(IN BRIEF) Henkel Adhesive Technologies has launched Bergquist Gap Filler TGF 6500LVO, a next-generation thermal gap filler with 6.5W/m∙K thermal conductivity for automotive electronics applications. The material is designed to support heat transfer in demanding systems such as ADAS, electronic … Read the full press release
Posted in Automotive, Business, Chemicals, Electronics & Machinery, Germany, Industrial, Technology
Tagged 6.5W/m∙K thermal conductivity, ADAS, Advanced driver assistance systems, automated production, automotive electronics, Bergquist Gap Filler TGF 10000, Bergquist Gap Filler TGF 2100LVO, Bergquist Gap Filler TGF 2900LVO, Bergquist Gap Filler TGF 4400LVO, Bergquist Gap Filler TGF 6500LVO, Bergquist Gap Filler TGF 6500LVO Expands Henkel’s Automotive Thermal Management Portfolio, Bergquist Gap Filler TGF 6500LVO Supports High-Performance Thermal Management in Compact Vehicle Systems, component manufacturers, ECUs, electric vehicles, electronic control units, EV power conversion components, heat transfer, heat-accelerated curing, Henkel, Henkel Adhesive Technologies, high-throughput manufacturing, low bond line thickness, low fogging, low outgassing, low-volatile silicone technology, Nancy Yang, New Henkel Thermal Gap Filler Targets Rising Heat Loads in Vehicle Electronics, OEMs, Power Density, room-temperature curing, siloxane-sensitive applications, thermal gap filler, Thermal Management, thermal resistance, two-component thermal gap filler
(IN BRIEF) Elmos Semiconductor SE has received the German Innovation Award 2026 for its development of the world’s smallest quantum random number generator, a technology designed to enhance cybersecurity in the face of growing AI and quantum computing capabilities. The … Read the full press release
Posted in Artificial Intelligence (AI), Awards, Business, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Security & Safety, Technology
Tagged Accenture, artificial intelligence, automotive electronics, CMOS technology, Cybersecurity, Elmos Semiconductor SE, Elmos Semiconductor Wins German Innovation Award 2026 for Breakthrough Quantum Random Number Generator Technology, encryption, Federal Ministry for Economic Affairs and Energy, German Innovation Award 2026, IoT security, Jan Dienstuhl, O2 Telefónica, QRNG chip, quantum computing, Quantum Random Number Generator, Santiago Argelich Hesse, Semiconductor Innovation, WirtschaftsWoche
(IN BRIEF) Henkel has launched Loctite Stycast UV 7998, a new solvent-free conformal coating that combines strong electronics protection with UL 94 V-0 certification, sustainability benefits, and cost efficiency for mainstream applications such as home appliances, lighting, consumer electronics, and … Read the full press release
Posted in Business, Chemicals, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Netherlands, Technology
Tagged automotive electronics, CO2 reduction, conformal coating, consumer electronics, electronics protection, Henkel, Henkel Adhesives, Henkel Expands Conformal Coatings Portfolio with Solvent-Free UL 94 V-0 Rated Loctite Stycast UV 7998, home appliances, Loctite Stycast UV 7998, moisture cure, Oliver Steinbach, PCB protection, REACH compliant, RoHS compliant, solvent-free, sustainability, UL 94 V-0, UV curing, VOC-free
(IN BRIEF) Henkel has introduced Bergquist TGF 10000, a new liquid gap filler providing 10 W/mK thermal conductivity for high-power electronics that require efficient heat dissipation. Based on a silicone two-component system, the material combines strong thermal performance with high … Read the full press release
Posted in Business, Chemicals, Germany, Industrial, News, Technology
Tagged 10 W/mK, ADAS, automotive electronics, Bergquist TGF 10000, computing, consumer electronics, dispensing efficiency, Henkel, high-power electronics, liquid gap filler, Michael Cai, network infrastructure, New Bergquist TGF 10000 Gap Filler Delivers 10 W/mK for High-Power Automotive and Computing Applications, SoC modules, telecommunications, thermal conductivity, thermal interface materials, vibration resistance
(IN BRIEF) The European Investment Bank has signed a €40 million loan agreement with Prodrive Technologies to boost the Dutch company’s research and development efforts in electronics for semiconductors, medical technology, energy systems, and automotive applications. The investment will help … Read the full press release
Posted in Banks, Electronics & Machinery, European Union, Financial, Infrastructure & Utilities, Investment, Luxembourg, Netherlands, News, Technology
Tagged automotive electronics, decarbonisation, EIB, energy systems, EU Chips Act, European Innovation, European Investment Bank, EV charging infrastructure, high-tech manufacturing, hydrogen electrolysis, medical electronics, New €40 Million EIB Partnership Supports Prodrive Technologies’ Growth in High-Tech Manufacturing and European Competitiveness, Pieter Janssen, Prodrive Technologies, Robert de Groot, semiconductor R&D, strategic autonomy, €40 million loan
(IN BRIEF) Henkel has launched Loctite TCF 14001, a high-performance liquid thermal interface material designed for advanced optical transceivers used in AI data centers. Featuring a 14.5 W/m-K thermal conductivity — one of the highest among liquid TIMs — the … Read the full press release
