(IN BRIEF) Foxconn, Radiall and Thales have inaugurated the next stage of Tessalia Technology SAS, a new joint venture in Le Barp, Nouvelle-Aquitaine, dedicated to Outsourced Semiconductor Assembly and Testing. Created within the framework of the EU Chips Act, Tessalia … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Environment, Financial, France, Government, Healthcare, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology
Tagged advanced packaging, aerospace, Alain Rousset, automotive, Bob Wei-Ming Chen, Bordeaux, Choose France 2026 Summit, cleanrooms, electronics manufacturing, Emmanuel Macron, encapsulation technology, EU Chips Act, European semiconductor ecosystem, Foxconn, France, Hon Hai Technology Group, industrial competitiveness, Le Barp, made in Europe components, medical sectors, Nouvelle-Aquitaine, OSAT, Outsourced Semiconductor Assembly and Testing, Patrice Caine, PCBs, Pierre Gattaz, printed circuit boards, Radiall, Radiall and Thales Launch Tessalia to Strengthen European Semiconductor Packaging Capacity in France, reindustrialisation, Route des Lasers, Sébastien Martin, Semiconductor Packaging, SiP, strategic autonomy, supply chain resilience, System in Package, telecom infrastructure, Tessalia, Tessalia Foundation Stone Marks Major Step for European Semiconductor Value Chain Under EU Chips Act, Tessalia Technology SAS, Thales, ultra-high-density packaging, Young Liu
(IN BRIEF) Henkel has introduced Technomelt PA 6370, a new ultra-low viscosity hot melt material designed for low pressure molding applications in complex electronic devices and components. The polyamide-based formulation provides a fast and cost-effective alternative to conventional potting, with … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology
Tagged coefficient of thermal expansion, connectors, corrosion resistance, CTE, device reliability, electrical insulation, electronic components, electronic devices, electronics manufacturing, electronics protection, encapsulation, environmental resistance, flame retardancy, Harsh Environments, heat resistance, Henkel, Henkel Expands Technomelt Portfolio with Ultra-Low Viscosity Hot Melt for Small Gap Electronic Encapsulation, Henkel Launches Technomelt PA 6370 to Improve Low Pressure Molding Protection for Complex Electronic Devices, Henkel Targets Complex Electronic Assemblies with New Hot Melt Material Designed for Harsh Operating Conditions, high heat and humidity, high-throughput, hot melt material, Justin Kolbe, lap shear testing, low melt viscosity, low pressure molding, low-voltage applications, manufacturing flexibility, moisture resistance, motors, New Henkel Technomelt PA 6370 Material Offers Faster Alternative to Potting for Rugged Electronics Protection, PCBs, polyamide-based hot melt, potting alternative, printed circuit boards, Sensors, small gap filling, Technomelt PA 6370, TECHNOMELT®, UL 94 V-0, ultra-low viscosity
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