Infineon Expands Portfolio with 62mm Half-Bridge Module for Higher Current Power Solutions

Infineon Expands Portfolio with 62mm Half-Bridge Module for Higher Current Power Solutions

(IN BRIEF) Infineon Technologies AG introduces a new portfolio of 62mm half-bridge and common emitter modules featuring 1200V TRENCHSTOP™ IGBT7 chips. The addition of the 800A maximum current class expands the range of offerings, providing system designers with flexibility in designing higher current power solutions. These modules are suitable for applications such as solar central inverters, industrial drives, UPS, EV charging, and energy storage systems. The modules utilize micro-pattern trench technology, resulting in lower static losses and improved controllability. They also feature high mechanical robustness and compatibility with previous module versions. Thermal interface material is pre-applied to facilitate efficient heat dissipation.

(PRESS RELEASE) MUNICH, 19-Jul-2023 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a 62mm half-bridge and common emitter module portfolio with 1200 V TRENCHSTOP™ IGBT7 chips. The wide range of offerings in the proven 62mm housing is extended with the new 800 A maximum current class for the package family. The addition to the portfolio’s current classes provides system designers with a high degree of flexibility in designing higher current power solutions while offering higher power density and electrical performance. It is tailored to meet the needs of solar central inverters as well as industrial drive applications and uninterruptible power supplies (UPS). Additionally, EV charging, energy storage systems (ESS) and other new industrial applications can be covered.

Based on the new micro-pattern trench technology, the 62mm module family with the 1200 V TRENCHSTOP IGBT7 chip has significantly lower static losses compared to the modules with the IGBT4 chipset. This results in significant loss reduction in applications, especially in industrial drives that typically operate at moderate switching frequencies. The IGBT’s oscillation behavior and controllability have been improved. In addition, the new power modules feature a maximum overload junction temperature of 175°C.

A solid, nickel-coated copper baseplate and screw main terminals ensure the high mechanical robustness of the 62mm module housing. The main terminals are located in the center of the housing, making them well suited for parallel circuits and 3-level configurations due to the low inductive DC link connection. Unchanged standard package design and dimensions within the module family support mechanical compatibility with the previous module version. In addition, all modules are available with Infineon’s proven pre-applied thermal interface material (TIM).


The 1200 V TRENCHSTOP IGBT7 62mm portfolio can be ordered now. Variants with pre-applied TIM will also be available shortly. More information is available at and, respectively.

More information about Infineon’s contribution to energy efficiency:

Media Contact:

Fabian Schiffer
Tel: +49 89 234 25869

SOURCE: Infineon Technologies AG



Comments are closed.