Posted in Artificial Intelligence (AI), Business, Chemicals, Electronics & Machinery, Germany, Industrial, News, Technology
Tagged 1.6T, 800G, advanced packaging, AI data centers, automotive electronics, coherent optics, cooling technology, heat management, Henkel, Henkel Expands Advanced TIM Portfolio with Loctite TCF 14001 for Next-Generation High-Density Electronics, high thermal conductivity, industrial automation, Loctite TCF 14001, optical transceivers, power generation, silicone gap filler, telecommunications, Thermal Interface Material, TIM, Tracy Lin
(IN BRIEF) Henkel will showcase its latest innovations in EMI shielding, thermal management, debonding, and pad printing at Productronica 2025 in Munich, emphasizing sustainability, digitalization, and reliability in electronics manufacturing. The company will launch a new EMI shielding film for … Read the full press release
Posted in Automotive, Business, Chemicals, Electronics & Machinery, Germany, Industrial, Marketing, News, Technology
Tagged and Pad Printing Solutions at Productronica 2025, Anna Ryzhova, automotive electronics, Bart Van Eeghem, Battery Engineering Centers, Circularity, debonding, digital engineering, electronics manufacturing, EMI shielding, EMI testing, Henkel, Henkel Highlights Next-Generation Electronics Innovations and Pad Printing Technologies at Productronica 2025, Henkel Presents Advanced Materials and Digital Engineering Solutions to Drive Sustainable Electronics at Productronica 2025, Henkel to Unveil Advanced EMI Shielding, industrial power, Loctite Stycast CC 8555, Loctite Stycast US 8000AB, Mahmoud Awwad, Messe München, Pad Printing, PCB protection, printed electronics, Productronica 2025, sustainability, TELECOM, thermal interface materials, Thermal Management
(IN BRIEF) Elmos Semiconductor SE has reached a milestone of over one billion motor control ICs delivered since 2003, reflecting its leadership in designing highly optimized driver and BLDC controller chips for automotive and industrial applications. With solutions covering common … Read the full press release
Posted in Automotive, Business, Financial, Government, Industrial, Investment, Management, Marketing, News, Technology
Tagged 12 V, 24 V, 48 V, automotive electronics, BLDC motor controllers, Elmos Semiconductor SE, IC integration, industrial drives, Jan Dienstuhl, microchip delivery, motor control ICs, motor driver innovation, power range 1 W–3 kW, precision control, semiconductor milestone, System-on-Chip
(IN BRIEF) FORVIA HELLA has secured over €1 billion in new orders, including the development of the Advanced Control Module (ACM) for automated driving and the Intelligent Power Distribution Module (iPDM). With production taking place in Timisoara, Romania, and development … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Germany, Industrial, Investment, News, Technology
Tagged ACM, Advanced Control Module, ASIC, automated driving, automated vehicle technologies, automotive electronics, electric vehicles, electronic fuse, FORVIA HELLA, Germany, INNOVATION, Intelligent Power Distribution Module, iPDM, Jörg Weisgerber, L2+, Lippstadt, Romania, Shanghai Auto Show 2025, software power management, Timişoara
(IN BRIEF) Henkel has introduced Loctite AA 5885, a 1K polyacrylate UV-curable gasketing sealant designed for automotive electronics applications. Optimized for Cured-in-Place Gasketing, the product offers excellent resistance to automotive fluids, high temperatures, and harsh conditions. It features rapid curing … Read the full press release
Posted in Automotive, Business, Chemicals, Electronics & Machinery, Financial, Germany, Industrial, Investment, Management, News, Technology
Tagged 1K polyacrylate, automotive electronics, chemical resistance, Cured-in-Place Gasketing, ECU module, electrification, energy efficiency, gasketing sealant, Henkel, high-temperature resistance, Loctite AA 5885, multi-substrate, OEM, rapid curing, sustainability, under-the-hood conditions, UV-curable
(PRESS RELEASE) GERLINGEN, 17-Feb-2022 — /EuropaWire/ — Robert Bosch GmbH (Bosch), a German multinational engineering and technology company, has announced the launch of an in-house startup that will be focused on quantum sensor products following seven years of researching on … Read the full press release
Speech to Include Vision for the Future of Self-Driving Cars and Automotive Semiconductors GRENOBLE, 6-10-2015 — /EuropaWire/ — The Design and Verification Conference (DVCon) & Exhibition Europe 2015 has announced that Hans Adlkofer, the Vice President of the Automotive Systems Group … Read the full press release
Posted in Automotive, Business, Denmark, Electronics & Machinery, Finland, France, Germany, Marketing, News, Sweden, Switzerland, Technology, United Kingdom
Tagged Annette Bley, ARM, automotive electronics, Automotive Semiconductors, Cadence, DVCon, DVCon Europe, Hans Adlkofer, Hr. Hans Adlkofer, Infineon Technologies, Intel, Mentor Graphics, Munich, self-driving cars, Synopsys
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