(IN BRIEF) Infineon Technologies AG has launched the AIROC™ CYW5591x Connected Microcontroller (MCU) product family, featuring Wi-Fi 6/6E and Bluetooth® Low Energy 5.4, to create efficient and compact IoT devices. This new MCU family supports rapid development with Infineon’s ModusToolbox™ … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Technology
Tagged AIROC CYW5591x, alpha customers, Arm Cortex M33, AzureWave, Bluetooth Low Energy 5.4, Bluetooth stack, Cloud, Connected Microcontroller, connectivity, development, GPIO, Industrial, Infineon Technologies AG, IoT devices, Linux host drivers, low-power solutions, Masatomo Hashimoto, Mason Lin, Matter software, MCU, ModusToolbox, Murata, Patrick Lin, Peripherals, RTOS, SECURITY, Sivaram Trikutam, smart home, USI, wearables, Wi-Fi 6, Wi-Fi 6E, wireless performance
(IN BRIEF) Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has announced its decision, approved by the Supervisory Board, to acquire up to 7,000,000 shares via the stock exchange, with a total purchase price of up to €300 million. The … Read the full press release
Posted in Financial, Germany, Industrial, Investment, Management, News, Technology
Tagged employee, Financial, Infineon Technologies AG, investment, Share Buyback Program
(IN BRIEF) Infineon Technologies AG recently wrapped up its 24th Annual General Meeting, conducted virtually and publicly broadcasted on the company’s website. Shareholders participated live, engaging in discussions and posing questions. Among the key outcomes, shareholders approved a dividend payment … Read the full press release
(IN BRIEF) Infineon Technologies has launched the XENSIV™ TLI5590-A6W magnetic position sensor, combining magnetic position sensing expertise with linearized tunnel magnetoresistance (TMR) technology. The sensor, suitable for linear and angular position detection, is qualified for industrial and consumer applications and … Read the full press release
(IN BRIEF) TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. have announced their joint investment in the European Semiconductor Manufacturing Company (ESMC) GmbH, situated in Dresden, Germany. The project aims to establish a 300 mm fab to … Read the full press release
Posted in Business, Construction, Electronics & Machinery, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, News, Technology
Tagged Collaborate, Dr. CC Wei, Dr. Stefan Hartung, Dresden, European Manufacturing Hub, European Semiconductor Manufacturing Company (ESMC), Infineon Technologies AG, Jochen Hanebeck, Kurt Sievers, NXP Semiconductors, partnership, Robert Bosch GmbH, TSMC
(IN BRIEF) Several leading semiconductor industry players, including Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP Semiconductors, and Qualcomm Technologies, Inc., have joined forces to establish a new company aimed at accelerating the adoption of the open-source RISC-V architecture … Read the full press release
Posted in Business, Electronics & Machinery, Germany, Industrial, Management, News, Technology
Tagged electronics industry, Fuel Innovation, Infineon, Infineon Technologies AG, Jens Fabrowsky, Lars Reger, Nordic Semiconductor, NXP Semiconductors, partnership, Peter Schiefer, Qualcomm Technologies, RISC-V, Robert Bosch GmbH, Semiconductor Giants, Svein-Egil Nielsen, Ziad Asghar
(IN BRIEF) Infineon Technologies has launched CALYPSO move, the first secured memory for simple contactless ticketing based on the Calypso basic specification. The technology aims to address the need for sustainable, convenient, and interoperable ticketing solutions in the rapidly expanding … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Infrastructure & Utilities, Technology, Transportation & Logistics
Tagged AFC, Automatic Fare Collection, Calypso Networks Association, Calypso®, CALYPSO™ move, CNA, contactless ticketing based, digital ticketing, Infineon Technologies AG, Paulo Barreto, public transport operators, smart mobility, ticketing solutions, Tolgahan Yildiz
(IN BRIEF) Infineon Technologies AG has released its range of CoolGaN devices to the broader market, following the successful integration of the CoolGaN 600 V HD-GIT technology into its in-house manufacturing. The expanded GaN portfolio includes a wide range of … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Technology
