Hi-SIDE demonstrates an integrated high speed satellite data chain architecture at data rates exceeding 10 Gigabits per second

Hi-SIDE demonstrates an integrated high speed satellite data chain architecture at data rates exceeding 10 Gigabits per second

(PRESS RELEASE) EDINBURGH, 30-Jun-2022 — /EuropaWire/ — In June 2022, the H2020 Hi-SIDE project successfully achieved its objective of developing and demonstrating new satellite data chain technology that can capture, process, store and transmit data at speeds exceeding 10 Gbit/s.

With funding from the Horizon 2020, research and innovation program, the Hi-SIDE team designed and manufactured new satellite subsystems including:

  • SpaceFibre interface and routing switch IP cores to interconnect the data chain elements, and provide common configuration, control and housekeeping capabilities whilst supporting high data rates.
  • A data compression module capable of compression and storage of hyperspectral images at 7 Gbit/s on a CCSDS 123.0-B-2 based compression.
  • A payload processing board which provides 40GOps of computational capability.
  • A new file protection scheme that safeguards against data storage and transmission errors that may occur in optical downlinks.
  • A RF downlink composed of a 1 GBaud/5 Gbit/s Ka-Band Modulator, a 2 W Ka-Band SSPA and a ground station demodulator with a super-high-rate dual channel (LHCP, RHCP) design that can support LEO, MEO, and GEO missions with minimal implementation losses.
  • An optical terminal system which supports data link rates of up to 8 Gbit/s with optical downlink rates of 10 Gbit/s.

The individual components of the data chain were then integrated and demonstrated in a series of scenarios, representing major data processing sequences on-board satellites. This included end to end demonstrations of:

  • Storage and playback of images from a SpaceFibre Camera at 9 Gbit/s.
  • Compression and storage of hyperspectral images at 7 Gbit/s on a CCSDS 123.0-B-2 based compression.
  • Encryption and storage of files via the payload processing board.
  • Packet error burst correction up to 25% using the Hi-SIDE file protection scheme.
  • Transmission and playback of images via the RF downlink at 5 Gbit/s per channel.
  • Data transmission via the optical downlink at 10 Gbit/s.

The demonstration proved the capacity of the Hi-SIDE HSDC architecture to process, store and transmit data from instrument to ground at data rates up to 10 Gbit/s. This performance represents a significant improvement compared to current satellite payload technologies.

‘EO is a growing market but sending data from space back to Earth is a big challenge. Hi-SIDE has demonstrated the capacity of the HSDC to work at data rates that have not been achieved before and has the potential to contribute to redefining the way the satellites connect back to Earth’ – Robiel Pino, ERZIA Technologies SL.

For more detail on the specific achievements of the Hi-SIDE project and the HSDC subsystems developed within the project, please visit Hi-SIDE’s website at: https://www.hi-side.space/

ABOUT THE PROJECT:

Hi-SIDE, which stands for High-Speed Integrated Satellite Data Systems For Leading EU IndustrY, started on 1st January 2018 and ran until 30th June 2022.

The Hi-SIDE project was delivered by 11 partners from 6 countries:

  • Airbus Defence and Space SAS (France),
  • Tesat-Spacecom GmbH & Co.KG (Germany),
  • Deutsches Zentrum Luft – und Raumfahrt e.V. (Germany),
  • STAR-Dundee Limited (UK),
  • STAR-Barcelona (Spain),
  • Integrated Systems Development S.A. (Greece),
  • Kongsberg Spacetec AS (Norway),
  • Erzia Technologies SL (Spain),
  • Universitat Autonoma De Barcelona (Spain),
  • Ethniko Kai Kapodistriako Panepistimio Athinon (Greece)
  • Modus Research and Innovation Limited (UK).

To develop the technology that was demonstrated, Hi-SIDE was granted 6.9 M€ from the European Union’s H2020-COMPET-2017 Research and Innovation Action Framework Programme under Grant Agreement no 776151.

Media contact:

Modus Research and Innovation Limited
7-11 Melville Street
Edinburgh, EH3 7PE

SOURCE: Modus Research and Innovation Limited

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