(IN BRIEF) STMicroelectronics has introduced two new ultralow-power global-shutter image sensors, VD55G4 and VD65G4, designed to enable always-on vision in compact, battery-powered devices. Part of the ST BrightSense portfolio, the sensors offer up to ten times lower power consumption compared … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Energy, Gas & Oil, Financial, Industrial, Infrastructure & Utilities, Internet & Online, Investment, Management, Marketing, Switzerland, Technology
Tagged always on vision, AR VR XR devices, Edge AI, embedded vision, global shutter, image sensors, IoT devices, microcontrollers, semiconductor technology, smart home appliances, ST BrightSense, STMicroelectronics, STMicroelectronics introduces new global shutter sensors delivering high performance vision with significantly reduced power consumption, STMicroelectronics launches ultralow power image sensors to enable always on vision in next generation wearable and smart devices, ultralow power, VD55G4, VD65G4, wearables
(IN BRIEF) STMicroelectronics will release its first quarter 2026 financial results on April 23, 2026, before European markets open. The company will host a conference call later that morning to discuss its performance and business outlook, with a live webcast … Read the full press release
Posted in Business, Economy, Financial, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Switzerland, Technology
Tagged analysts, conference call, corporate earnings, Earnings Release, financial reporting, Investor Relations, Q1 2026 results, Semiconductor industry, STM, STMicroelectronics, STMicroelectronics Sets Date for First Quarter Results and Investor Communication Session, Stock Market, Upcoming Earnings Release and Conference Call Scheduled by STMicroelectronics for April 2026, webcast
(IN BRIEF) STMicroelectronics has expanded its 800 VDC power conversion portfolio with new 12V and 6V architectures designed for next-generation AI data centers. Complementing its existing 50V solution, the new converters provide a complete ecosystem for efficient power distribution in … Read the full press release
Posted in Artificial Intelligence (AI), Energy, Gas & Oil, Environment, Industrial, Infrastructure & Utilities, Management, News, Switzerland, Technology
Tagged 800 VDC, AI data centers, analog mixed signal, data center technology, energy efficiency, GaN, GPU infrastructure, hyperscalers, Marco Cassis, NVIDIA GTC 2026, power conversion, semiconductors, silicon carbide, STMicroelectronics, STMicroelectronics Advances High Density AI Computing with New Efficient Power Distribution Architectures, STMicroelectronics Strengthens Data Center Power Capabilities with Complete 800 VDC Conversion Ecosystem
(IN BRIEF) STMicroelectronics has begun high-volume production of its PIC100 silicon photonics platform, a technology designed to support hyperscalers deploying high-speed optical interconnects in data centers and AI computing clusters. Manufactured using 300 mm semiconductor processes, the platform enables advanced … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Media, Switzerland, Technology
Tagged 1.6T transceivers, 300 mm fabrication, 800G transceivers, AI data center connectivity, AI Infrastructure, CEA-Leti, co packaged optics, data centers, Dr Vladimir Kozlov, Fabio Gualandris, hyperscalers, LightCounting, Near Packaged Optics, OFC 2026, Optical Fiber Communication Conference, optical interconnects, optical networking, photonics modulators, PIC100 platform, PIC100 TSV platform, pluggable optics market, Semiconductor Manufacturing, Sicoya, silicon nitride waveguides, silicon photonics, STMicroelectronics, STMicroelectronics accelerates silicon photonics roadmap with PIC100 platform production and plans to quadruple capacity by 2027, STMicroelectronics begins high-volume production of PIC100 silicon photonics platform to support hyperscale AI data center connectivity, through silicon via technology
(IN BRIEF) STMicroelectronics will host two investor and analyst webcasts in March 2026 covering strategic developments in artificial intelligence and sensing technologies. The first session, led by Remi El-Ouazzane, will address the company’s role in cloud-based AI infrastructure, while the … Read the full press release
Posted in Artificial Intelligence (AI), Business, Economy, Environment, Financial, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Media, Switzerland, Technology
