(IN BRIEF) Eseye, a global IoT connectivity solutions provider, has partnered with Thales to enhance IoT devices’ connectivity. They are leveraging Thales’ expertise to implement Thales Adaptive Connect (TAC), a cloud-based solution based on eSIM technology. This solution eliminates the … Read the full press release
Posted in Business, France, Infrastructure & Utilities, Internet & Online, Technology
Tagged Adam Hayes, DIGITAL IDENTITY AND SECURITY MOBILE IOT, embedded SIM, Eseye, eSIM, Guillaume Lafaix, IFPP, IoT connectivity solutions, IoT devices, SGP.32, SGP.41, TAC, Thales Adaptive Connect, Thales connectivity management
(IN BRIEF) Vodafone, Ericsson, and Qualcomm Technologies have achieved a successful test of RedCap, a new radio and chipset technology designed to enable the connection of numerous low-cost, energy-efficient devices to high-speed 5G networks. RedCap is a software enhancement that … Read the full press release
Posted in Business, Industrial, Infrastructure & Utilities, Management, News, Technology, Telecom, United Kingdom
Tagged 5G networks, Ericsson, Franciso Martin, IoT devices, Qualcomm, RedCap Technology, Spain, vodafone
(IN BRIEF) Inmarsat and MediaTek have partnered to provide ultra-reliable, two-way satellite services to various industries, including smartphones, IoT devices, and automotive, using MediaTek’s 5G Non-Terrestrial Networks (NTN) technology and Inmarsat’s ELERA L-band satellite network. The collaboration will enable mobile … Read the full press release
Posted in Business, Industrial, Internet & Online, Technology, Telecom, United Kingdom
Tagged 5G, automotive, ELERA L-band, Inmarsat, Internet of Things, IoT, IoT devices, Jat Brainch, JC Hsu, MediaTek, mobile network operators, Non-Terrestrial Networks, NTN, satellite, satellite network, smartphone manufacturers, smartphones
Infineon to launch “Build AI for the IoT Design Challenge” on hackster.io, February 3, 2022 (PRESS RELEASE) MUNICH, 8-Feb-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced a new partnership with … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Infrastructure & Utilities, News, Technology
Tagged AI, AI tools, AIROC™, CAPSENSE™, Chris Rogers, data analytics, hackster.io, Infineon Technologies, Internet of Things, IoT, IoT devices, Machine Learning, MCUs, ML, ModusToolbox™, PSoC 6, PSoC™ 6 microcontrollers, SensiML, SensiML Analytics Toolkit, smart applications, smart home, Steve Tateosian, XENSIV™, XENSIV™ sensors
(PRESS RELEASE) MUNICH, 18-Feb-2021 — /EuropaWire/ — From 1-5 March 2021, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will be showcasing its comprehensive IoT portfolio for the first time at the virtual Embedded Solutions Conference 2021 (ESC21). The acquisition … Read the full press release
Posted in Artificial Intelligence (AI), Automotive, Germany, Industrial, Infrastructure & Utilities, Internet & Online, Marketing, News, Security & Safety, Technology
Tagged advanced driver assistance, ARM, artificial-intelligence, AURIX™ microcontrollers, automated driving, automotive microcontrollers, connected age, connected mobility, connectivity components, Cortex, Cypress, data infrastructure, digital world, Embedded Solutions Conference 2021, ESC21, eSIM, hardware, ICT security, iMOTION™, Infineon, Infineon Technologies AG, IoT, IoT devices, M4F, M7F architecture, microcontroller, microcontrollers, OPTIGA™ TPM, OPTIGA™ TPM SLI 9670, OPTIGA™ Trust, security sensor, security solutions, semiconductor manufacturers, semiconductors, Sensors, smart building, smart car, smart device, smart factory, smart home, Smart Things, software, software ecosystems, software tools, telematics, TRAVEO™, virtual trade shows, XENSIV™ sensors, XMC™ microcontrollers
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