Tag Archives: high-power electronics

Henkel Expands Thermal Interface Portfolio with Durable, High-Performance Liquid Gap Filler for Advanced Devices

(IN BRIEF) Henkel has introduced Bergquist TGF 10000, a new liquid gap filler providing 10 W/mK thermal conductivity for high-power electronics that require efficient heat dissipation. Based on a silicone two-component system, the material combines strong thermal performance with high … Read the full press release