(IN BRIEF) ZEISS Industrial Quality Solutions will bring the topic of quality to the official COMPUTEX 2026 Forum stage for the first time, using the event in Taipei to highlight how precision inspection, metrology and process control are becoming central … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Germany, Industrial, Investment, News, Science, Technology
Tagged 51.2T networks, advanced packaging, AI Hardware, AI Infrastructure, AI server value chain, chip-to-rack stack, Clive Yen, co packaged optics, COMPUTEX 2026, connector quality, coordinate measuring machines, CPO, data centers, digital microscopy, electron microscopy, failure analysis, FAU connectors, GPUs, HBM, high-bandwidth memory, inspection, L10-L11 rack assembly, light microscopy, liquid cooling, metrology, MPO connectors, ODM ecosystem, optical connectivity, optics, optoelectronics, PCB inspection, PCB reliability, printed circuit boards, process control, quality innovation, rack integration, Semiconductor Packaging, TaiNEX 2, Taipei, thermal management systems, Tonmoy Kundu, wafer process control, X-ray inspection, ZEISS, ZEISS Brings Quality Innovation to COMPUTEX 2026 Forum as AI Hardware Scaling Demands Greater Precision, ZEISS Highlights Quality as a Critical Enabler of AI Infrastructure Growth at COMPUTEX 2026, ZEISS Industrial Quality Solutions, ZEISS Research Microscopy Solutions, ZEISS to Showcase Chip-to-Rack Quality Solutions for Next-Generation AI Hardware at COMPUTEX 2026
IN BRIEF) TUM will launch the Center for Structural and Functional Connectomics (CSFC) on its Garching campus—a €69 million initiative approved by the GWK—to comprehensively map neural networks and accelerate research into multiple sclerosis, neuro-oncology, and developmental neurological disorders. Spanning … Read the full press release
Posted in Artificial Intelligence (AI), Business, Education, Financial, Germany, Government, Healthcare, Industrial, Investment, Management, Marketing, News, Science, Technology
Tagged AI-supported imaging, Center for Structural and Functional Connectomics, computational modeling, connectomics, CSFC, developmental neurological disorders, DZNE, DZPG, electron microscopy, Garching campus, GWK funding, Helmholtz Munich, light microscopy, Max Planck Society, microscopy, multiple sclerosis, Munich Institute of Biomedical Engineering, neuro-oncology, neuronal connections, Prof. Franz Pfeiffer, Prof. Julijana Gjorgjieva, Prof. Thomas Misgeld, SyNergy Cluster of Excellence, TUM, X-ray microscopy, €69 million
(IN BRIEF) PVA TePla AG has acquired DIVE imaging systems GmbH, a company specializing in advanced light microscopy systems for high-precision, non-destructive material analysis. The acquisition, effective from January 1, 2025, expands PVA TePla’s portfolio in the metrology sector, particularly … Read the full press release
Posted in Business, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged acquisition, artificial intelligence, DIVE imaging systems, Dr. Philipp Wollmann, Fraunhofer Institute, hyperspectral vision, industrial inspection, Jalin Ketter, layer thickness measurement, light microscopy, metrology, partnership, process optimization, PVA TePla, quality control, Semiconductor industry, surface analysis
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