Siemens and NVIDIA Target More Verifiable AI-Driven Outcomes in Chip and PCB Engineering

Siemens and NVIDIA Target More Verifiable AI-Driven Outcomes in Chip and PCB Engineering

(IN BRIEF) Siemens has expanded its strategic partnership with NVIDIA to advance self-verifying agentic AI workflows for semiconductor and PCB design. The collaboration combines Siemens’ EDA expertise and physics-based engineering software with NVIDIA AI infrastructure, accelerated computing, AI software and Nemotron models. The new capabilities build on Siemens’ Fuse EDA AI Agent system and integrate with Siemens Intelligence Center X, supporting agent creation and orchestration across design, manufacturing and supply chain operations. Siemens said the goal is to help engineering teams move from simple automation toward continuously validated, trusted engineering outcomes. The enhanced offering spans Siemens’ EDA portfolio, including Catapult, Questa One, Veloce, Solido, Aprisa, Calibre, Tessent, Innovator3D IC and Xpedition. It also introduces agentic AI capabilities for custom IC characterisation, layout analysis and digital verification, with reported benefits including faster turnaround times, improved token efficiency and earlier identification of design issues.

(PRESS RELEASE) MUNICH, 27-Jul-2026 — /EuropaWire/ — Siemens has announced an expansion of its strategic partnership with NVIDIA to bring self-verifying agentic AI workflows to electronic design automation, supporting semiconductor and printed circuit board engineering teams as they work toward more trusted, continuously validated design outcomes.

The new capabilities combine Siemens’ EDA software and domain expertise with NVIDIA AI infrastructure and software.

The collaboration is intended to improve result quality, time-to-results, tool-calling reliability and token efficiency for long-running engineering workloads.

Siemens said the expanded work builds on its recently introduced Fuse EDA AI Agent system.

The updated system adds NVIDIA AI technology to help long-running, domain-scoped AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.

The aim is to help engineering teams move beyond simple task automation and toward AI-supported workflows that deliver verifiable outcomes across the electronic design automation lifecycle.

The Fuse EDA AI Agent system is now integrated into Siemens Intelligence Center X, the company’s enterprise industrial AI environment for agent creation and orchestration.

Intelligence Center X supports AI-driven, coordinated processes across design, manufacturing and supply chain operations.

Siemens said this strengthens the comprehensive digital twin by bringing intelligence into broader enterprise reasoning and helping support smarter execution and more trusted outcomes.

Amit Gupta, Senior Vice President and Chief AI Strategy Officer at Siemens EDA, Siemens Digital Industries Software, said the expanded collaboration with NVIDIA brings together domain-specific industrial AI, physics-based EDA engines and accelerated computing.

He said the goal is to create trusted, self-verifying AI workflows that allow autonomous and long-running EDA AI agents to validate their decisions accurately and efficiently against proven engineering tools.

Gupta added that the approach is designed to help customers accelerate development, improve design quality and increase confidence in engineering outcomes.

Timothy Costa, Vice President and General Manager of Computational Engineering at NVIDIA, said semiconductor and PCB design are among the world’s most complex engineering challenges.

He said AI agents need trusted tools to reason, act and verify their work.

Costa added that Siemens is combining its EDA software with NVIDIA accelerated computing, AI software and Nemotron open models to create self-verifying agentic workflows that improve design quality, speed up results and give engineering teams greater confidence throughout the process.

The updated Fuse EDA AI Agent solution combines Siemens’ engineering intelligence and verification capabilities with NVIDIA AI infrastructure technologies to execute complex semiconductor design tasks with greater speed and precision.

Optimised EDA agents built with the NVIDIA NeMo Gym open library for agentic environments are designed to improve result quality, speed and token efficiency for semiconductor and PCB design.

Siemens said these capabilities support EDA design flows that can improve over time, as self-verifying agents learn from each project, refine execution strategies, optimise workflows and make better use of accumulated context.

