New Henkel hotmelt adhesive Technomelt Supra 100 Cool sets the lowest application temperature standard in the market

Posted on 15, July 2013 by | This entry was posted in Business, Chemicals, Germany, Industrial, Science and tagged , , , , , . Bookmark the permalink.

15-7-2013 — /europawire.eu/ — With an application temperature of 100 degrees Celsius, Technomelt Supra 100 Cool from Henkel is the new record-holder among hotmelt adhesives used in the packaging industry. Combined with the benefits of the proven Supra product range, this Henkel innovation delivers higher efficiency in packaging production while also promoting sustainability in customer operations.

The ongoing drive toward high bond quality, high yield and long-term availability is getting more important in packaging production. In addition to its low application temperature of 100 degrees Celsius and its high adhesive strength, Technomelt Supra 100 Cool is also characterized by its wide-ranging suitability in case sealing, carton closing and tray erection.

Production trials carried out by consumer goods manufacturers throughout Europe have demonstrated that the low application temperature of Technomelt Supra 100 Cool reduces the energy requirement compared to conventional hotmelts by up to 50 percent. Technomelt Supra 100 Cool is like all products of the Technomelt Supra line suitable for application in the food industry.

Wide application window allows warm filling and deep-freeze packaging
A further plus offered by innovative Technomelt Supra 100 Cool is its good heat resistance and cold flexibility, which enables its use for both warm-filling and deep-freeze applications. Compared to Coolmelt Ultra 90, also available from Henkel, this new hotmelt reduces adhesive consumption – in the case of a carton sealing, for example – by up to 25 percent, as was also recently validated in the industry trials.The low application temperature also means faster applicator start-up. And it enhances one of the decisive advantages of Henkel’s Supra technology: thanks to this innovative hotmelt, the amount of wear and tear to which machine components and applicators are subjected can be appreciably reduced, with the maintenance input involved in removing cracking residues also diminishing. These plus points both improve the equipment and spare part lifetime and increase production efficiency.

Henkel’s ongoing commitment in support of the packaging industry
Technomelt Supra 100 Cool is the hotmelt with the lowest application temperature of its class in the marketplace. With this new generation of low-temperature packaging adhesives, Henkel combines innovation with sustainability, further underlining its commitment to progress in support of the packaging sector and the consumer goods industry.

Contact
Holger Elfes
Business Unit and Brand PR / Adhesive Technologies | Headquarters, Düsseldorf / Germany
Phone +49-211-797-9933
Fax +49-211-798-9832

Lisa Kretzberg
Business Unit and Brand PR / Adhesive Technologies | Headquarters, Düsseldorf / Germany
Phone +49-211-797-5672
Fax +49-211-798-9832

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New Technomelt Supra 100 Cool offers a wide application window, making it particularly suitable for case, carton and box gluing.

New Technomelt Supra 100 Cool offers a wide application window, making it particularly suitable for case, carton and box gluing.

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