(IN BRIEF) Siemens has expanded its strategic partnership with NVIDIA to advance self-verifying agentic AI workflows for semiconductor and PCB design. The collaboration combines Siemens’ EDA expertise and physics-based engineering software with NVIDIA AI infrastructure, accelerated computing, AI software and … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Germany, Industrial, Internet & Online, Security & Safety, Technology
Tagged 3D ICs, Abhi Kolpekwar, accelerated computing, ACE-RTL, agentic AI, AI Chips, Amit Gupta, Aprisa, Calibre, Catapult, chiplets, custom IC design, deterministic validation, Digital Twin, digital verification, EDA, Electronic design automation, Fuse EDA AI Agent, Gianbattista Lo Giudice, industrial AI, Innovator3D IC, Intelligence Center X, Liberty files, Nemotron 3 Ultra, NVIDIA, NVIDIA CUDA-X, NVIDIA NeMo Gym, NVIDIA Nemotron, NVIDIA OpenShell, PCB design, physics-based EDA engines, Plano, printed circuit board design, Questa One, RTL benchmarking, self-verifying AI workflows, semiconductor design, Siemens, Siemens Advances Trusted Agentic AI Workflows Across the EDA Lifecycle, Siemens Digital Industries Software, Siemens EDA, Siemens Enhances AI-Native EDA Portfolio With Self-Verifying Engineering Agents, Siemens Integrates NVIDIA AI Technologies Into Fuse EDA AI Agent System, Solido, Solido Analytics, Solido Characterization Suite, Solido Characterizer, Solido Generator, Solido Layout Analyzer, Solido LibSPICE, STMicroelectronics, Switchyard, Tessent, Texas, Timothy Costa, United States, Veloce, Xpedition
(IN BRIEF) Siemens has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company based in San Diego, California. The acquisition will expand Siemens’ EDA portfolio with AI-powered chip planning and early design exploration … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Germany, Industrial, Investment, Technology
Tagged acquisition, advanced semiconductor technologies, AI-powered chip planning, Ankur Gupta, architecture trade-offs, California, chip design, design exploration, digital design, Digital Design Creation, early design exploration, EDA software, Electronic design automation, engineering productivity, hardware design, OpenROAD, Plano, power performance and area, PPA, Precision Innovations, San Diego, semiconductor complexity, semiconductor design, Siemens, Siemens Adds AI-Driven Early Chip Planning Technology to EDA Portfolio, Siemens Digital Industries Software, Siemens EDA, Siemens Expands Semiconductor Design Capabilities With Precision Innovations Deal, Siemens Targets Faster SoC Design Exploration Through AI-Powered EDA Acquisition, silicon lifecycle management, SoC design, System-on-Chip, Texas, third quarter 2026, time to silicon, Tom Spyrou, verification workflows
(IN BRIEF) Siemens has enriched its EDA suite with Innovator3D IC™—an AI-powered, capacity-optimized workflow for 2.5D/3D IC planning, layout, protocol compliance, and data governance—and Calibre 3DStress, which integrates transistor-level thermo-mechanical simulation into standard physical verification. Innovator3D IC™’s four modules cover … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, News, Technology
Tagged 2.5D IC, 3D IC, AI-infused, Bryan Black, Calibre 3DStress, Calibre 3DThermal, Chipletz, Digital Twin, Electronic design automation, Innovator3D IC, Mike Ellow, multiphysics, Sandro Dalle Feste, Siemens Digital Industries Software, Siemens EDA, STMicroelectronics, stress analysis
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