Tagged adapters, chargers, CoolGaN™ 600 V, GaN devices, HD-GIT, hybrid-drain-embedded gate injection transistor, Infineon Technologies AG, JEDEC standards, JESD22, JESD47, led lighting systems, motor drives, PCIM Europe 2023, servers, TV/monitor
(IN BRIEF) Infineon Technologies AG has launched its latest generation of power MOSFETs for automotive applications, called the OptiMOS 7 40V MOSFET family. These MOSFETs combine thin-wafer technology with innovative packaging to deliver significant performance benefits in tiny packages, making … Read the full press release
(IN BRIEF) Infineon Technologies and Schweizer Electronic are working on a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB) in order to increase the efficiency of chips based on silicon carbide (SiC). The companies … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Germany, Industrial, Marketing, Technology
Tagged 1200 V CoolSiC™ chips, chip embedding, electric vehicles, Infineon Technologies AG, PCB, PCIM Europe 2023, printed circuit boards, p²Pack®, Robert Hermann, Schweizer Electronic AG, semiconductors, SIC, silicon carbide, Thomas Gottwald
(NOTICIA EN BREVE) Infineon Technologies está listo para exhibir una gama de soluciones de energía de alto rendimiento y eficiencia energética en la Conferencia de Electrónica de Potencia Aplicada 2023 en Orlando. La cartera de productos de la empresa de … Read the full press release
Posted in Electronics & Machinery, Energy, Gas & Oil, Environment, Germany, Industrial, Marketing, Technology
Tagged almacenamiento de energía, APEC, banda prohibida amplia, carga de vehículos eléctricos, centros de datos, Conferencia de electrónica de potencia aplicada de 2023, control de motores, controladores de puente, descarbonización, digitalización, dispositivos electrónicos de potencia, Infineon, Infineon Technologies AG, MOSFET, puentes integrados, silicio, soluciones de energía
(IN BRIEF) Infineon Technologies is set to showcase a range of high-performance and energy-efficient power solutions at the 2023 Applied Power Electronics Conference in Orlando. The company’s product portfolio of advanced silicon and wide bandgap materials will be highlighted to … Read the full press release
Posted in Electronics & Machinery, Energy, Gas & Oil, Environment, Germany, Industrial, Marketing, Technology
Tagged 2023 Applied Power Electronics Conference, APEC, bridge drivers, data centers, decarbonization, digitalization, energy storage, EV charging, Infineon, Infineon Technologies AG, Integrated Bridges, MOSFETs, Motor Control, power electronic devices, power solutions, silicon, wide bandgap
(NOTICIA EN BREVE) Infineon Technologies AG y Apex.AI han anunciado una asociación para desarrollar conjuntamente una plataforma que acelerará el desarrollo de software para clientes automotrices. La colaboración integrará el kit de desarrollo de software de Apex.AI y el microcontrolador … Read the full press release
Posted in Automotive, Electronics & Machinery, Germany, Industrial, Technology
Tagged Apex.AI, Apex.Grace, Apex.Ida, Apex.Middleware, Apex.OS, aplicaciones autónomas, AURIX™ TC3X, certificación ASIL D, conducción automatizada, controladores de seguridad, Dr. Jan Becker, Infineon Technologies AG, ISO 262626 ASIL D, microcontrolador, movilidad, norma ISO 26262, ROS, sistema operativo de robot, software con certificación de seguridad, Thomas Schneid
(IN BRIEF) Infineon Technologies AG and Apex.AI have announced a partnership to co-develop a platform that will accelerate software development for automotive customers. The collaboration will integrate Apex.AI’s software development kit and Infineon’s AURIX™ TC3X microcontroller to expedite the integration … Read the full press release
Posted in Automotive, Electronics & Machinery, Germany, Industrial, Technology
Tagged Apex.AI, Apex.Grace, Apex.Ida, Apex.Middleware, Apex.OS, ASIL D certification, AURIX™ TC3X, automated driving, autonomous applications, Dr. Jan Becker, Infineon Technologies AG, ISO 26262 standard, ISO 262626 ASIL D, microcontroller, mobility, Robot Operating System, ROS, safety controllers, safety-certified software, Thomas Schneid
(ACTUALITÉ EN BREF) Infineon dirige un consortium de 30 partenaires de recherche dans le développement d’une plate-forme de supercalcul automobile pour les futurs véhicules hautement automatisés. Le projet de recherche, appelé Mannheim-CeCaS, étudiera le développement d’une plate-forme informatique centrale holistique … Read the full press release