Tagged Analyst Webcast, APMS Group, artificial intelligence, autonomous devices, Cloud AI, Energy management, integrated device manufacturer, intelligent sensing, investor webcast, Marco Cassis, MDRF Group, physical AI, Remi El-Ouazzane, renewable electricity, Semiconductor industry, semiconductors, smart mobility, STM, STMicroelectronics, STMicroelectronics Announces Investor Webcast Series Highlighting AI Infrastructure and Intelligent Sensing Innovation, STMicroelectronics Investor Events to Showcase Cloud AI Capabilities and Next Generation Intelligent Sensing Technologies, sustainability
(IN BRIEF) STMicroelectronics has introduced the Stellar P3E, the first automotive microcontroller with built-in AI acceleration for real-time edge intelligence, aimed at software-defined vehicles and X-in-1 ECU architectures that reduce cost, weight, and complexity. The MCU integrates ST’s Neural-ART Accelerator … Read the full press release
Posted in Artificial Intelligence (AI), Automotive, Energy, Gas & Oil, Environment, Industrial, Infrastructure & Utilities, Management, News, Switzerland, Technology
Tagged Arm Cortex-R52, automotive MCU, Automotive Semiconductors, Counterpoint Research, Edge AI, electric vehicles, Functional safety, Greg Basich, hybrid vehicles, Luca Rodeschini, NanoEdge AI Studio, Neural-ART Accelerator, phase-change memory, predictive maintenance, real-time AI, smart sensing, software-defined vehicle, ST Edge AI Suite, Stellar P3E, Stellar Studio, STMicroelectronics, STMicroelectronics Launches Stellar P3E Automotive MCU with Built-In AI Acceleration for Software-Defined Vehicles, virtual sensors, X-in-1 ECU, xMemory
(IN BRIEF) STMicroelectronics has expanded its strategic collaboration with Amazon Web Services through a multi-year, multi-billion-dollar agreement that makes ST a key supplier of advanced semiconductors for AWS’s cloud and AI infrastructure, covering high-bandwidth connectivity, intelligent microcontrollers and energy-efficient power … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Government, Industrial, Infrastructure & Utilities, Investment, Management, Switzerland, Technology
Tagged AI Infrastructure, Amazon Web Services, aws, AWS and STMicroelectronics Expand Long-Term Collaboration on Data Centre and AI Hardware, cloud computing, data centres, EDA optimisation, high-performance computing, hyperscale computing, Jean-Marc Chery, microcontrollers, mixed-signal processing, power ICs, semiconductors, share warrants, Silicon Design, STMicroelectronics, STMicroelectronics Deepens Strategic Partnership with AWS for Cloud and AI Infrastructure, technology partnership
(IN BRIEF) STMicroelectronics has been awarded Global Top Employer certification for 2026 by the Top Employers Institute, marking the second consecutive year it has achieved the institute’s highest recognition. The certification covers ST operations in 41 countries and places the … Read the full press release
Posted in Awards, Business, Financial, Industrial, Investment, Management, Marketing, Switzerland, Technology
Tagged Adrian Seligman, diversity equity and inclusion, employee engagement, Global Top Employer 2026, human resources excellence, learning and development, People Strategy, Rajita D’Souza, Semiconductor industry, STMicroelectronics, STMicroelectronics Recognized as a Global Top Employer for 2026 by Top Employers Institute, Talent Acquisition, Top Employers Institute, wellbeing, workplace culture
(IN BRIEF) STMicroelectronics and SP Group have inaugurated Singapore’s largest industrial district cooling system at ST’s Ang Mo Kio TechnoPark, developed in partnership with Daikin Airconditioning (Singapore). The advanced system, capable of reducing carbon emissions by 120,000 tonnes annually and … Read the full press release
Posted in Energy, Gas & Oil, Environment, Industrial, Infrastructure & Utilities, Management, News, Switzerland, Technology
Tagged 000 Tonnes of Emissions, Ang Mo Kio TechnoPark, carbon neutrality, Chua Ban Hong, clean energy, Daikin Airconditioning Singapore, decarbonization, district cooling system, EMIS, energy efficiency, Green Mark Platinum, industrial cooling, low carbon transition, net zero Singapore, PFC abatement, Rajita D’Souza, Singapore sustainability, Singapore’s Largest Industrial Cooling Project Launches at STMicroelectronics’ TechnoPark to Cut 120, smart metering, SP Group, Stanley Huang, STMicroelectronics, STMicroelectronics Partners with SP Group and Daikin to Pioneer Sustainable Cooling for Carbon-Neutral Manufacturing, sustainable manufacturing, Toa Payoh site, VOC abatement, water reclamation
