(IN BRIEF) Infineon Technologies AG has launched the OPTIGA™ Connect Consumer OC1230, a cutting-edge eSIM solution designed to reduce energy consumption by 50% compared to existing models, extending battery life while maintaining high performance. This compact, GSMA-compliant eSIM is ideal … Read the full press release
Posted in Electronics & Machinery, Germany, Technology
Tagged 28 nm eSIM solution, 5G routers, Arm® v8, battery life, BSI-CC-PP-0100-2018, chip-scale packaging, energy consumption, flexibility, GSMA SGP.22 v3, GSMA-compliant, Infineon Technologies AG, Integrity Guard 32, IoT applications, mobile network profiles, multiple profiles, OPTIGA Connect Consumer OC1230, PCB space, POS payment terminals, power/performance ratio, PQC, remote management, remote SIM provisioning, SECURITY, SIM card, Smartphone, smartphones, wearables, X2QFN20 package
(IN BRIEF) Infineon Technologies AG has launched the AIROC™ CYW5591x Connected Microcontroller (MCU) product family, featuring Wi-Fi 6/6E and Bluetooth® Low Energy 5.4, to create efficient and compact IoT devices. This new MCU family supports rapid development with Infineon’s ModusToolbox™ … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Technology
Tagged AIROC CYW5591x, alpha customers, Arm Cortex M33, AzureWave, Bluetooth Low Energy 5.4, Bluetooth stack, Cloud, Connected Microcontroller, connectivity, development, GPIO, Industrial, Infineon Technologies AG, IoT devices, Linux host drivers, low-power solutions, Masatomo Hashimoto, Mason Lin, Matter software, MCU, ModusToolbox, Murata, Patrick Lin, Peripherals, RTOS, SECURITY, Sivaram Trikutam, smart home, USI, wearables, Wi-Fi 6, Wi-Fi 6E, wireless performance
(IN BRIEF) Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has announced its decision, approved by the Supervisory Board, to acquire up to 7,000,000 shares via the stock exchange, with a total purchase price of up to €300 million. The … Read the full press release
Posted in Financial, Germany, Industrial, Investment, Management, News, Technology
Tagged employee, Financial, Infineon Technologies AG, investment, Share Buyback Program
(IN BRIEF) Infineon Technologies AG recently wrapped up its 24th Annual General Meeting, conducted virtually and publicly broadcasted on the company’s website. Shareholders participated live, engaging in discussions and posing questions. Among the key outcomes, shareholders approved a dividend payment … Read the full press release
(IN BRIEF) Infineon Technologies has launched the XENSIV™ TLI5590-A6W magnetic position sensor, combining magnetic position sensing expertise with linearized tunnel magnetoresistance (TMR) technology. The sensor, suitable for linear and angular position detection, is qualified for industrial and consumer applications and … Read the full press release
(IN BRIEF) TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. have announced their joint investment in the European Semiconductor Manufacturing Company (ESMC) GmbH, situated in Dresden, Germany. The project aims to establish a 300 mm fab to … Read the full press release
Posted in Business, Construction, Electronics & Machinery, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, News, Technology
Tagged Collaborate, Dr. CC Wei, Dr. Stefan Hartung, Dresden, European Manufacturing Hub, European Semiconductor Manufacturing Company (ESMC), Infineon Technologies AG, Jochen Hanebeck, Kurt Sievers, NXP Semiconductors, partnership, Robert Bosch GmbH, TSMC
(IN BRIEF) Several leading semiconductor industry players, including Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP Semiconductors, and Qualcomm Technologies, Inc., have joined forces to establish a new company aimed at accelerating the adoption of the open-source RISC-V architecture … Read the full press release
Posted in Business, Electronics & Machinery, Germany, Industrial, Management, News, Technology
Tagged electronics industry, Fuel Innovation, Infineon, Infineon Technologies AG, Jens Fabrowsky, Lars Reger, Nordic Semiconductor, NXP Semiconductors, partnership, Peter Schiefer, Qualcomm Technologies, RISC-V, Robert Bosch GmbH, Semiconductor Giants, Svein-Egil Nielsen, Ziad Asghar
(IN BRIEF) Infineon Technologies has launched CALYPSO move, the first secured memory for simple contactless ticketing based on the Calypso basic specification. The technology aims to address the need for sustainable, convenient, and interoperable ticketing solutions in the rapidly expanding … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Infrastructure & Utilities, Technology, Transportation & Logistics
Tagged AFC, Automatic Fare Collection, Calypso Networks Association, Calypso®, CALYPSO™ move, CNA, contactless ticketing based, digital ticketing, Infineon Technologies AG, Paulo Barreto, public transport operators, smart mobility, ticketing solutions, Tolgahan Yildiz
(IN BRIEF) Infineon Technologies AG has released its range of CoolGaN devices to the broader market, following the successful integration of the CoolGaN 600 V HD-GIT technology into its in-house manufacturing. The expanded GaN portfolio includes a wide range of … Read the full press release
Posted in Electronics & Machinery, Germany, Industrial, Technology
Tagged adapters, chargers, CoolGaN™ 600 V, GaN devices, HD-GIT, hybrid-drain-embedded gate injection transistor, Infineon Technologies AG, JEDEC standards, JESD22, JESD47, led lighting systems, motor drives, PCIM Europe 2023, servers, TV/monitor
(IN BRIEF) Infineon Technologies AG has launched its latest generation of power MOSFETs for automotive applications, called the OptiMOS 7 40V MOSFET family. These MOSFETs combine thin-wafer technology with innovative packaging to deliver significant performance benefits in tiny packages, making … Read the full press release