Posted in Automotive, Germany, Industrial, Technology, Transportation & Logistics
Tagged Ambrosys, ASIL-D, auto-mobilité, auto-mobility, automated connected vehicles, automotive qualification, automotive supercomputing, Autonomous Vehicles, AVL Software & Functions, Berliner Nanotest und Design, BMBF, Bosch, CentralCarServer, Chemnitz University of Technology, Continental, Continental Automotive, FinFET, Fraunhofer ENAS, Fraunhofer Institutes, FZI Research Center for Information Technology, Glück Engineering, Hella, IMWS, Inchron, Infineon, Infineon Technologies AG, Institut de technologie de Karlsruhe, Instituts Fraunhofer, IPMS, IZM, Karlsruhe Institute of Technology, Karlsruhe Institute of Technology (KIT), Kernkonzept, LIS and SEC), Mannheim-CeCaS, Missing Link Electronics, Munich University of Applied Sciences, Peter Schiefer, qualification automobile, Steinbeis ZFW, STTech, supercalcul automobile, Swissbit Allemagne, Swissbit Germany, Technical University of Munich (AIR, TU Munich, Universität zu Lübeck, véhicules autonomes, véhicules connectés automatisés, ZF Friedrichshafen
(IN BRIEF) Infineon is leading a consortium of 30 research partners in the development of an automotive supercomputing platform for future highly-automated vehicles. The research project, called Mannheim-CeCaS, will investigate the development of a holistic central computing platform to provide … Read the full press release
Posted in Automotive, Germany, Industrial, Technology, Transportation & Logistics
Tagged Ambrosys, ASIL-D, auto-mobility, automated connected vehicles, automotive qualification, automotive supercomputing, Autonomous Vehicles, AVL Software & Functions, Berliner Nanotest und Design, BMBF, Bosch, CentralCarServer, Chemnitz University of Technology, Continental, Continental Automotive, FinFET, Fraunhofer ENAS, Fraunhofer Institutes, FZI Research Center for Information Technology, Glück Engineering, Hella, IMWS, Inchron, Infineon, Infineon Technologies AG, IPMS, IZM, Karlsruhe Institute of Technology, Karlsruhe Institute of Technology (KIT), Kernkonzept, LIS and SEC), Mannheim-CeCaS, Missing Link Electronics, Munich University of Applied Sciences, Peter Schiefer, Steinbeis ZFW, STTech, Swissbit Germany, Technical University of Munich (AIR, TU Munich, Universität zu Lübeck, ZF Friedrichshafen
(ACTUALITÉ EN BREF) Infineon Technologies a annoncé la construction d’une nouvelle usine à Dresde pour les technologies à signaux analogiques/mixtes et les semi-conducteurs de puissance. Le ministère fédéral allemand des affaires économiques et de l’action pour le climat a approuvé … Read the full press release
(IN BRIEF) Infineon Technologies has announced the construction of a new plant in Dresden for analog/mixed-signal technologies and power semiconductors. The German Federal Ministry for Economic Affairs and Climate Action has approved the early project launch, enabling construction to begin … Read the full press release
(PRESS RELEASE) MUNICH, 29-Dec-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, is extending its collaboration with Rainforest Connection, a NGO focused on preventing rainforest deforestation. The partners are using modern sensor technology … Read the full press release
Posted in Environment, Germany, Industrial, Management, News, Technology
Tagged Adrian Mikolajczak, artificial-intelligence, biodiversity, Bourhan Yassin, CES 2023, climate change, Consumer Electronics Show, Guardian devices, illegal deforestation, Infineon Technologies AG, NGO, Rainforest Connection, rainforest preservation, rainforests, RFCx, sensor, solar electricity, wildfires, XENSIV™ PAS CO2 sensor
(COMMUNIQUÉ DE PRESSE) MUNICH, 29-Dec-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), un fabricant allemand de semi-conducteurs, étend sa collaboration avec Rainforest Connection, une ONG axée sur la prévention de la déforestation des forêts tropicales. Les … Read the full press release
Posted in Environment, Germany, Industrial, Management, Technology
Tagged Adrian Mikolajczak, biodiversité, Bourhan Yassin, capteur, capteur de CO2 XENSIV™ PAS, CES 2023, changement climatique, Consommateur Salon de l'électronique, déforestation illégale, dispositifs Guardian, électricité solaire, forêts tropicales, incendies de forêt, Infineon Technologies AG, intelligence artificielle, ONG, préservation de la forêt tropicale, Rainforest Connection, RFCx
