(IN BRIEF) Foxconn, Radiall and Thales have inaugurated the next stage of Tessalia Technology SAS, a new joint venture in Le Barp, Nouvelle-Aquitaine, dedicated to Outsourced Semiconductor Assembly and Testing. Created within the framework of the EU Chips Act, Tessalia … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Environment, Financial, France, Government, Healthcare, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology
Tagged advanced packaging, aerospace, Alain Rousset, automotive, Bob Wei-Ming Chen, Bordeaux, Choose France 2026 Summit, cleanrooms, electronics manufacturing, Emmanuel Macron, encapsulation technology, EU Chips Act, European semiconductor ecosystem, Foxconn, France, Hon Hai Technology Group, industrial competitiveness, Le Barp, made in Europe components, medical sectors, Nouvelle-Aquitaine, OSAT, Outsourced Semiconductor Assembly and Testing, Patrice Caine, PCBs, Pierre Gattaz, printed circuit boards, Radiall, Radiall and Thales Launch Tessalia to Strengthen European Semiconductor Packaging Capacity in France, reindustrialisation, Route des Lasers, Sébastien Martin, Semiconductor Packaging, SiP, strategic autonomy, supply chain resilience, System in Package, telecom infrastructure, Tessalia, Tessalia Foundation Stone Marks Major Step for European Semiconductor Value Chain Under EU Chips Act, Tessalia Technology SAS, Thales, ultra-high-density packaging, Young Liu
(IN BRIEF) Siemens AG and Hon Hai Technology Group (Foxconn) have inked a memorandum of understanding (MoU) to spearhead digital transformation and sustainability in smart manufacturing platforms. This collaboration aims to optimize global manufacturing processes, particularly in electronics, information and … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Environment, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged Cedrik Neike, Dr. Zhe Shi, Foxconn, partnership, Roland Busch, Siemens, smart manufacturing, sustainability, Taiwan, Young Liu
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