LPKF and Onto Innovation Propel Advanced Packaging with Cutting-Edge Glass Processing Solutions

LPKF and Onto Innovation Propel Advanced Packaging with Cutting-Edge Glass Processing Solutions

(IN BRIEF) LPKF Laser & Electronics SE has joined Onto Innovation’s Packaging Applications Center of Excellence (PACE) to accelerate the production of panel-level packages that use glass cores, crucial for modern semiconductor applications like high-performance computing and AI. LPKF will leverage its LIDE technology, known for defect-free through glass via (TGV) processing, while Onto Innovation contributes its Firefly® system for automated inspection and metrology. In Q2 2025, the Firefly system will be installed at Vitrion, LPKF’s Center of Excellence in Hannover, ensuring high-throughput quality control for glass substrates and interposers. This collaboration aims to streamline process integration and secure the supply chain for advanced packaging, significantly reducing production time and costs while enhancing chip quality. Leaders from both companies emphasize the strategic importance of this partnership in driving innovation and meeting the growing demands of high-volume manufacturing.

(PRESS RELEASE) HANNOVER, 3-Apr-2025 — /EuropaWire/ — LPKF Laser & Electronics SE has joined forces with Onto Innovation by becoming part of its Packaging Applications Center of Excellence (PACE) as of 2024. PACE is dedicated to creating a seamless process integration and establishing a secure supply chain to fast-track the mass production of panel-level packages built on glass cores—key components in semiconductor architectures for high-performance computing, AI, cloud services, and machine/deep learning. LPKF’s proprietary LIDE technology is renowned for its ability to micro-process through glass vias (TGV) without defects, making it ideal for advanced glass substrate production. Complementing this, Onto Innovation’s Firefly® system offers an automated solution for inspection and metrology, critical for quality assurance in IC substrates and panel-level packaging.

Taking the collaboration a step further, Onto Innovation and LPKF are set to install Onto’s cutting-edge Firefly system in the cleanroom at Vitrion, LPKF’s Center of Excellence for glass processing in Hannover, Germany, in Q2 this year. This strategic move will enable high-throughput quality control of glass substrates and interposers, significantly reducing time to market and supporting high-volume manufacturing.

Dr. Roman Ostholt, Managing Director LIDE at LPKF, commented, “Our partnership within PACE has already yielded remarkable outcomes. Glass substrates have the potential to lower the cost of interposers while maintaining exceptional chip quality. Integrating Onto’s Firefly system into our process is a major step forward in our joint mission to develop high-volume manufacturing solutions for advanced packaging.” Mike Rosa, Chief Marketing Officer and Senior Vice President of Strategy at Onto Innovation, added, “Collaborating with industry pioneers like LPKF is a privilege for Onto Innovation. The deployment of our Firefly system for TGV process control at Vitrion represents a pivotal milestone, advancing the reliability and performance of glass substrates and interposers. Together, we are driving the future of advanced packaging applications.”

About Onto Innovation

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that includes un-patterned wafer quality, 3D metrology spanning chip features from na-nometer scale transistors to large die interconnects, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics, and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking ap-proach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster, and more efficient. With headquarters and manufacturing in the U.S., Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com.

About LPKF

As a high-tech mechanical engineering company, LPKF develops high-precision, scalable manufacturing pro-cesses that are used in growth markets such as semiconductors & electronics, life science & medical technolo-gy, smart mobility and research & development. Founded in 1976, the company is headquartered in Garbsen near Hanover and operates worldwide through subsidiaries and representatives. LPKF employs over 750 peo-ple and is committed to driving technological advancement with innovative solutions, aiming to create a sus-tainable positive impact on the world. The shares of LPKF Laser & Electronics SE are traded on the SDAX of the German Stock Exchange (ISIN 0006450000).

Media Contacts:

Bettina Schäfer
bettina.schaefer@lpkf.com
Tel. +49 5131 7095-1382
Fax +49 5131 7095-90

Onto Innovation:
Amy Shay
Amy.shay@ontoinnovation.com
Tel. +1 952 259 1794

MANAGEMENT BOARD:
Dr. Klaus Fiedler (CEO)
Peter Mümmler (CFO)
LPKF Laser & Electronics SE
Osteriede 7, 30827 Garbsen
www.lpkf.com

SOURCE: LPKF