(IN BRIEF) Fuhua has started production at a new Evonik-licensed hydrogen peroxide mega plant in Leshan, Sichuan Province, China. The facility has an annual capacity of 200 kilotonnes of industrial-grade hydrogen peroxide, making it one of the largest plants of … Read the full press release
Posted in Business, Chemicals, Electronics & Machinery, Industrial, International Trade, Technology
Tagged 200 kilotonnes annual capacity, Active Oxygens business line, catalysts, chemical production, CHINA, commissioning, construction support, electronics manufacturing, engineering support, Evonik, Evonik Fuhua New Materials, Evonik Technology Supports Launch of World-Scale Hydrogen Peroxide Facility in Sichuan, food safety, Fuhua, Germany, H2O2, Hydrogen peroxide, hydrogen peroxide mega plant, hydrogen peroxide production, in-specification production, industrial chemicals, industrial-grade hydrogen peroxide, June 2026 operations, Leshan, Leshan Mega Plant to Supply Industrial and Specialty Hydrogen Peroxide Markets, licensing agreement, merchant market, Michael Träxler, New Leshan Hydrogen Peroxide Plant Strengthens Industrial and Specialty Chemical Supply, November 2023 agreement, plant start-up, process equipment, proprietary H2O2 technology, regional Chinese market, Sichuan Province, specialty chemicals, specialty hydrogen peroxide, United States, working solution, Zhang Hua
(IN BRIEF) Foxconn, Radiall and Thales have inaugurated the next stage of Tessalia Technology SAS, a new joint venture in Le Barp, Nouvelle-Aquitaine, dedicated to Outsourced Semiconductor Assembly and Testing. Created within the framework of the EU Chips Act, Tessalia … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Environment, Financial, France, Government, Healthcare, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology
Tagged advanced packaging, aerospace, Alain Rousset, automotive, Bob Wei-Ming Chen, Bordeaux, Choose France 2026 Summit, cleanrooms, electronics manufacturing, Emmanuel Macron, encapsulation technology, EU Chips Act, European semiconductor ecosystem, Foxconn, France, Hon Hai Technology Group, industrial competitiveness, Le Barp, made in Europe components, medical sectors, Nouvelle-Aquitaine, OSAT, Outsourced Semiconductor Assembly and Testing, Patrice Caine, PCBs, Pierre Gattaz, printed circuit boards, Radiall, Radiall and Thales Launch Tessalia to Strengthen European Semiconductor Packaging Capacity in France, reindustrialisation, Route des Lasers, Sébastien Martin, Semiconductor Packaging, SiP, strategic autonomy, supply chain resilience, System in Package, telecom infrastructure, Tessalia, Tessalia Foundation Stone Marks Major Step for European Semiconductor Value Chain Under EU Chips Act, Tessalia Technology SAS, Thales, ultra-high-density packaging, Young Liu
(IN BRIEF) Henkel has introduced Technomelt PA 6370, a new ultra-low viscosity hot melt material designed for low pressure molding applications in complex electronic devices and components. The polyamide-based formulation provides a fast and cost-effective alternative to conventional potting, with … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology
Tagged coefficient of thermal expansion, connectors, corrosion resistance, CTE, device reliability, electrical insulation, electronic components, electronic devices, electronics manufacturing, electronics protection, encapsulation, environmental resistance, flame retardancy, Harsh Environments, heat resistance, Henkel, Henkel Expands Technomelt Portfolio with Ultra-Low Viscosity Hot Melt for Small Gap Electronic Encapsulation, Henkel Launches Technomelt PA 6370 to Improve Low Pressure Molding Protection for Complex Electronic Devices, Henkel Targets Complex Electronic Assemblies with New Hot Melt Material Designed for Harsh Operating Conditions, high heat and humidity, high-throughput, hot melt material, Justin Kolbe, lap shear testing, low melt viscosity, low pressure molding, low-voltage applications, manufacturing flexibility, moisture resistance, motors, New Henkel Technomelt PA 6370 Material Offers Faster Alternative to Potting for Rugged Electronics Protection, PCBs, polyamide-based hot melt, potting alternative, printed circuit boards, Sensors, small gap filling, Technomelt PA 6370, TECHNOMELT®, UL 94 V-0, ultra-low viscosity
