Tag Archives: Ramachandran (Ram) Trichur

Henkel Introduces Loctite Eccobond UF 9000AE for Advanced Semiconductor Packaging

(IN BRIEF) Henkel has unveiled Loctite Eccobond UF 9000AE, a specialized semiconductor capillary underfill encapsulant designed to meet the rigorous demands of cutting-edge applications like artificial intelligence (AI) and high-performance computing (HPC). This innovative material provides robust protection for large … Read the full press release