Henkel Introduces Advanced Low Pressure Molding Material for High-Performance Environmental Resistance in Electronics

With Technomelt PA 6370 Henkel has launched a new low pressure molding hot melt for challenging electronic device designs.

(IN BRIEF) Henkel has introduced Technomelt PA 6370, a new ultra-low viscosity hot melt material designed for low pressure molding applications in complex electronic devices and components. The polyamide-based formulation provides a fast and cost-effective alternative to conventional potting, with the ability to fill gaps as small as 0.5 mm while offering long-term protection against moisture, heat, corrosion and harsh environmental conditions. Unlike traditional potting processes, which can involve up to eight steps and take as long as 24 hours, Technomelt hot melts enable encapsulation in three steps with minimal pressure and cycle times as low as 30 seconds. Technomelt PA 6370 delivers strong penetration, wetting and adhesion stability across multiple substrates, including after 1,200 hours of exposure to high heat and humidity. The material also meets UL 94 V-0 flame retardancy standards, provides excellent electrical insulation, and supports dimensional stability across an operating temperature range of -20°C to 140°C. It is suitable for low-voltage motors, connectors, sensors, printed circuit boards and electronic devices used in demanding environments.

(PRESS RELEASE) DÜSSELDORF, 27-May-2026 — /EuropaWire/ — Henkel has expanded its Technomelt portfolio of low pressure molding materials with the launch of Technomelt PA 6370, an ultra-low viscosity polyamide-based hot melt designed to protect complex electronic systems and components with demanding design requirements.

The new material has been engineered to provide a fast, cost-effective and reliable alternative to conventional potting processes, particularly for applications that require small gap filling and long-term resistance to harsh operating environments. With the ability to fill gaps as small as 0.5 mm, Technomelt PA 6370 supports intricate electronic device designs while delivering strong protection against moisture, heat, corrosion and other environmental stresses.

Technomelt materials are known for their low-pressure, gentle and energy-efficient processing characteristics. They also generate lower standard emissions compared with traditional potting encapsulants. Conventional potting materials can require up to eight processing steps and as long as 24 hours to complete. By contrast, Technomelt hot melts can encapsulate electronic parts in three straightforward steps, using minimal pressure and cycle times as short as 30 seconds.

Until now, achieving reliable filling in very small dimensions while maintaining the established protective performance of Technomelt materials has been difficult. Technomelt PA 6370 addresses this challenge through its ultra-low melt viscosity, measured at 2700–3000 mPa·s at 210°C and 1065–1180 mPa·s at 240°C. This high flowability enables strong penetration and wetting, while maintaining adhesion stability across multiple substrates.

The material has demonstrated robust performance in lap shear testing after 1,200 hours of exposure to high heat and moisture conditions of 85°C and 85% relative humidity. These results highlight its suitability for applications where long-term adhesion and protection are required under demanding environmental conditions.

Justin Kolbe, Senior Business Development Manager at Henkel, said achieving void-free filling in small gaps while preserving adhesion strength after exposure to water, salt fog, humidity and temperature ageing presents a significant technical challenge. He noted that Technomelt PA 6370 represents an important advancement for electronics protection, combining manufacturing flexibility, high throughput, UL flame retardancy compliance and strong environmental resistance for assemblies exposed to continuous use in harsh outdoor environments.

Technomelt PA 6370 also provides excellent electrical insulation properties and meets the UL 94 V-0 flame retardancy standard. Its low coefficient of thermal expansion of 175 ppm is another notable feature, placing it close to the performance level of many two-part polyurethane and epoxy potting materials. This helps support dimensional stability and stress resistance across a broad operating temperature range from -20°C to 140°C.

The new material is designed to broaden manufacturers’ options for protecting electronic devices without requiring tradeoffs between processing speed, intricate part penetration and rugged device protection. By combining fast cycle times with precise gap filling and strong environmental resistance, Technomelt PA 6370 offers manufacturers a practical solution for advanced electronic assemblies.

Technomelt PA 6370 is well suited for low-voltage applications such as motors, as well as connectors, sensors, printed circuit boards and other electronic devices operating in harsh or demanding conditions.

About Henkel
With its brands, innovations and technologies, Henkel holds leading market positions worldwide in the industrial and consumer businesses. The business unit Adhesive Technologies is the global leader in the market for adhesives, sealants and coatings. With Consumer Brands, the company holds leading positions especially in laundry & home care and hair in many markets and categories around the world. The company’s three strongest brands are Loctite,
Persil and Schwarzkopf. In fiscal 2025, Henkel reported sales of about 20.5 billion euros and adjusted operating profit of around 3.0 billion euros. Henkel’s preferred shares are listed in the German stock index DAX. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Henkel was founded in 1876 and today employs a diverse team of about 47,000 people worldwide – united by a strong corporate culture, shared values and a common purpose: “Pioneers at heart for the good of generations.” More information at www.henkel.com

Media Contact:

Sebastian Hinz
Adhesive Technologies
Media Relations
Headquarters, Düsseldorf/Germany
+49-211-797-8594
press@henkel.com

SOURCE: Henkel