(IN BRIEF) Infineon Technologies AG introduces a new portfolio of 62mm half-bridge and common emitter modules featuring 1200V TRENCHSTOP™ IGBT7 chips. The addition of the 800A maximum current class expands the range of offerings, providing system designers with flexibility in … Read the full press release
(IN BRIEF) Infineon Technologies AG announces the expansion of its data logging memory portfolio with the introduction of two new automotive-qualified Ferroelectric RAM (F-RAM) memory devices. These devices, available in 1Mbit and 4Mbit densities, cater to the increasing demand for … Read the full press release
Posted in Business, Germany, Industrial, Management, News, Technology
Tagged Data Logging Expansion, EXCELON, F-RAM, Infineon, Memory Devices, Ramesh Chettuvetty
(IN BRIEF) Infineon Technologies AG and Semikron Danfoss have signed a multi-year volume agreement for the supply of silicon-based electromobility chips. As the demand for power semiconductors rises due to the rapid growth of electromobility, Infineon will provide chipsets consisting … Read the full press release
Posted in Automotive, Business, Germany, Industrial, Management, News, Technology
Tagged Claus A. Petersen, electric vehicles, Electromobility Chips, Infineon, partnership, Peter Schiefer, Semikron Danfoss
(IN BRIEF) Infineon Technologies AG has partnered with Edge Impulse to expand its Tiny Machine Learning-based AI development tools for the PSoC 63 Bluetooth LE microcontroller. This collaboration enables developers to build edge Machine Learning (ML) applications using Edge Impulse … Read the full press release
Posted in Business, Germany, Industrial, Management, News, Technology
Tagged AI Development Tools, Edge Impulse, Infineon, partnership, PSoC 63 Bluetooth LE MCUs, Shantanu Bhalerao
(IN BRIEF) Infineon has introduced its new generation of 1200 V CoolSiC™ MOSFETs in TO263-7 packaging for automotive applications. These silicon carbide (SiC) MOSFETs offer high power density, efficiency, and enable bi-directional charging. They also reduce system costs in on-board … Read the full press release
(IN BRIEF) Infineon Technologies AG has launched the HybridPACK Drive G2, a new automotive power module that offers scalability and extends the concept of an integrated B6 package to higher power and ease-of-use. The HybridPACK Drive G2 is available with … Read the full press release
Posted in Business, Energy, Gas & Oil, Germany, Industrial, Management, News, Technology
Tagged HybridPACK Drive G2, Infineon, power
(IN BRIEF) Infineon Technologies has launched SEMPER X1 LPDDR Flash memory, the first of its kind in the industry, to enable the next generation of automotive E/E architectures. The device delivers eight times the performance of current NOR Flash memories … Read the full press release
Posted in Business, Germany, Industrial, Management, News, Technology
Tagged Infineon, Jim Handy, LPDDR Flash memory, Sandeep Krishnegowda, software, vehicles
(IN BRIEF) Infineon Technologies and Hi-Lo Systems have partnered in the Greater China market to accelerate time-to-market for device manufacturers using Infineon’s Trusted Platform Module (TPM) security chips. Hi-Lo Systems will provide firmware update programming services for Infineon’s OPTIGA TPMs, … Read the full press release
Posted in Business, Germany, Industrial, Management, News, Technology
Tagged Hi-Lo Systems, Infineon, partnership, Szu Po Huang, Theodore Varelas, TPM firmware
(IN BRIEF) Infineon Technologies has expanded its SECORA Pay solutions portfolio to include 28 nm technology, with a new product family that uses an embedded non-volatile memory. The new plug-and-play solutions offer an onboarding and migration path for card manufacturers, … Read the full press release
Posted in Business, Financial, Germany, Industrial, Management, News, Technology
Tagged 28 nm chip, Infineon, payment industry, SECORA™, semiconductor shortages, technology, Tolgahan Yildiz
(IN BRIEF) Infineon Technologies has partnered with Infinitum to provide semiconductor components for the latter’s Aircore EC motor. Infineon will provide silicon carbide (SiC) CoolSiC MOSFETs, which help to optimise the motor’s power and energy savings. The Infinitum Aircore EC … Read the full press release
Posted in Energy, Gas & Oil, Environment, Germany, Industrial, Management, News, Technology
Tagged air core motor, decarbonization, energy efficiency, Germany, industrial applications, Infineon, Infinitum, Infinitum Aircore EC motor, Michael Williams, partnership, Rick Tewell, semiconductor, silicon carbide (SiC) CoolSiC MOSFETs