(IN BRIEF) Henkel has relocated its Singapore operations to Geneo at Singapore Science Park, establishing a next-generation global hub that unites innovation, supply chain, digital operations, electronics engineering, and consumer brands under one roof. The move strengthens Singapore’s role as … Read the full press release
Posted in Business, Chemicals, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Technology
Tagged Academy of Hair, Adhesives Technology, advanced materials, Asia-Pacific, Consumer Brands, digital operations, electronic adhesives, electronics manufacturing, Geneo, global innovation hub, Henkel, Henkel Expands Regional and Global Operations with Integrated Innovation Hub at Singapore Science Park, Henkel Strengthens Asia-Pacific Innovation and Supply Chain Capabilities with New Global Hub at Singapore Science Park, Industry 4.0, Mark Dorn, Singapore Economic Development Board, Singapore Science Park, Supply Chain Management, sustainability, Thomas Holenia
(IN BRIEF) Henkel will showcase its latest innovations in EMI shielding, thermal management, debonding, and pad printing at Productronica 2025 in Munich, emphasizing sustainability, digitalization, and reliability in electronics manufacturing. The company will launch a new EMI shielding film for … Read the full press release
Posted in Automotive, Business, Chemicals, Electronics & Machinery, Germany, Industrial, Marketing, News, Technology
Tagged and Pad Printing Solutions at Productronica 2025, Anna Ryzhova, automotive electronics, Bart Van Eeghem, Battery Engineering Centers, Circularity, debonding, digital engineering, electronics manufacturing, EMI shielding, EMI testing, Henkel, Henkel Highlights Next-Generation Electronics Innovations and Pad Printing Technologies at Productronica 2025, Henkel Presents Advanced Materials and Digital Engineering Solutions to Drive Sustainable Electronics at Productronica 2025, Henkel to Unveil Advanced EMI Shielding, industrial power, Loctite Stycast CC 8555, Loctite Stycast US 8000AB, Mahmoud Awwad, Messe München, Pad Printing, PCB protection, printed electronics, Productronica 2025, sustainability, TELECOM, thermal interface materials, Thermal Management
Adhesive Technologies to expand expertise for innovative electronics solutions (PRESS RELEASE) DÜSSELDORF, 24-Jun-2021 — /EuropaWire/ — Henkel Adhesive Technologies, through its corporate venture capital arm Henkel Tech Ventures, has invested in ioTech, a UK-based start-up with an R&D footprint in … Read the full press release
Posted in Chemicals, Electronics & Machinery, Germany, Industrial, Investment, News, Technology
Tagged adhesives, consumer electronics, Continuous Laser Assisted Deposition, electronics, electronics manufacturing, functional coatings, Henkel, Henkel Adhesive Technologies, Hervé Javice, innovative electronics solutions, investment, ioTech, laser, Paolo Bavaj, sealants, semi-conductor packaging, start-up
Brussels, 30-5-2013 — /europawire.eu/ — The European Commission is today announcing a collection of five major projects, to boost Europe’s manufacturing competitiveness by bringing research closer to industrial needs. These projects are the first steps in putting into effect the European Electronics strategy … Read the full press release
Posted in Belgium, Business, Electronics & Machinery, European Union, Industrial, Science, Technology
Tagged AGATE, Agrate, Bernin, chip designers, Crolles, Dresden, E450EDL, electric vehicles, electro-mobility, electronics manufacturing, EPPL, EU Electronics strategy, FDSOI technology, gallium nitride, greenhouse gas reduction, integrated circuits, Lab4MEMS, Leuven, light emitting diodes, microsystems, Neelie Kroes, Pilot lines, Places2Be, researchers, semiconductor manufacturers, technology companies, ultra-thin large area silicon substrates, universities, Veldhoven, Villach
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