(IN BRIEF) STMicroelectronics announced that Rias Al-Kadi, General Manager of its Ranging and Connectivity Division, has joined the Board of Directors of the FiRa Consortium, strengthening the company’s leadership in advancing secure ultra-wideband (UWB) technology. ST is contributing to the … Read the full press release
Posted in Automotive, Bulgaria, Financial, Industrial, Investment, Management, Marketing, News, Switzerland, Technology
Tagged appointment, automotive access, CCC Digital Key, Connectivity Standards Alliance, consumer electronics, CSA, digital key, FiRa Consortium, IEEE, IEEE 802.15.4ab, IoT, leadership, partnership, ranging and connectivity, Rias Al-Kadi, Rias Al-Kadi of STMicroelectronics appointed to FiRa Consortium Board to drive UWB adoption and standards, Semiconductor industry, SK Yong, smart homes, STM, STMicroelectronics, STMicroelectronics Executive Joins FiRa Consortium Board to Advance Ultra-Wideband Technology and Digital Key Ecosystem, STMicroelectronics strengthens UWB leadership as Rias Al-Kadi joins FiRa Consortium Board of Directors, ultra-wideband, UWB, UWB Alliance
(IN BRIEF) Siemens has enriched its EDA suite with Innovator3D IC™—an AI-powered, capacity-optimized workflow for 2.5D/3D IC planning, layout, protocol compliance, and data governance—and Calibre 3DStress, which integrates transistor-level thermo-mechanical simulation into standard physical verification. Innovator3D IC™’s four modules cover … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, News, Technology
Tagged 2.5D IC, 3D IC, AI-infused, Bryan Black, Calibre 3DStress, Calibre 3DThermal, Chipletz, Digital Twin, Electronic design automation, Innovator3D IC, Mike Ellow, multiphysics, Sandro Dalle Feste, Siemens Digital Industries Software, Siemens EDA, STMicroelectronics, stress analysis
(IN BRIEF) STMicroelectronics has introduced a fifth-generation Human Presence Detection solution for laptops, PCs, and monitors that significantly reduces daily power consumption by over 20% while enhancing user security and privacy. The solution integrates ST’s VL53L8CP FlightSense multizone Time-of-Flight sensor … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Financial, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, News, Switzerland, Technology
Tagged 3D sensing, Adaptive Screen Dimming, AI algorithms, Alexandre Balmefrezol, FlightSense, Florian Domengie, Gesture Recognition, Head Orientation AI, Human Presence Detection, laptop privacy, low-power computing, Multi-Person Detection, PC energy efficiency, PC sensor hubs, posture detection, STMicroelectronics, ToF sensor, VL53L8CP, Wake-on-Attention, Walk-Away Lock, Yole Group
(IN BRIEF) STMicroelectronics and Singapore Power (SP Group) have partnered to upgrade the cooling infrastructure at ST’s Toa Payoh site. The new dual-temperature cooling system will reduce energy consumption and carbon emissions by 2,140 tons annually. The system, designed to … Read the full press release
Posted in Business, Environment, Financial, Government, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, News, Switzerland, Technology
Tagged carbon emissions, carbon neutral, chiller cooling system, cooling system, dual-temperature cooling, energy efficiency, energy savings, energy-intensive industries, environmental goals, MEES, Operational Efficiency, partnership, refrigerant tons, Singapore Power, Singapore’s SG Green Plan, SP Group, STMicroelectronics, sustainability, Toa Payoh site
(IN BRIEF) STMicroelectronics has expanded its “Lab-in-Fab” initiative in Singapore, partnering with ASTAR IME, ULVAC, ASTAR IMRE, and NUS to advance environmentally friendly piezoelectric MEMS technology. This collaboration aims to accelerate the development and commercialization of next-generation devices for personal … Read the full press release
Posted in Business, Environment, Financial, Government, Industrial, Investment, Management, News, Switzerland, Technology
Tagged 3D mapping, A*STAR, Lab-in-Fab, lead-free materials, medical devices, NUS, partnership, personal electronics, piezoelectric MEMS, piezoMEMS, power-efficient devices, R&D collaboration, semiconductor R&D, Singapore semiconductor ecosystem, smartphone autofocus, STMicroelectronics, sustainability, ULVAC
