Tag Archives: lead frame packages

Henkel to address the demands of contemporary packaging device designs with a new high-performance non-conductive die attach film

(PRESS RELEASE) IRVINE, CA, United States, 30-Nov-2022 — /EuropaWire/ — Henkel (ETR: HEN3), a German chemical and consumer goods company, has announced it will address the the demands of contemporary packaging device designs with the launch of a new high-performance … Read the full press release