(NOTICIA EN BREVE) Infineon Technologies está listo para exhibir una gama de soluciones de energía de alto rendimiento y eficiencia energética en la Conferencia de Electrónica de Potencia Aplicada 2023 en Orlando. La cartera de productos de la empresa de … Read the full press release
Posted in Electronics & Machinery, Energy, Gas & Oil, Environment, Germany, Industrial, Marketing, Technology
Tagged almacenamiento de energía, APEC, banda prohibida amplia, carga de vehículos eléctricos, centros de datos, Conferencia de electrónica de potencia aplicada de 2023, control de motores, controladores de puente, descarbonización, digitalización, dispositivos electrónicos de potencia, Infineon, Infineon Technologies AG, MOSFET, puentes integrados, silicio, soluciones de energía
(IN BRIEF) Infineon Technologies is set to showcase a range of high-performance and energy-efficient power solutions at the 2023 Applied Power Electronics Conference in Orlando. The company’s product portfolio of advanced silicon and wide bandgap materials will be highlighted to … Read the full press release
Posted in Electronics & Machinery, Energy, Gas & Oil, Environment, Germany, Industrial, Marketing, Technology
Tagged 2023 Applied Power Electronics Conference, APEC, bridge drivers, data centers, decarbonization, digitalization, energy storage, EV charging, Infineon, Infineon Technologies AG, Integrated Bridges, MOSFETs, Motor Control, power electronic devices, power solutions, silicon, wide bandgap
(IN BRIEF) Continental and Infineon Technologies are collaborating to develop a more efficient and organized electrics/electronics architecture for the automotive industry. The new architecture features central high-performance computers (HPC) and a few powerful Zone Control Units (ZCU), replacing up to … Read the full press release
Posted in Business, Electronics & Machinery, Germany, Management, News, Technology, Transportation & Logistics
Tagged AURIX microcontroller family, automotive, Continental, electrics architecture, electronics architecture, Gilles Mabire, high performance computers, HPC, Infineon, Jean-Francois Tarabbia, microcontroller, Peter Schiefer, TC4x, technology, vehicle architecture, ZCU, Zone Control Units
(IN BRIEF) Infineon Technologies has released the NGC1081, a single-chip solution for developing passive smart devices for IoT applications. The tag-side controller supports a dual power supply function, allowing it to operate in a passive mode based on energy harvesting … Read the full press release
(IN KÜRZE) Infineon und ein Konsortium aus namhaften Unternehmen und Forschungsinstitutionen arbeiten im Projekt MANNHEIM-CeCaS an der Entwicklung einer automobile Supercomputing-Plattform für das autonome Fahren. Die Plattform soll auf hochleistungsfähigen Prozessoren auf Basis von nichtplanarer Transistortechnologie (FinFET) sowie Applikationsspezifischen Hardware-Beschleunigern … Read the full press release
(ACTUALITÉ EN BREF) Infineon dirige un consortium de 30 partenaires de recherche dans le développement d’une plate-forme de supercalcul automobile pour les futurs véhicules hautement automatisés. Le projet de recherche, appelé Mannheim-CeCaS, étudiera le développement d’une plate-forme informatique centrale holistique … Read the full press release
Posted in Automotive, Germany, Industrial, Technology, Transportation & Logistics
Tagged Ambrosys, ASIL-D, auto-mobilité, auto-mobility, automated connected vehicles, automotive qualification, automotive supercomputing, Autonomous Vehicles, AVL Software & Functions, Berliner Nanotest und Design, BMBF, Bosch, CentralCarServer, Chemnitz University of Technology, Continental, Continental Automotive, FinFET, Fraunhofer ENAS, Fraunhofer Institutes, FZI Research Center for Information Technology, Glück Engineering, Hella, IMWS, Inchron, Infineon, Infineon Technologies AG, Institut de technologie de Karlsruhe, Instituts Fraunhofer, IPMS, IZM, Karlsruhe Institute of Technology, Karlsruhe Institute of Technology (KIT), Kernkonzept, LIS and SEC), Mannheim-CeCaS, Missing Link Electronics, Munich University of Applied Sciences, Peter Schiefer, qualification automobile, Steinbeis ZFW, STTech, supercalcul automobile, Swissbit Allemagne, Swissbit Germany, Technical University of Munich (AIR, TU Munich, Universität zu Lübeck, véhicules autonomes, véhicules connectés automatisés, ZF Friedrichshafen
(IN BRIEF) Infineon is leading a consortium of 30 research partners in the development of an automotive supercomputing platform for future highly-automated vehicles. The research project, called Mannheim-CeCaS, will investigate the development of a holistic central computing platform to provide … Read the full press release
Posted in Automotive, Germany, Industrial, Technology, Transportation & Logistics