(IN BRIEF) STMicroelectronics is showcasing over 50 advanced demos at electronica China 2025, highlighting its pioneering work in Automotive, Industrial, and Enabling Technologies. The exhibits include the newly launched Teseo VI GNSS chip with quad-band anti-jamming and centimeter-level accuracy, cutting-edge … Read the full press release
Posted in Artificial Intelligence (AI), Automotive, Business, Financial, Industrial, Investment, Management, Media, News, Switzerland, Technology
Tagged AI server PSU, automotive GNSS, Autonomous Vehicles, China tech events, contactless FOTA, data center infrastructure, digital power, Edge AI, electronica China 2025, Enabling Technologies, Gesture Recognition, industrial robotics, ISP, John Lee, Jung-hee Ryu, MEMS IMU, Meta-bounds AR glasses, NPU, Powertrain Controller, Smart Glasses, smart IoT, ST motor control, ST60 connectivity, STM32G431, STM32N6, STMicroelectronics, Teseo VI, time-of-flight sensor, Vienna PFC, Zonal Control Unit
(IN BRIEF) STMicroelectronics has unveiled its new silicon photonics and BiCMOS technologies to meet the growing demands of AI and datacenter interconnects. With a focus on energy-efficient, high-speed solutions, these innovations are set to power the next generation of optical … Read the full press release
Posted in Artificial Intelligence (AI), Business, Electronics & Machinery, Financial, Industrial, Investment, Management, News, Switzerland, Technology
Tagged 1.6Tb/s, 5G, 800Gb/s, AI clusters, AI demand, aws, BiCMOS, datacenter infrastructure, datacenters, energy efficiency, hyperscalers, optical interconnects, optical technology, optical transceivers, PIC100, semiconductor solutions, silicon photonics, silicon platform, STMicroelectronics
(IN BRIEF) STMicroelectronics has signed its first physical Power Purchase Agreement (PPA) with TotalEnergies to secure renewable energy for its operations in France. The 15-year contract will deliver 1.5 TWh of clean power from two new wind and solar farms, … Read the full press release
Posted in Business, Energy, Gas & Oil, Environment, Financial, France, Government, Industrial, Infrastructure & Utilities, Investment, Management, News, Switzerland, Technology
Tagged 100% renewable goal, baseload power, carbon neutrality, clean energy, decarbonization, design, France, Geoff West, green electricity, Manufacturing, partnership, Power Purchase Agreement, PPA, R&D, renewable energy, semiconductor, solar farms, Sophie Chevalier, STMicroelectronics, sustainability, sustainable solutions, TotalEnergies, wind farms
(IN BRIEF) STMicroelectronics and Ampere, Renault Group’s EV division, have entered a multi-year agreement to supply Silicon Carbide (SiC) power modules for Ampere’s next-generation electric powertrains starting in 2026. This partnership focuses on developing an advanced powerbox to enhance EV … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Energy, Gas & Oil, Environment, Financial, France, Government, Industrial, Investment, Management, News, Switzerland, Technology
Tagged Ampere, France, INNOVATION, Michael Anfang, partnership, Philippe Brunet, Power Modules EVs, silicon carbide, STMicroelectronics, sustainability
(IN BRIEF) STMicroelectronics, a global semiconductor leader, has unveiled plans for a new high-volume silicon carbide (SiC) manufacturing facility in Catania, Italy. This facility, part of ST’s Silicon Carbide Campus, will be fully integrated, covering R&D, manufacturing, testing, and packaging, … Read the full press release
Posted in Business, Electronics & Machinery, Environment, Financial, Government, Industrial, Infrastructure & Utilities, Investment, Italy, Management, News, Switzerland, Technology
Tagged investment, Italy, Jean-Marc Chery, partnership, Silicon Carbide (“SiC”) Manufacturing Facility, STMicroelectronics, sustainability
(IN BRIEF) STMicroelectronics introduces the EVSPIN32G4-DUAL demonstration board, featuring the highly integrated STSPIN32G4 motor controller, which facilitates the control of two motors simultaneously, streamlining product development processes and simplifying PCB design. With its Arm Cortex-M4 MCU, the controller executes complex … Read the full press release
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