(IN BRIEF) ZEISS Semiconductor Manufacturing Technology is rolling out its new AIMS® EUV 3.0 actinic mask qualification system to leading semiconductor manufacturers worldwide, setting a new benchmark in photomask inspection with improved scanner matching, Digital FlexIllu illumination emulation, and full … Read the full press release →
Posted in Business, Electronics & Machinery, Germany, Industrial, Investment, News, Science, Technology
Tagged actinic mask qualification, AIMS EUV, AIMS EUV 3.0, chip production, Digital FlexIllu, Dr Clemens Neuenhahn, High-NA-EUV, lithography, Low-NA-EUV, mask throughput, Oberkochen Germany, photomask inspection, scanner matching, Semiconductor Manufacturing, wafer-level critical dimension, ZEISS Semiconductor Manufacturing Solutions, ZEISS Semiconductor Manufacturing Technology, ZEISS SMT, ZEISS Strengthens Global Semiconductor Support With Advanced AIMS EUV 3.0 and Performance Upgrades for Existing Systems
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