Henkel Unveils Next-Gen Silicone-Free Thermal Gel to Enhance ADAS Reliability in Autonomous Vehicles

Bergquist Liqui Form TLF 6500CGel-SF, thermal cure gel applied on the ADAS Domain Controller.

(IN BRIEF) Henkel has launched Bergquist Liqui Form TLF 6500 CGel-SF, a state-of-the-art silicone-free, thermal curable gel developed to protect ADAS components from thermal degradation. Designed for advanced driver assistance systems that process vast amounts of sensor and vehicle data, the gel offers a superior conductivity of 6.5W/(m·K), ensuring effective heat dissipation. This new material fills gaps and air voids, reducing compression stress on delicate electronic assemblies while facilitating high-speed, just-in-time manufacturing. Moreover, the product meets stringent sustainability standards, being low in VOCs, free of D4-D10 chemicals, and exhibiting minimal oil bleeding, which is crucial for maintaining the performance of optical components. Henkel’s innovation is positioned to enhance the reliability and longevity of ADAS systems in an era of rapidly growing data demands and increasingly sophisticated vehicle platforms.

(PRESS RELEASE) DÜSSELDORF, 19-Mar-2025 — /EuropaWire/ — Amid the rapid advancement of autonomous driving technology, Henkel has introduced an innovative thermal management solution designed specifically for high-performance ADAS components. The company’s latest product, Bergquist Liqui Form TLF 6500 CGel-SF, is a silicone-free, thermal curable gel engineered to protect critical ADAS domain controllers from the detrimental effects of excessive heat. As ADAS systems handle increasing volumes of sensor and vehicle data at higher speeds, maintaining optimal thermal conditions is paramount to preserving component reliability and longevity.

Bergquist Liqui Form TLF 6500 CGel-SF sets a new benchmark in heat dissipation with an exceptional conductivity rating of 6.5W/(m·K). This advanced gel not only ensures efficient thermal transfer by filling air voids and bridging irregular gaps but also minimizes mechanical stress on sensitive electronic assemblies. Its one-part, easy-to-dispense formulation streamlines production processes, making it compatible with just-in-time manufacturing while significantly reducing the risk of thermal degradation and subsequent component failure.

“ADAS systems are evolving rapidly, and as safety standards and OEM expectations grow, so does the challenge of managing the heat generated by these sophisticated domain controllers,” explained Nancy Yang, Business Development Manager for Automotive Electronics North America at Henkel. “Our new thermal gel has been meticulously engineered to handle the high heat loads produced by next-generation vehicle platforms, some of which process up to 4.5 terabytes of data per hour. It applies with minimal stress, ensuring that even the most delicate components are safeguarded against thermal failure.”

In addition to its high performance, Bergquist Liqui Form TLF 6500 CGel-SF aligns with Henkel’s commitment to sustainability. The product is low in volatile organic compounds (VOCs), free from D4-D10 chemicals, and exhibits extremely low oil bleeding. These environmentally conscious attributes not only protect production line operators and sensitive optical components—such as camera lenses in radar and lidar systems—but also support the industry’s broader move toward greener manufacturing practices.

Media contact:

Sebastian Hinz
Adhesive Technologies
Media Relations
Headquarters, Düsseldorf/Germany
+49-211-797-8594
press@henkel.com

SOURCE: HENKEL