(IN BRIEF) Siemens has expanded its strategic partnership with NVIDIA to advance self-verifying agentic AI workflows for semiconductor and PCB design. The collaboration combines Siemens’ EDA expertise and physics-based engineering software with NVIDIA AI infrastructure, accelerated computing, AI software and … Read the full press release →
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Germany, Industrial, Internet & Online, Security & Safety, Technology
Tagged 3D ICs, Abhi Kolpekwar, accelerated computing, ACE-RTL, agentic AI, AI Chips, Amit Gupta, Aprisa, Calibre, Catapult, chiplets, custom IC design, deterministic validation, Digital Twin, digital verification, EDA, Electronic design automation, Fuse EDA AI Agent, Gianbattista Lo Giudice, industrial AI, Innovator3D IC, Intelligence Center X, Liberty files, Nemotron 3 Ultra, NVIDIA, NVIDIA CUDA-X, NVIDIA NeMo Gym, NVIDIA Nemotron, NVIDIA OpenShell, PCB design, physics-based EDA engines, Plano, printed circuit board design, Questa One, RTL benchmarking, self-verifying AI workflows, semiconductor design, Siemens, Siemens Advances Trusted Agentic AI Workflows Across the EDA Lifecycle, Siemens Digital Industries Software, Siemens EDA, Siemens Enhances AI-Native EDA Portfolio With Self-Verifying Engineering Agents, Siemens Integrates NVIDIA AI Technologies Into Fuse EDA AI Agent System, Solido, Solido Analytics, Solido Characterization Suite, Solido Characterizer, Solido Generator, Solido Layout Analyzer, Solido LibSPICE, STMicroelectronics, Switchyard, Tessent, Texas, Timothy Costa, United States, Veloce, Xpedition
(IN BRIEF) Siemens Digital Industries Software has expanded its partnership with Intel Foundry to enhance the development of advanced semiconductor technologies. This collaboration includes certifications for Siemens’ Calibre® nmPlatform and Solido™ Simulation Suite tools with Intel’s 18A PDK, enabling cutting-edge … Read the full press release →
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Government, Industrial, Infrastructure & Utilities, Internet & Online, Investment, Management, News, Technology
Tagged 18A PDK, 3D IC, advanced packaging, Aprisa software, Calibre nmPlatform, chiplet alliance, chiplets, digital transformation, EMIB-T, GPU, Innovator3D IC, Intel Foundry, partnership, semiconductor design, semiconductor technology, Siemens, Solido Simulation Suite
EuropaWire (EW) is the first truly pan-European and leading press release distribution and newswire service for Europe and the European Union working towards consolidating Europe’s voice on the global newswire and media scene. The newswire service comes with advanced submission forms, flexible pricing and PR budgeting, granular targeting, nearly uncapped reach across countries, markets, verticals, industries, audiences, languages, etc., translation and localisation for greater local PR impact, in-depth distribution reporting, metrics and insights including measured PR reach, reads, engagements, impact, etc., no cap on words, images and multimedia to go along with your release, among others. Your press releases will be seen among the releases of Europe’s biggest and most prominent companies, brands and institutions. Here you can learn more about EuropaWire’s mission, achievements, services, etc.
HOW TO GET STARTED?
Digi Communications NV announces availability of Digi Spain’s H1 2026 financial results presentation
Load more...