(PRESS RELEASE) MUNICH, 14-Nov-2022 — /EuropaWire/ — Siemens AG (ETR: SIE), a German multinational conglomerate and Europe’s largest industrial manufacturing company, has announced that Microsoft (NASDAQ: MSFT), an American multinational technology company that develops, licenses, and supports software, services, devices, … Read the full press release
Posted in Business, Germany, Industrial, Infrastructure & Utilities, Internet & Online, Management, Security & Safety, Technology
Tagged AES, Airbus, Allianz, Atos, Bosch, Cedrik Neike, Charter of Trust, CoT, Cybersecurity, cybersecurity initiative, Dell Technologies, Deutsche Post DHL Group, Digital Engineering GmbH, HPI, IBM, Infineon Technologies AG, Microsoft, Mitsubishi Heavy Industries, NTT, NXP Semiconductors, SGS, Siemens, Tom Burt, TotalEnergies, TÜV SÜD
(PRESS RELEASE) MUNICH/ BERLIN, 11-Aug-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced the expansion of its expertise in the area of AI powered predictive analysis for industrial machinery and equipment … Read the full press release
(COMMUNIQUÉ DE PRESSE) MUNICH/ BERLIN, 11-Aug-2022 — /EuropaWire/ — Infineon Technologies AG (FSE : IFX / OTCQX : IFNNY), un semi-conducteur allemand a annoncé l’expansion de son expertise dans le domaine de l’analyse prédictive alimentée par l’IA pour les machines et équipements … Read the full press release
Posted in Business, Germany, Industrial, Investment, Management, Technology
Tagged AI solutions, analyse prédictive, Anja Vedder, artificial intelligence, Industrial Analytics, Infineon Technologies AG, intelligence artificielle, logiciel, Peter Wawer, predictive analysis, semi-conducteur, semiconductor, software, startup
(PRESS RELEASE) MUNICH, 11-Aug-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced its participation at IFA 2022, the most inspiring trade show for consumer electronics and home appliances, taking place in … Read the full press release
Posted in Business, Financial, Germany, Industrial, Management, Marketing, News, Security & Safety, Technology
Tagged biometrics, contactless payments, digital payments, digital wallets, EMV® certification, IFA 2022, Infineon Technologies AG, Internet of Things, Ioannis Kabitoglou, IoT, mobile payments, SECORA™ Connect, SECORA™ Pay
(COMMUNIQUÉ DE PRESSE) MUNICH, 11-Aug-2022 — /EuropaWire/ — Infineon Technologies AG (FSE : IFX / OTCQX : IFNNY), un semi-conducteur allemand fabricant, a annoncé sa participation à IFA 2022, le salon le plus inspirant pour l’électronique grand public et les appareils électroménagers, … Read the full press release
Posted in Business, Financial, Germany, Industrial, Management, Marketing, News, Security & Safety, Technology
Tagged biometrics, biométrie, certification EMV®, contactless payments, digital payments, digital wallets, EMV® certification, IFA 2022, Infineon Technologies AG, Internet des objets, Internet of Things, Ioannis Kabitoglou, IoT, mobile payments, Paiements mobiles, paiements numériques, paiements sans contact, portefeuilles numériques, SECORA™ Connect, SECORA™ Pay
(COMMUNIQUÉ DE PRESSE) MUNICH, 18-Mar-2022 — /EuropaWire/ — Infineon Technologies AG (FSE : IFX / OTCQX : IFNNY), un semi-conducteur allemand fabricant, a annoncé l’introduction de sa nouvelle famille de produits EiceDRIVER™ 2EDN destinée aux conceptions à espace limité. Les dispositifs de … Read the full press release
(PRESS RELEASE) MUNICH, 18-Mar-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced the introduction of its new EiceDRIVER™ 2EDN product family aimed at space-limited designs. The next-generation devices complement the existing … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Technology
Tagged 2EDN, 2EDN driver ICs, EiceDRIVER™ 2EDN, gate driver, Infineon Technologies AG, SWITCH, switching devices
(COMMUNIQUÉ DE PRESSE) MUNICH, 11-Mar-2022 — /EuropaWire/ — Infineon Technologies AG (FSE : IFX / OTCQX : IFNNY), un semi-conducteur allemand fabricant, a annoncé qu’une estimation automatisée de la durée de vie a été ajoutée à sa plate-forme de simulation de puissance … Read the full press release
(PRESS RELEASE) MUNICH, 11-Mar-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced that an automated lifetime estimation has been added to its Power Simulation platform (IPOSIM) aimed at simplifying the selection … Read the full press release
