STMicroelectronics Unveils Next-Gen Optical Interconnect Technologies to Drive AI Growth and Energy Efficiency

STMicroelectronics Unveils Next-Gen Optical Interconnect Technologies to Drive AI Growth and Energy Efficiency

(IN BRIEF) STMicroelectronics has unveiled its new silicon photonics and BiCMOS technologies to meet the growing demands of AI and datacenter interconnects. With a focus on energy-efficient, high-speed solutions, these innovations are set to power the next generation of optical modules for hyperscalers, offering 800Gb/s and 1.6Tb/s performance. The technologies will be produced in ST’s 300mm fabs in Europe and are expected to play a key role in the rapidly expanding optical module market.

(PRESS RELEASE) GENEVA, 20-Feb-2025 — /EuropaWire/ — STMicroelectronics (NYSE: STM), a global leader in semiconductor solutions, has introduced its cutting-edge proprietary technologies designed to enhance the performance of optical interconnects for datacenters and AI clusters. As demand for AI computing soars, the need for faster and more energy-efficient interconnections between computing resources, memory, and power systems has become crucial. In response, ST is partnering with leading optical module providers to address these challenges, unveiling new silicon photonics and next-generation BiCMOS technologies. These innovations are set to power the 800Gb/s and 1.6Tb/s optical modules that will be crucial for hyperscalers and other large-scale AI operations, with deployment expected to begin in the second half of 2025.

Addressing AI Demands with High-Speed Optical Interconnects
At the core of datacenter interconnections lie optical transceivers, which convert optical signals to electrical ones and vice versa, facilitating seamless data transfer between GPUs, switches, and storage devices. ST’s new silicon photonics (SiPho) technology offers the ability to integrate multiple components into a single chip, while its next-generation BiCMOS technology ensures ultra-high-speed, low-power optical connectivity—critical for meeting the growing demands of AI and high-performance computing.

“AI-driven demand is accelerating the need for high-speed communication technology across the datacenter ecosystem. This is the ideal moment for ST to introduce its energy-efficient silicon photonics solutions alongside a new BiCMOS generation to help our customers design next-generation optical interconnect products capable of delivering 800Gbps and 1.6Tbps solutions for hyperscalers,” said Remi El-Ouazzane, President of STMicroelectronics’ Microcontrollers, Digital ICs, and RF Products Group. “Both of these technologies will be produced using 300mm processes in Europe, providing our customers with an independent, high-volume supply for two critical components in the development of their optical module strategies.”

Collaborating with Industry Leaders to Shape the Future
ST’s collaboration with Amazon Web Services (AWS) marks a key step in advancing the potential of silicon photonics technology. AWS is working with ST to develop the PIC100, a new silicon photonics technology designed to interconnect workloads, including AI applications. “We are excited to work with STMicroelectronics to push the boundaries of silicon photonics and unlock the innovations that will shape the future of AI interconnects,” said Nafea Bshara, Vice President and Distinguished Engineer at AWS.

A Rapidly Expanding Market
The pluggable optics market is experiencing remarkable growth, valued at $7 billion in 2024 and projected to exceed $24 billion by 2030, with a compound annual growth rate (CAGR) of 23%. According to Dr. Vladimir Kozlov, CEO and Chief Analyst at LightCounting, silicon photonics modulators will account for an increasing share of the market, growing from 30% in 2024 to 60% by 2030.

ST’s Role in Advancing Optical Technology
ST’s SiPho and BiCMOS technologies are being industrialized on a 300mm silicon platform, which will be manufactured at ST’s Crolles facility in France. The combination of these two technologies sets ST apart as a key player in the optical market, offering a unique and scalable solution for the future of AI and high-speed communication.

For more technical details on ST’s BiCMOS and silicon photonics technologies, visit ST.com. For further insights, read the blog post on ST’s PIC100 technology.

Additional information
ST’s SiPho technology combined with the ST BiCMOS technology are a unique 300mm silicon platform to serve the optical market. Both technologies are being industrialized and will be manufactured in ST’s Crolles (France/Europe) 300mm fab.

About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.

Media Contacts:

Media Relation:
Alexis Breton
Corporate External Communications
Tel: +33.6.59.16.79.08
alexis.breton@st.com

Investor Relation:

Jérôme Ramel
EVP Corporate Development & Integrated External Communication
Tel: +41.22.929.59.20
jerome.ramel@st.com

SOURCE: STMicroelectronics