Tagged Ambrosys, ASIL-D, auto-mobility, automated connected vehicles, automotive qualification, automotive supercomputing, Autonomous Vehicles, AVL Software & Functions, Berliner Nanotest und Design, BMBF, Bosch, CentralCarServer, Chemnitz University of Technology, Continental, Continental Automotive, FinFET, Fraunhofer ENAS, Fraunhofer Institutes, FZI Research Center for Information Technology, Glück Engineering, Hella, IMWS, Inchron, Infineon, Infineon Technologies AG, IPMS, IZM, Karlsruhe Institute of Technology, Karlsruhe Institute of Technology (KIT), Kernkonzept, LIS and SEC), Mannheim-CeCaS, Missing Link Electronics, Munich University of Applied Sciences, Peter Schiefer, Steinbeis ZFW, STTech, Swissbit Germany, Technical University of Munich (AIR, TU Munich, Universität zu Lübeck, ZF Friedrichshafen
(ACTUALITÉ EN BREF) Sentry Enterprises, une entreprise technologique axée sur la transformation de l’identité, a choisi la famille de puces SLC37x Secure Element de dernière génération d’Infineon pour alimenter ses plates-formes biométriques. Sentry finalise actuellement sa “plate-forme d’identité universelle” de … Read the full press release
(IN BRIEF) Sentry Enterprises, a technology company focused on transforming identity, has chosen Infineon’s latest generation SLC37x Secure Element chip family to power its biometric platforms. Sentry is currently finalizing its next-generation “universal identity platform” that incorporates biometric hardware, a … Read the full press release
New Multi-Year Agreement to Deepen Partnership in Silicon Carbide Supply Chain Infineon expands its SiC manufacturing capacity to reach a market share of 30% by the end of the decade (PRESS RELEASE) MUNICH, 12-Jan-2023 — /EuropaWire/ — Infineon Technologies AG … Read the full press release
Nuevo acuerdo plurianual para profundizar la asociación en la cadena de suministro de carburo de silicio Infineon amplía su capacidad de fabricación de SiC para alcanzar una cuota de mercado del 30 % a finales de la década (COMUNICADO DE … Read the full press release
(PRESS RELEASE) MUNICH, 2-Jan-2023 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, and NuCurrent, a supplier of Fortune 1000 companies and other high-flying product developers with wireless power technologies and product integration expertise, … Read the full press release
Posted in Business, Energy, Gas & Oil, Germany, Industrial, Marketing, News, Technology
Tagged Charging Technology, Doris Keitel-Schulz, energy harvesting, Infineon, Jacob Babcock, NFC, NuCurrent
(PRESS RELEASE) MUNICH, 27-Oct-2021 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced the launch of its first automotive current sensor. The coreless current sensor, the new XENSIV™ TLE4972, will use Infineon’s … Read the full press release
Posted in Automotive, Germany, Industrial, News, Technology
Tagged automotive current sensor, battery main switches, battery-driven vehicles, Hall technology, Hybrid, Infineon, Infineon Technologies AG, PG-TDSO-16, PG-VSON-6, sensor, TLE4972, TLE4972-AE35S5, traction inverters, XENSIV TLE4972-AE35D5, XENSIV™ TLE4972, xEV applications
(PRESS RELEASE) MUNICH, 18-Feb-2021 — /EuropaWire/ — From 1-5 March 2021, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will be showcasing its comprehensive IoT portfolio for the first time at the virtual Embedded Solutions Conference 2021 (ESC21). The acquisition … Read the full press release
Posted in Artificial Intelligence (AI), Automotive, Germany, Industrial, Infrastructure & Utilities, Internet & Online, Marketing, News, Security & Safety, Technology
Tagged advanced driver assistance, ARM, artificial-intelligence, AURIX™ microcontrollers, automated driving, automotive microcontrollers, connected age, connected mobility, connectivity components, Cortex, Cypress, data infrastructure, digital world, Embedded Solutions Conference 2021, ESC21, eSIM, hardware, ICT security, iMOTION™, Infineon, Infineon Technologies AG, IoT, IoT devices, M4F, M7F architecture, microcontroller, microcontrollers, OPTIGA™ TPM, OPTIGA™ TPM SLI 9670, OPTIGA™ Trust, security sensor, security solutions, semiconductor manufacturers, semiconductors, Sensors, smart building, smart car, smart device, smart factory, smart home, Smart Things, software, software ecosystems, software tools, telematics, TRAVEO™, virtual trade shows, XENSIV™ sensors, XMC™ microcontrollers
(PRESS RELEASE) MUNICH, 14-Mar-2019 — /EuropaWire/ — Dr. Sven Schneider, who is currently Board Spokesman, CFO and Labor Director at Linde AG, will be the next CFO of Infineon Technologies AG. His appointment has just been voted by Infineon’s Supervisory … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Investment, Management, News, Technology
