(IN BRIEF) LPKF reported a solid start to 2026, with rising order intake and a strong book-to-bill ratio of 1.4, despite a decline in revenue to €17.1 million due to weakness in the Solar segment. The company’s North Star transformation … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Marketing, Technology
Tagged Advanced Semiconductor Packaging, book to bill ratio, electronics segment, Garbsen Germany, industrial technology, Klaus Fiedler, laser processing, LIDE technology, LPKF Laser & Electronics SE, LPKF Reports Strong Order Growth and Advances Transformation Strategy Despite Challenging Start to 2026, LPKF Strengthens Semiconductor Position and Cost Efficiency as Order Intake Rises in First Quarter 2026, North Star program, order intake, PCB manufacturing, perovskite solar cells, Q1 2026 results, Semiconductor industry, solar segment, surface mount technology, transformation strategy, welding restructuring
(IN BRIEF) LPKF Laser & Electronics SE has obtained new patent protection in Korea for its LIDE (Laser Induced Deep Etching) technology, effective September 1, 2025. The process enables ultra-precise, damage-free structuring of thin glass substrates, with applications across semiconductor … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Industrial, News, Technology
Tagged advanced packaging, co-packaging optics, earthworm structure, high-volume manufacturing, Korean Patent Office, Laser Induced Deep Etching, LIDE technology, LPKF, LPKF Laser & Electronics SE, microsystem manufacturing, precision glass processing, Roman Ostholt, Semiconductor Manufacturing, TGV, through glass vias
(IN BRIEF) LPKF Laser & Electronics SE has joined Onto Innovation’s Packaging Applications Center of Excellence (PACE) to accelerate the production of panel-level packages that use glass cores, crucial for modern semiconductor applications like high-performance computing and AI. LPKF will … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged advanced packaging, automated inspection, cleanroom, Dr. Roman Ostholt, Firefly® system, glass cores, Hannover, high-volume manufacturing, LIDE technology, LPKF Laser & Electronics SE, metrology, Mike Rosa, Onto Innovation, Pace, Packaging Applications Center of Excellence, partnership, semiconductor, TGV, through glass vias, Vitrion
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