Tag Archives: Radiall and Thales Launch Tessalia to Strengthen European Semiconductor Packaging Capacity in France

Tessalia Joint Venture Advances European Chip Packaging Ambitions With Planned 50 Million SiP Components Annually by 2033

(IN BRIEF) Foxconn, Radiall and Thales have inaugurated the next stage of Tessalia Technology SAS, a new joint venture in Le Barp, Nouvelle-Aquitaine, dedicated to Outsourced Semiconductor Assembly and Testing. Created within the framework of the EU Chips Act, Tessalia … Read the full press release