Le forum de confiance numérique et la charte de confiance vont fusionner Bosch et Deutsche Post DHL Group rejoignent la Charte de confiance Le forum des partenaires associés continue de croître avec CyberNB, le Cyber Peace Institute, le Cyber Readiness … Read the full press release
Posted in Business, Germany, Industrial, Infrastructure & Utilities, Management, News, Security & Safety, Technology
Tagged AES, Airbus, Allianz, Allianz Risk Barometer, Atos, Bosch, BSI, CCN, Cedrik Neike, CoT, Cyber Peace Institute, Cyber Readiness Institute, cyber-risque, Cybercrime, CyberNB, cybersécurité, cybersecurity initiative, David Thornewill, Dell Technologies, Deutsche Post DHL Group, Digital Trust Forum, digitalisation, Dr. Tanja Rückert, DTF, Global Cyber Alliance, HPI, IBM, Infineon Technologies AG, Institut Hasso Plattner, intelligence artificielle, METI, Mitsubishi Heavy Industries, Munich Security Conference, NTT, NXP Semiconductors, SGS, supply chain, The Charter of Trust, TotalEnergies, TU Graz, TÜV SÜD
Digital Trust Forum and Charter of Trust to merge Bosch and Deutsche Post DHL Group join Charter of Trust Associated Partner Forum further growing with CyberNB, Cyber Peace Institute, Cyber Readiness Institute and Global Cyber Alliance (PRESS RELEASE) MUNICH, 16-Feb-2022 … Read the full press release
Posted in Business, Germany, Industrial, Infrastructure & Utilities, Management, Security & Safety, Technology
Tagged AES, Airbus, Allianz, Allianz Risk Barometer, artificial-intelligence, Associated Partner Forum, Atos, Bosch, BSI, Canadian Centre for Cybersecurity, CCN, Cedrik Neike, CoT, Cyber Peace Institute, Cyber Readiness Institute, cyber risk, Cybercrime, CyberNB, Cybersecurity, cybersecurity initiative, David Thornewill, Dell Technologies, Deutsche Post DHL Group, Digital Trust Forum, digitalization, Dr. Tanja Rückert, DTF, Federal Office for Information Security, Global Cyber Alliance, Hasso Plattner Institute, HPI, IBM, Infineon Technologies AG, METI, Mitsubishi Heavy Industries, Munich Security Conference, NTT, NXP Semiconductors, SGS, Spanish National Cryptologic Center, supply chain, Supply Chain Security, The Charter of Trust, TotalEnergies, TU Graz, TÜV SÜD
(COMMUNIQUÉ DE PRESSE) MUNICH, 14-Feb-2022 — /EuropaWire/ — Infineon Technologies AG (FSE : IFX / OTCQX : IFNNY), un fabricant allemand de semi-conducteurs, a annoncé qu’il allait lancer des semi-conducteurs de puissance avec CoolSiC™ MOSFET et la technologie .XT dans le package … Read the full press release
Posted in Automotive, Germany, Industrial, Infrastructure & Utilities, News, Technology, Transportation & Logistics
Tagged carbure de silicium, combustibles fossiles, CoolSiC™ MOSFET, d mobilité verte, Dr. Peter Wawer, Infineon Technologies AG, PINTA, rail, semi-conducteurs, SIC, Siemens Mobility, Stadtwerke München, Stefan Schönewolf, technologie .XT, trains, tramway Avenio, XHP™ 2
(PRESS RELEASE) MUNICH, 14-Feb-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced it will launch power semiconductors with CoolSiC™ MOSFET and .XT technology in the XHP™ 2 package in support of … Read the full press release
Posted in Automotive, Germany, Industrial, Infrastructure & Utilities, Technology, Transportation & Logistics
Tagged .XT technology, Avenio streetcar, CoolSiC™ MOSFET, d green mobility, Dr. Peter Wawer, fossil fuels, Infineon Technologies AG, PINTA, rail, semiconductors, SIC, Siemens Mobility, silicon carbide, Stadtwerke München, Stefan Schönewolf, trains, XHP™ 2
(PRESS RELEASE) MUNICH, 4-Jan-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced the launch of its new AIROC™ CYW20829 Bluetooth® LE system on chip (SoC), a Bluetooth 5.3 core spec-compliant device … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Internet & Online, News, Technology
Tagged AIROC CYW20829 Bluetooth LE SoC, AIROC™, ARM® Cortex® M33, Bluetooth, Bluetooth 5.3, Bluetooth LE-connected, Bluetooth Low Energy, Bluetooth Mesh, chip, CYW20829, CYW20829 Bluetooth®, home automation, human interface devices, industrial applications, Infineon Technologies AG, IoT, IoT application, LE system, lighting, ModusToolbox™, remote controls, Sensors, smart home, Sonal Chandrasekharan, Wi-Fi®, Wireless
