(IN BRIEF) The University of Liverpool has been awarded more than £23.7 million through UK Research and Innovation’s Local Innovation Partnership Fund to lead two high-growth projects selected by Liverpool City Region: AIM-HI and NBIC-LIVE. AIM-HI, the AI Materials Hub … Read the full press release
Posted in Artificial Intelligence (AI), Business, Chemicals, Education, Financial, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Science, Technology, United Kingdom
Tagged Accelerator programme, advanced manufacturing, AI Hardware, AI Materials Hub for Innovation, AI software, AI-enabled chemistry, AIM-HI, anti-biofilm surfaces, Antimicrobial Surfaces, artificial intelligence, biofilms, business incubator, catalysis, high-value jobs, innovation clusters, Innovation Investment Fortnight, lab robotics, life sciences, LIPF, Liverpool City Region, Liverpool City Region Combined Authority, Local Innovation Partnership Fund, Materials Chemistry, National Biofilms Innovation Centre Liverpool Engine for Antimicrobial Surface Technologies, NBIC-LIVE, net-zero materials, open innovation platforms, private sector match funding, product formulation, Professor Sir Ian Chapman, Professor Tim Jones, R&D projects, regional economic growth, regional productivity, soft matter, Steve Rotheram, UK innovation, UK Research and Innovation, UKRI, University of Liverpool, University of Liverpool Leads AIM-HI and NBIC-LIVE Projects to Strengthen Liverpool City Region’s Innovation Economy, University of Liverpool Secures Over £23 Million to Lead AI Materials Chemistry and Antimicrobial Innovation Projects in Liverpool City Region, University of Liverpool to Drive Regional Growth Through Major UKRI-Backed AI and Advanced Materials Innovation Programmes, workforce skills
(IN BRIEF) ZEISS Industrial Quality Solutions will bring the topic of quality to the official COMPUTEX 2026 Forum stage for the first time, using the event in Taipei to highlight how precision inspection, metrology and process control are becoming central … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Germany, Industrial, Investment, News, Science, Technology
Tagged 51.2T networks, advanced packaging, AI Hardware, AI Infrastructure, AI server value chain, chip-to-rack stack, Clive Yen, co packaged optics, COMPUTEX 2026, connector quality, coordinate measuring machines, CPO, data centers, digital microscopy, electron microscopy, failure analysis, FAU connectors, GPUs, HBM, high-bandwidth memory, inspection, L10-L11 rack assembly, light microscopy, liquid cooling, metrology, MPO connectors, ODM ecosystem, optical connectivity, optics, optoelectronics, PCB inspection, PCB reliability, printed circuit boards, process control, quality innovation, rack integration, Semiconductor Packaging, TaiNEX 2, Taipei, thermal management systems, Tonmoy Kundu, wafer process control, X-ray inspection, ZEISS, ZEISS Brings Quality Innovation to COMPUTEX 2026 Forum as AI Hardware Scaling Demands Greater Precision, ZEISS Highlights Quality as a Critical Enabler of AI Infrastructure Growth at COMPUTEX 2026, ZEISS Industrial Quality Solutions, ZEISS Research Microscopy Solutions, ZEISS to Showcase Chip-to-Rack Quality Solutions for Next-Generation AI Hardware at COMPUTEX 2026
(IN BRIEF) The Technical University of Munich has developed the EU’s first university-designed 7-nanometre AI chip, created by Professor Hussam Amrouch and aligned with TSMC industry standards, with plans for multiple new designs annually and production from 2028 at ESMC … Read the full press release
Posted in Artificial Intelligence (AI), Business, Education, Financial, Germany, Industrial, Investment, Management, Science, Technology
Tagged 7-nanometre chip, AI Hardware, Bavaria, Cybersecurity, ESMC Dresden, Hubert Aiwanger, MACHT-AI, Markus Blume, neuromorphic computing, on-device AI, Professor Hussam Amrouch, quantum computing, RISC-V, semiconductor sovereignty, Technical University of Munich, Thomas Hofmann, TUM
(IN BRIEF) RWTH Aachen University’s Chair of Integrated Photonics has pioneered an innovative packaging technology for optical data links in collaboration with aiXscale Photonics. This technology enables the co-packaging of optical and electrical systems on a wafer scale, leading to … Read the full press release
Posted in Artificial Intelligence (AI), Business, Energy, Gas & Oil, Germany, Industrial, Management, News, Technology
Tagged AI Hardware, aiXscale Photonics, Darrell Childers, data centers, Dr. Florian Merget, François Lelarge, Heraeus, innovative, Optical Packaging Technology, partnership, Prof. Dr. Jeremy Witzens, Steffen Metzger
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