(PRESS RELEASE) MUNICH, 22-Feb-2019 — /EuropaWire/ — Infineon Technologies AG, Xilinx Inc. and Xylon, d.o.o. will present a new Xylon IP core called logiHSSL presented at Embedded World trade fair 2019. The companies have joined forced to provide more flexibility in how to use safety microcontrollers in automotive and industrial applications.
The new logiHSSL will enable high-speed communication between Infineon’s AURIX™ TC2xx and TC3xx microcontrollers and Xilinx’ SoC, MPSoC and FPGA devices via the Infineon High Speed Serial Link (HSSL).
Baud-rates of up to 320 Mbaud are supported by the serial link at a net payload data-rate of up to 84%.
The HSSL, an Infineon native interface, is low-cost when it comes to pin-count as it requires only five pins – two LVDS with two pins each and one clk pin.
The HSSL interface is usually used to exchange data between AURIX devices and customer ASICs for performance or functional extension.
With the new IP core, system developers will be able to combine safety and security provided by AURIX with the wide range of functional possibilities brought to the table by the Xilinx devices. The linked devices can access and control each other’s internal and connected resources through the HSSL.
The new logiHSSL IP core and the development kit will be available starting in March 2019.
Ralf Koedel, Marketing Director Microcontrollers at Infineon:
“Our AURIX microcontrollers are the market reference for many safety-critical applications, for example in advanced driver assistance and automated driving. Now, we are creating new options for our customers in emerging applications that are both performance-hungry and safety-critical. Besides the ones mentioned these include for example industrial automation applications.”
Paul Zoratti, director Automotive Solutions, Xilinx:
“Our products are adopted in ADAS and AD architectures for data aggregation, pre-processing, and distribution as well as compute acceleration. Coupled with the AURIX family providing ASIL D level functional safety, this has created a strong market pull for an FPGA-based HSSL solution. Xylon’s licensable IP core will enable customers to implement a reliable HSSL communications path between Xilinx and Infineon devices without expending valuable development resources.”
Infineon, Xilinx and Xylon have put together a starter kit that includes a Xilinx evaluation kit, an Infineon AURIX evaluation board and a Xylon FMC board to support development activities. It also contains the reference design with the test software application, Xylon’s logicBRICKS evaluation licenses, documentation and technical support.
Infineon will demonstrate demo boards at this year’s Embedded World in Nuremberg, Germany from 26 to 28 February 2019. The company will exhibit at booth #231, hall 3A while its distribution partner EBV will be at booth #229, hall 3A.
More information on Infineon exhibiting at Embedded World can be found over here:
SOURCE: Infineon Technologies AG