Henkel Showcases Sustainable and High-Performance Electronics Materials for Automotive, Industrial, and Telecom Sectors at Productronica 2025

Henkel showcases next-generation electronic solutions for different industry segments at Productronica.

(IN BRIEF) Henkel will showcase its latest innovations in EMI shielding, thermal management, debonding, and pad printing at Productronica 2025 in Munich, emphasizing sustainability, digitalization, and reliability in electronics manufacturing. The company will launch a new EMI shielding film for automotive applications, introduce debonding-on-demand technologies for circularity, and highlight high-performance thermal gap fillers. Henkel’s portfolio extends across automotive, industrial, telecom, and aviation sectors, featuring solutions like Loctite Stycast CC 8555 and US 8000AB. The company will also present advancements in digital engineering, testing, and printed electronics, including a live session by Anna Ryzhova on scalable pad printing. Henkel’s comprehensive approach positions it as a leading innovator driving efficiency and sustainability across the global electronics industry.

(PRESS RELEASE) DÜSSELDORF, 6-Oct-2025 — /EuropaWire/ — Henkel will take center stage at Productronica 2025, the world’s premier trade fair for electronics development and manufacturing, held from November 18 to 21 at Messe München, Germany. The company will present a comprehensive range of next-generation materials and technologies for electronics assembly and PCB protection, focusing on key areas such as electromagnetic interference (EMI) shielding, thermal management, debonding, and pad printing. With sustainability, performance, and reliability as central themes, Henkel continues to strengthen its position as a trusted innovation partner across the electronics value chain.

At Booth 321 in Hall B3, Henkel will unveil its new EMI shielding film, a cost-efficient and high-performance alternative to traditional metal housings. Designed to meet the growing complexity of automotive electronics, the film delivers superior EMI noise control and simplifies production processes. Alongside this, the company will highlight its debonding-on-demand technologies that enable safe, non-destructive disassembly for improved recyclability and circularity, as well as new thermal gap fillers engineered for next-generation automotive systems.

“The automotive industry is transforming at an unprecedented pace,” said Bart Van Eeghem, Business Development Manager, Automotive Electronics at Henkel. “Our innovations in EMI shielding, debonding, and thermal management directly address these challenges, helping manufacturers achieve higher efficiency, safety, and sustainability.”

Henkel’s exhibit will also spotlight its growing digital engineering and test capabilities, including advanced Battery Engineering Centers and EMI testing facilities that accelerate product validation. Using modeling and simulation tools, Henkel enables digital twin development and material validation—shortening design cycles and speeding up time-to-market for new electronic solutions.

Beyond the automotive sector, Henkel will showcase materials that enhance performance and reliability across industrial, telecom, and aviation applications. In industrial power, the company will feature its award-winning Loctite Stycast CC 8555 conformal coating, offering robust PCB protection from moisture and chemicals, and the newly certified Loctite Stycast US 8000AB potting compound, designed for extreme thermal stability in harsh environments.

In the data and telecom segment, Henkel will highlight its portfolio of Thermal Interface Materials (TIMs) for a wide range of bondline thicknesses, including advanced 1K pre-cured gels, 2K curable gap fillers, and phase change materials. For aerospace, visitors can explore Henkel’s high-reliability thermal and electronic materials demonstrated through a radar module display.

“We are dedicated to supporting long-term reliability and performance in advanced electronics systems across industries,” said Mahmoud Awwad, Business Development Manager for Power and Industrial Automation. “Our materials are designed to empower applications in automation, transport, data, and industrial power.”

On November 20, Henkel’s Anna Ryzhova, Business Development Manager for Printed Antenna Applications, will host a presentation titled “Functionalizing 3D Parts with Precision: Pad Printing as a Scalable Alternative Manufacturing Technology” (Hall B2, 2:25 – 3:05 pm). She will highlight how pad printing enables functionalization, miniaturization, and efficient integration of conductive materials into 3D-shaped components—offering a scalable alternative for the future of printed electronics.

“Printed electronics continues to redefine the electronics industry by providing sustainable and cost-effective innovations each year,” said Ryzhova. “Pad printing is emerging as a versatile technology that meets growing demands for miniaturization and functionalization in complex 3D parts.”

By combining advanced materials, digital engineering, and global expertise, Henkel is helping shape the next generation of electronics—empowering safer, smarter, and more sustainable technologies for industries worldwide.

Media Contact:

Sebastian Hinz
Phone: +49 211 797-58 94
Email: sebastian.hinz@henkel.com

SOURCE: Henkel AG & Co. KGaA