(PRESS RELEASE) MUNICH, 8-Dec-2021 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced it partnered with MK Smart, a subsidiary of MK Group, leading provider of Digital Security solutions and Smart Card … Read the full press release
Posted in Germany, Government, News, Security & Safety, Technology
Tagged biometrics, chip, digital signing, digitalization, e-ID data, eID, eID document, electronic ID, ICAO-compliant, Infineon Technologies AG, MK Group, MK Smart, national ID card, security chip, SLC37 security, Smart Cards, Vietnam
(PRESS RELEASE) MUNICH, 27-Oct-2021 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced the launch of its first automotive current sensor. The coreless current sensor, the new XENSIV™ TLE4972, will use Infineon’s … Read the full press release
Posted in Automotive, Germany, Industrial, News, Technology
Tagged automotive current sensor, battery main switches, battery-driven vehicles, Hall technology, Hybrid, Infineon, Infineon Technologies AG, PG-TDSO-16, PG-VSON-6, sensor, TLE4972, TLE4972-AE35S5, traction inverters, XENSIV TLE4972-AE35D5, XENSIV™ TLE4972, xEV applications
(PRESS RELEASE) MUNICH/ SEOUL/ SINGAPORE, 27-Oct-2021 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced a new partnership with Hyundai Motor Group (Hyundai) aimed at helping starts up successfully deal with the … Read the full press release
Posted in Artificial Intelligence (AI), Automotive, Germany, Industrial, News, Technology, Transportation & Logistics
Tagged academics, Actuators, artificial-intelligence, conferences, corporate innovators, digital transformation, digitalization, Dr. Helmut Gassel, Dr. Youngcho Chi, electrification, future mobility, Hyundai, Hyundai CRADLE, Hyundai Motor Group, Infineon Technologies AG, Internet of Things, investors, Manufacturing, microcontrollers, mobility, OktoberTech, Oktobertech Asia Pacific 2021, policymakers, robotics, SECURITY, semiconductors, Sensors, Smart Cities, smart factory, Startups, urban air mobility
(PRESS RELEASE) MUNICH, 6-Sep-2021 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced the launch of new current ratings for its EconoDUAL™ 3 portfolio with TRENCHSTOP™ IGBT7 chips. With the broad range … Read the full press release
(PRESS RELEASE) MUNICH, 19-Aug-2021 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, has announced it will coordinate the research project called VE-VIDES which stands for “Design methods and hardware/software co-verification for the unique … Read the full press release
Posted in Education, Electronics & Machinery, Germany, Industrial, Internet & Online, News, Security & Safety, Technology
Tagged CARIAD SE, Chemnitz University of Technology, CVE-MITRE, cyber-security, data, Djones Lettnin, edacentrum GmbH, electronics, firmware, Fraunhofer Institute for Integrated Circuits IIS, hacking, hardware, IMMS GmbH, Infineon Technologies AG, Internet of Things, OFFIS e.V., OneSpin, optical attacks, physical attacks, research project, Robert Bosch GmbH, Siemens AG, software, software components, Synopsys GmbH, trustworthiness, Trustworthy Electronics, Ulm University, VE-VIDES, X-FAB Global Services GmbH
(PRESS RELEASE) MUNICH, 18-Feb-2021 — /EuropaWire/ — From 1-5 March 2021, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will be showcasing its comprehensive IoT portfolio for the first time at the virtual Embedded Solutions Conference 2021 (ESC21). The acquisition … Read the full press release
Posted in Artificial Intelligence (AI), Automotive, Germany, Industrial, Infrastructure & Utilities, Internet & Online, Marketing, News, Security & Safety, Technology
Tagged advanced driver assistance, ARM, artificial-intelligence, AURIX™ microcontrollers, automated driving, automotive microcontrollers, connected age, connected mobility, connectivity components, Cortex, Cypress, data infrastructure, digital world, Embedded Solutions Conference 2021, ESC21, eSIM, hardware, ICT security, iMOTION™, Infineon, Infineon Technologies AG, IoT, IoT devices, M4F, M7F architecture, microcontroller, microcontrollers, OPTIGA™ TPM, OPTIGA™ TPM SLI 9670, OPTIGA™ Trust, security sensor, security solutions, semiconductor manufacturers, semiconductors, Sensors, smart building, smart car, smart device, smart factory, smart home, Smart Things, software, software ecosystems, software tools, telematics, TRAVEO™, virtual trade shows, XENSIV™ sensors, XMC™ microcontrollers
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