Tag Archives: New Henkel Technomelt PA 6370 Material Offers Faster Alternative to Potting for Rugged Electronics Protection

Henkel Introduces Advanced Low Pressure Molding Material for High-Performance Environmental Resistance in Electronics

(IN BRIEF) Henkel has introduced Technomelt PA 6370, a new ultra-low viscosity hot melt material designed for low pressure molding applications in complex electronic devices and components. The polyamide-based formulation provides a fast and cost-effective alternative to conventional potting, with … Read the full press release