(IN BRIEF) Schneider Electric has released a first-of-its-kind study on arc flash risk in 800 VDC data center power architectures, providing guidance for the safe adoption of higher-voltage systems in AI data centers. The study compares two representative 800 VDC … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Energy, Gas & Oil, France, Industrial, Internet & Online, Security & Safety, Technology
Tagged 1.2 cal/cm² PPE threshold, 400 kW IT racks, 800 VDC, advanced software, AI data centers, AI factories, AI-augmented modelling, arc flash risk, back-feed, capacitor discharge, capacitor placement, centralized 800 VDC architecture, cloud infrastructure, data center design, data centers, DC arc flash analysis, DC Arc Flash Analysis A Practical Study on 800 VDC in Data Centers, Digital Twins, electrical distribution, electrical safety, ETAP, facility-level architecture, fault currents, fault-clearing behaviour, France, high-density racks, incident energy, Manish Kumar, megawatt-scale racks, New Schneider Electric Study Assesses Arc Flash Risk in High-Density Data Center Power Architectures, NVIDIA, overcurrent protection, peak current, physics-based safety, power architectures, power system analysis, protection coordination, rack-level architecture, reverse-blocking diodes, Rueil-Malmaison, safe work practices, Schneider Electric, Schneider Electric Advances 800 VDC Data Center Safety Research With Digital Twin Analysis, Schneider Electric and ETAP Highlight Arc Flash Modelling for Next-Generation AI Data Centers, Secure Power and Data Centers, sidecar power rack, Tanuj Khandelwal, transient behaviour, transient simulation, white paper
(IN BRIEF) Siemens and Infineon Technologies are collaborating to advance semiconductor circuit breaker technology for data centers, industrial production facilities and battery storage systems. Under the partnership, Infineon will supply silicon carbide power modules for Siemens’ SENTRON 3QD2 semiconductor circuit … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Energy, Gas & Oil, Environment, European Union, Infrastructure & Utilities, Investment, Management, Switzerland, Technology
Tagged 1200 V module, AI data centers, Andreas Weisl, battery storage systems, CoolSiC MOSFET module, data centers, DC grids, decarbonization, digitalization, direct current grids, electrical protection, energy efficiency, factories, Germany, industrial infrastructure, Infineon, Infineon Supplies Silicon Carbide Power Modules for Siemens SENTRON 3QD2 Semiconductor Circuit Breakers, Infineon Technologies, Markus Grabmeier, microsecond interruption, Nuremberg, overload protection, PCIM Europe 2026, Power Density, power distribution, power modules, power-critical environments, production facilities, reliability, resilient infrastructure, semiconductor circuit breaker, SENTRON 3QD2, short circuits, SIC, Siemens, Siemens AG, Siemens and Infineon Collaborate to Improve Electrical Protection for AI Data Centers Production Facilities and Battery Storage, Siemens and Infineon Partner to Advance Silicon Carbide-Based Circuit Protection for Data Centers and Factories, Siemens and Infineon Strengthen Electrical Protection for Direct Current Grids and Data Centers, Siemens Smart Infrastructure, silicon carbide, smart protection algorithms, solid-state circuit breaker
(IN BRIEF) Siemens, together with NVIDIA and Fluence and incorporating nVent-aligned design considerations, has developed a reference architecture for NVIDIA DSX Vera Rubin NVL72 AI data centers. The design translates NVIDIA’s AI factory concept into an industrialized electrical, power and … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Government, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology
Tagged 100 MW IT load, 136 MW facility capacity, AI data centers, AI factories, AI load smoothing, AI workloads, automation, battery energy storage, black start, cloud infrastructure providers, colocation providers, controls architecture, data center infrastructure, Digital Twin, DSX MaxLPS, DSX Vera Rubin, electrical architecture, Fluence, Fluence and nVent-Aligned Design Approach Support Scalable AI Factory Infrastructure, grid demand response, hyperscalers, Integrated Data Center Management Suite, Jeff Monday, liquid cooling, low-voltage power blocks, medium-voltage distribution, mission-critical facilities, modular infrastructure, nVent, nVent Systems Protection, NVIDIA, NVIDIA and Fluence Develop Reference Architecture for High-Density AI Data Centers, NVIDIA Vera Rubin NVL72, NVL72, Power Systems, prefabricated skids, rack interface, reference architecture, Ruth Gratzke, Sara Zawoyski, Siemens, Siemens Reference Design Targets Faster and More Reliable Deployment of NVIDIA Vera Rubin NVL72 AI Data Centers, Siemens Smart Infrastructure USA, Smartstack, Tier III concurrent maintainability, token production, utility connection
(IN BRIEF) Jitendra Mohan, Sanjay Gajendra and Casey Morrison, co-founders of Astera Labs, have been named EY World Entrepreneur Of The Year™ 2026 at a ceremony in Monaco. Selected from nearly 5,000 program participants, including 58 winners from 46 countries … Read the full press release
Posted in Artificial Intelligence (AI), Awards, Business, Financial, France, Government, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology, United Kingdom
Tagged AI data centers, AI Infrastructure, artificial intelligence, Asif Ramji, Astera Labs, Astera Labs Co-Founders Named EY World Entrepreneur Of The Year 2026 for AI Infrastructure Leadership, Astera Labs Leadership Team Recognized with EY World Entrepreneur Of The Year 2026 Award in Monaco, bandwidth, business leadership, Casey Morrison, connectivity solutions, data center performance, entrepreneurial spirit, Entrepreneurship, Eric Minuskin, EY, EY Global Chair and CEO, EY Honors Astera Labs Founders for Building a Global AI Connectivity Company from Silicon Valley Startup, EY World Entrepreneur of the Year, global award, global entrepreneurs, GROWTH, growth companies, impact, IPO, Janet Truncale, Jitendra Mohan, Monaco, private business, purpose, Salle des Etoiles, Sanjay Gajendra, Sanjay Gajendra and Casey Morrison Win EY World Entrepreneur Of The Year 2026, Semiconductor industry, Silicon Valley, software-defined connectivity, start-ups, Technology Innovation, United States, Venture Worx
