(IN BRIEF) Foxconn, Radiall and Thales have inaugurated the next stage of Tessalia Technology SAS, a new joint venture in Le Barp, Nouvelle-Aquitaine, dedicated to Outsourced Semiconductor Assembly and Testing. Created within the framework of the EU Chips Act, Tessalia … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Environment, Financial, France, Government, Healthcare, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology
Tagged advanced packaging, aerospace, Alain Rousset, automotive, Bob Wei-Ming Chen, Bordeaux, Choose France 2026 Summit, cleanrooms, electronics manufacturing, Emmanuel Macron, encapsulation technology, EU Chips Act, European semiconductor ecosystem, Foxconn, France, Hon Hai Technology Group, industrial competitiveness, Le Barp, made in Europe components, medical sectors, Nouvelle-Aquitaine, OSAT, Outsourced Semiconductor Assembly and Testing, Patrice Caine, PCBs, Pierre Gattaz, printed circuit boards, Radiall, Radiall and Thales Launch Tessalia to Strengthen European Semiconductor Packaging Capacity in France, reindustrialisation, Route des Lasers, Sébastien Martin, Semiconductor Packaging, SiP, strategic autonomy, supply chain resilience, System in Package, telecom infrastructure, Tessalia, Tessalia Foundation Stone Marks Major Step for European Semiconductor Value Chain Under EU Chips Act, Tessalia Technology SAS, Thales, ultra-high-density packaging, Young Liu
(IN BRIEF) ZEISS Industrial Quality Solutions will bring the topic of quality to the official COMPUTEX 2026 Forum stage for the first time, using the event in Taipei to highlight how precision inspection, metrology and process control are becoming central … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Germany, Industrial, Investment, News, Science, Technology
Tagged 51.2T networks, advanced packaging, AI Hardware, AI Infrastructure, AI server value chain, chip-to-rack stack, Clive Yen, co packaged optics, COMPUTEX 2026, connector quality, coordinate measuring machines, CPO, data centers, digital microscopy, electron microscopy, failure analysis, FAU connectors, GPUs, HBM, high-bandwidth memory, inspection, L10-L11 rack assembly, light microscopy, liquid cooling, metrology, MPO connectors, ODM ecosystem, optical connectivity, optics, optoelectronics, PCB inspection, PCB reliability, printed circuit boards, process control, quality innovation, rack integration, Semiconductor Packaging, TaiNEX 2, Taipei, thermal management systems, Tonmoy Kundu, wafer process control, X-ray inspection, ZEISS, ZEISS Brings Quality Innovation to COMPUTEX 2026 Forum as AI Hardware Scaling Demands Greater Precision, ZEISS Highlights Quality as a Critical Enabler of AI Infrastructure Growth at COMPUTEX 2026, ZEISS Industrial Quality Solutions, ZEISS Research Microscopy Solutions, ZEISS to Showcase Chip-to-Rack Quality Solutions for Next-Generation AI Hardware at COMPUTEX 2026
(IN BRIEF) Henkel has unveiled Loctite Eccobond UF 9000AE, a specialized semiconductor capillary underfill encapsulant designed to meet the rigorous demands of cutting-edge applications like artificial intelligence (AI) and high-performance computing (HPC). This innovative material provides robust protection for large … Read the full press release
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