Tagged accounting, appointment, Auditing, BOC, Business Continuity, CFO, compliance, Dr. Eckart Sünner, Dr. Reinhard Ploss, Dr. Sven Schneider, Export Control, Financial Controlling, Financial Planning, IFNNY, IFX, Infineon, Infineon Technologies AG, Investor Relations, leadership, Lincare, Linde AG, Management, microelectronics, reporting, risk management, semiconductors, taxes, treasury
(PRESS RELEASE) MUNICH, 22-Feb-2019 — /EuropaWire/ — Infineon Technologies AG, Xilinx Inc. and Xylon, d.o.o. will present a new Xylon IP core called logiHSSL presented at Embedded World trade fair 2019. The companies have joined forced to provide more flexibility in … Read the full press release
Posted in Automotive, Electronics & Machinery, Germany, Industrial, News, Technology, Telecom
Tagged AD architecture, ADAS architecture, ASICs, ASIL D level functional safety, AURIX, AURIX devices, compute acceleration, Connected Vehicles, Data aggregation, Embedded World 2019, emerging applications, FPGA-based HSSL solution, HSSL, industrial automation applications, Infineon, Infineon AURIX evaluation board, IP core, logicBRICKS, logiHSSL, Paul Zoratti, performance-hungry applications, Ralf Koedel, safe vehicles, safety-critical applications, secure factories, smart homes, smart vehicles, sophisticated drones, Xilinx, Xilinx evaluation kit, Xylon FMC board, Xylon IP core
MUNICH, 09-Nov-2018 — /EuropaWire/ — The Internet of Things (IoT) connects millions of devices from huge industrial machines to tiny remote sensors. Yet from one application to another, security requirements vary considerably. To develop customized solutions, Infineon Technologies AG (FSE: IFX … Read the full press release
Joint press release by exceet Card AG and Infineon Technologies AG MUNICH, 20-Apr-2018 — /EuropaWire/ — exceet Card AG is further strengthening its portfolio with SECORA™ Pay security solutions from Infineon Technologies AG. Card manufacturers can easily integrate them thanks … Read the full press release
Munich, Germany, 10-7-2015 — /EuropaWire/ — IR HiRel, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced the introduction of the HiRel HTB28 series, the industry’s first hermetic hybrid DC-DC converters rated at 185 ºC in a 1 inch … Read the full press release
Nuremberg, Germany, 21-10-2013 — /EuropaWire/ — Today (October 10, 2013) at the European Microwave Week tradeshow, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced 50V LDMOS transistors designed for use in UHF TV broadcast transmitters, including one device providing the highest peak … Read the full press release
Posted in Business, Electronics & Machinery, Germany, Media, Technology, Telecom
Tagged 50V LDMOS transistors, amplifier designers, European Microwave Week, European Microwave Week tradeshow, Infineon, Infineon Technologies AG, Nuremberg, PTVA042502EC, PTVA042502FC, PTVA047002EV, RF Portfolio, tradeshow, Transistors, UHF TV broadcast transmitters, UHF TV Power Amplifiers
Volume production will start in early 2014 Nuremberg, Germany, 21-10-2013 — /EuropaWire/ — Today (October 8, 2013), at the European Microwave Week tradeshow, Infineon Technologies introduced the latest generation of its pico GNSS (Global Navigation Satellite System) modules for smartphones. BGM1143N9 … Read the full press release
Posted in Business, Electronics & Machinery, Germany, Technology, Telecom
Tagged BeiDou, BGM1143N9, Compact Mobile Phones, European Microwave Week tradeshow, Global Navigation Satellite System, GLONASS, GNSS, GPS, high linearity, Infineon, Infineon Technologies, low noise amplifier (LNA), low-insertion-loss pre-filter, lowest noise figure, Navigation Functionality, navigation standards, pico GNSS modules, semiconductor solutions, Smallest GNSS Module, smartphones, Tillmann Geneuss, TSNP-9 package
Neubiberg, 22-7-2013 — /EuropaWire/ — Bombardier Transportation, an international market leader in modern rail transportation technologies, has presented Infineon Technologies AG with its Supplier Sustainability Award 2013. Bombardier introduced this award in 2011, and it is bestowed once a year in … Read the full press release
Posted in Awards, Business, Electronics & Machinery, Energy, Gas & Oil, Environment, Germany, Technology
Tagged Bombardier, Charles O‘ Donnell, Christoph Schwärzler, corporate management, Corporate Social Responsibility, CSR, Daniel Desjardins, Dr. Helmut Gassel, Environment, Infineon, Infineon Technologies AG, Supplier Sustainability Award, supply chain, sustainability goals, sustainable mobility, transparency
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