(IN BRIEF) STMicroelectronics has expanded its 800 VDC power conversion portfolio with new 12V and 6V architectures designed for next-generation AI data centers. Complementing its existing 50V solution, the new converters provide a complete ecosystem for efficient power distribution in … Read the full press release
Posted in Artificial Intelligence (AI), Energy, Gas & Oil, Environment, Industrial, Infrastructure & Utilities, Management, News, Switzerland, Technology
Tagged 800 VDC, AI data centers, analog mixed signal, data center technology, energy efficiency, GaN, GPU infrastructure, hyperscalers, Marco Cassis, NVIDIA GTC 2026, power conversion, semiconductors, silicon carbide, STMicroelectronics, STMicroelectronics Advances High Density AI Computing with New Efficient Power Distribution Architectures, STMicroelectronics Strengthens Data Center Power Capabilities with Complete 800 VDC Conversion Ecosystem
(IN BRIEF) Nokia has joined the Open Compute Project as a Platinum member, reinforcing its commitment to advancing open, scalable and AI-optimized networking technologies. As AI workloads continue to stress conventional data center and network designs, Nokia will collaborate with … Read the full press release
Posted in Artificial Intelligence (AI), Business, Finland, Infrastructure & Utilities, Management, News, Technology, Telecom
Tagged advanced optics, AI data centers, AI driven network operations, AI networking, AI supercycle, data center scalability, distributed architectures, edge networking, George Tchaparian, high performance switches, IP optical integration, Nokia, Nokia Accelerates Development of AI-Optimized Data Center and Edge Networks by Collaborating with OCP’s Global Community, OCP, Open Compute Project, optical interconnects, Pallavi Mahajan, Platinum membership, PON out of band management
(IN BRIEF) Henkel has launched Loctite TCF 14001, a high-performance liquid thermal interface material designed for advanced optical transceivers used in AI data centers. Featuring a 14.5 W/m-K thermal conductivity — one of the highest among liquid TIMs — the … Read the full press release
Posted in Artificial Intelligence (AI), Business, Chemicals, Electronics & Machinery, Germany, Industrial, News, Technology
Tagged 1.6T, 800G, advanced packaging, AI data centers, automotive electronics, coherent optics, cooling technology, heat management, Henkel, Henkel Expands Advanced TIM Portfolio with Loctite TCF 14001 for Next-Generation High-Density Electronics, high thermal conductivity, industrial automation, Loctite TCF 14001, optical transceivers, power generation, silicone gap filler, telecommunications, Thermal Interface Material, TIM, Tracy Lin
(IN BRIEF) Nokia, working with Keysight Technologies, has successfully tested Ultra Ethernet Transport (UET) traffic across its 7220 and 7250 IXR data center switching platforms, validating their ability to handle the extreme performance requirements of AI and HPC workloads. The … Read the full press release
Posted in Artificial Intelligence (AI), Business, Finland, Industrial, Infrastructure & Utilities, Investment, News, Technology, Telecom
Tagged 7220 IXR, 7250 IXR, AI data centers, AI workloads, AresONE 800GE, DCQCN, high bandwidth, HPC, Keysight Technologies, low-latency, networking infrastructure, Nokia, Nokia and Keysight demonstrate breakthrough in Ethernet-based networking for AI and HPC workloads, Nokia and Keysight demonstrate Ultra Ethernet Transport breakthrough for next-generation AI data centers, Nokia proves UEC 1.0 integration with successful UET test across next-generation switching portfolio, packet loss prevention, Ram Periakaruppan, RoCEv2, Rudy Hoebeke, SR Linux, UEC Specification 1.0, UET, Ultra Ethernet Consortium, Ultra Ethernet Transport
(IN BRIEF) Nokia has partnered with Extreme Broadband (EBB) and its subsidiary Open DC to upgrade six AI data centers in Malaysia using its Data Center Gateway, Data Center Fabric, and quantum-safe networking technologies. The deployment will enhance network performance, … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Finland, Government, Industrial, Infrastructure & Utilities, Internet & Online, Investment, Management, Marketing, News, Technology, Telecom
Tagged 7220 Interconnect Router, 7250 Interconnect Router, AI data centers, banking and finance, Data Center Fabric, Data Center Gateway, DDoS mitigation, digital infrastructure, EBB, enterprise connectivity, Extreme Broadband, Kent Wong, Malaysia, Multi-Cloud Connectivity, MYDIGITAL, National Cloud Computing Policy, Nokia, Open DC, partnership, quantum-safe networks, Wong Weng Yew
(IN BRIEF) Infineon Technologies highlights the transformative potential of gallium nitride (GaN) in driving energy efficiency and decarbonization across industries such as AI, home appliances, electric vehicles, and robotics. The company anticipates rapid growth in GaN adoption, supported by its … Read the full press release
Posted in Business, Environment, Financial, Germany, Industrial, Investment, Management, News, Technology
Tagged 2025 predictions, AI data centers, decarbonization, digitalization, electric vehicles, energy efficiency, gallium nitride, GaN, home appliances, Infineon Technologies, Power Density, power semiconductors, robotics, semiconductor materials, Si, SIC, silicon carbide, sustainability
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