The solution also incorporates the NVIDIA OpenShell secure runtime.

This enables enterprise-scale design teams to run autonomous agents across their EDA environment with security, access controls and audit trails in governed runtime environments.

Advanced reasoning capabilities using the latest NVIDIA Nemotron models and Switchyard are intended to help AI agents understand complex engineering trade-offs while improving performance and token efficiency.

NVIDIA accelerated computing and CUDA-X libraries support both AI reasoning and EDA engines, helping design teams pursue signoff-quality results in hours rather than days while maintaining accuracy.

Together, the new capabilities enable secure, token-efficient multi-agent coordination, real-time feedback and improved convergence across semiconductor and PCB design and verification workflows.

Siemens said this helps customers pursue more trusted engineering outcomes across demanding design environments.

The Fuse EDA AI Agent also orchestrates workflows across the semiconductor and PCB lifecycle.

Domain-specific agents can collaborate across synthesis, verification, implementation and validation processes to optimise results more holistically.

The expanded offering spans Siemens’ EDA technologies across semiconductor and electronics lifecycles.

These include high-level synthesis with Catapult, verification with Questa One and Veloce, and custom IC design and verification with Solido.

The solution also extends to physical implementation with Aprisa, signoff verification with Calibre, design-for-test with Tessent, advanced 3D IC integration using Innovator3D IC, and PCB design with Xpedition.

Siemens said the collaboration also strengthens its Solido Characterization Suite with agentic AI capabilities for custom integrated circuit design.

These workflows automate library characterisation by generating and verifying Liberty files through Solido Characterizer, Solido LibSPICE, Solido Generator and Solido Analytics.

The company said the solution delivers production-proven results for advanced-node standard cell, memory and custom IP libraries.

It also reduces characterisation turnaround times by more than 10 times and achieves a 5 times to 10 times reduction in token costs.

The agentic capabilities also extend further into custom IC design through the new Solido Layout Analyzer.

The AI-powered, measurement-aware solution is designed to help engineers visualise, explore and analyse parasitic and layout-dependent effects in post-layout designs.

Integrated with Fuse EDA AI Agent, Solido Layout Analyzer enables natural language prompting, results analysis, fixing recommendations and report generation.

Gianbattista Lo Giudice, Non-Volatile Memory Design Manager at STMicroelectronics, said the ability to connect layout insight directly with electrical behaviour is important for the company’s non-volatile memory team.

He said Solido Layout Analyzer brings layout-dependent effects analysis earlier into the flow, helping improve design confidence and reduce the time spent debugging complex design blocks by weeks.

He added that STMicroelectronics plans to test and validate the advantages in ongoing design activity.

Siemens is also extending agentic AI capabilities in digital verification.

The company said verification can consume up to 70 percent of design time and complexity, creating a major productivity challenge for the industry.

Building on the recently announced Questa One Agentic Toolkit, Siemens is expanding domain-scoped agentic AI workflows with NVIDIA’s Nemotron 3 Ultra reasoning model, which is designed for complex, long-running agents.

In agentic RTL benchmarking with the ACE-RTL agent, Siemens said Nemotron 3 Ultra leads among open models.

The model’s reasoning and efficiency help autonomous agents evaluate engineering trade-offs while continuously validating designs against golden test harnesses.

This enables teams to identify issues earlier, accelerate verification closure and deliver trusted results faster.

Abhi Kolpekwar, Senior Vice President and General Manager of Digital Verification Technologies at Siemens EDA, Siemens Digital Industries Software, said the industry has reached an inflection point as the complexity of AI chips, chiplets and 3D ICs has outpaced traditional verification methodologies.

He said agentic AI offers a path forward because it can scale with this complexity, enabling agents to orchestrate multi-domain verification, reason across billions of test scenarios and deliver production-quality results in timeframes that were not possible just two years ago.

Siemens said the expanded AI-driven EDA capabilities will be available in forthcoming releases of its AI-native EDA portfolio.

SOURCE: Siemens