(IN BRIEF) Infineon Technologies and Schweizer Electronic are working on a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB) in order to increase the efficiency of chips based on silicon carbide (SiC). The companies … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Germany, Industrial, Marketing, Technology
Tagged 1200 V CoolSiC™ chips, chip embedding, electric vehicles, Infineon Technologies AG, PCB, PCIM Europe 2023, printed circuit boards, p²Pack®, Robert Hermann, Schweizer Electronic AG, semiconductors, SIC, silicon carbide, Thomas Gottwald
(NOTICIA EN BREVE) Infineon Technologies está listo para exhibir una gama de soluciones de energía de alto rendimiento y eficiencia energética en la Conferencia de Electrónica de Potencia Aplicada 2023 en Orlando. La cartera de productos de la empresa de … Read the full press release
Posted in Electronics & Machinery, Energy, Gas & Oil, Environment, Germany, Industrial, Marketing, Technology
Tagged almacenamiento de energía, APEC, banda prohibida amplia, carga de vehículos eléctricos, centros de datos, Conferencia de electrónica de potencia aplicada de 2023, control de motores, controladores de puente, descarbonización, digitalización, dispositivos electrónicos de potencia, Infineon, Infineon Technologies AG, MOSFET, puentes integrados, silicio, soluciones de energía
(IN BRIEF) Infineon Technologies is set to showcase a range of high-performance and energy-efficient power solutions at the 2023 Applied Power Electronics Conference in Orlando. The company’s product portfolio of advanced silicon and wide bandgap materials will be highlighted to … Read the full press release
Posted in Electronics & Machinery, Energy, Gas & Oil, Environment, Germany, Industrial, Marketing, Technology
Tagged 2023 Applied Power Electronics Conference, APEC, bridge drivers, data centers, decarbonization, digitalization, energy storage, EV charging, Infineon, Infineon Technologies AG, Integrated Bridges, MOSFETs, Motor Control, power electronic devices, power solutions, silicon, wide bandgap
(NOTICIA EN BREVE) Infineon Technologies AG y Apex.AI han anunciado una asociación para desarrollar conjuntamente una plataforma que acelerará el desarrollo de software para clientes automotrices. La colaboración integrará el kit de desarrollo de software de Apex.AI y el microcontrolador … Read the full press release
Posted in Automotive, Electronics & Machinery, Germany, Industrial, Technology
Tagged Apex.AI, Apex.Grace, Apex.Ida, Apex.Middleware, Apex.OS, aplicaciones autónomas, AURIX™ TC3X, certificación ASIL D, conducción automatizada, controladores de seguridad, Dr. Jan Becker, Infineon Technologies AG, ISO 262626 ASIL D, microcontrolador, movilidad, norma ISO 26262, ROS, sistema operativo de robot, software con certificación de seguridad, Thomas Schneid
(IN BRIEF) Infineon Technologies AG and Apex.AI have announced a partnership to co-develop a platform that will accelerate software development for automotive customers. The collaboration will integrate Apex.AI’s software development kit and Infineon’s AURIX™ TC3X microcontroller to expedite the integration … Read the full press release
Posted in Automotive, Electronics & Machinery, Germany, Industrial, Technology
Tagged Apex.AI, Apex.Grace, Apex.Ida, Apex.Middleware, Apex.OS, ASIL D certification, AURIX™ TC3X, automated driving, autonomous applications, Dr. Jan Becker, Infineon Technologies AG, ISO 26262 standard, ISO 262626 ASIL D, microcontroller, mobility, Robot Operating System, ROS, safety controllers, safety-certified software, Thomas Schneid
(ACTUALITÉ EN BREF) Infineon dirige un consortium de 30 partenaires de recherche dans le développement d’une plate-forme de supercalcul automobile pour les futurs véhicules hautement automatisés. Le projet de recherche, appelé Mannheim-CeCaS, étudiera le développement d’une plate-forme informatique centrale holistique … Read the full press release
Posted in Automotive, Germany, Industrial, Technology, Transportation & Logistics
Tagged Ambrosys, ASIL-D, auto-mobilité, auto-mobility, automated connected vehicles, automotive qualification, automotive supercomputing, Autonomous Vehicles, AVL Software & Functions, Berliner Nanotest und Design, BMBF, Bosch, CentralCarServer, Chemnitz University of Technology, Continental, Continental Automotive, FinFET, Fraunhofer ENAS, Fraunhofer Institutes, FZI Research Center for Information Technology, Glück Engineering, Hella, IMWS, Inchron, Infineon, Infineon Technologies AG, Institut de technologie de Karlsruhe, Instituts Fraunhofer, IPMS, IZM, Karlsruhe Institute of Technology, Karlsruhe Institute of Technology (KIT), Kernkonzept, LIS and SEC), Mannheim-CeCaS, Missing Link Electronics, Munich University of Applied Sciences, Peter Schiefer, qualification automobile, Steinbeis ZFW, STTech, supercalcul automobile, Swissbit Allemagne, Swissbit Germany, Technical University of Munich (AIR, TU Munich, Universität zu Lübeck, véhicules autonomes, véhicules connectés automatisés, ZF Friedrichshafen
(IN BRIEF) Infineon is leading a consortium of 30 research partners in the development of an automotive supercomputing platform for future highly-automated vehicles. The research project, called Mannheim-CeCaS, will investigate the development of a holistic central computing platform to provide … Read the full press release
Posted in Automotive, Germany, Industrial, Technology, Transportation & Logistics
Tagged Ambrosys, ASIL-D, auto-mobility, automated connected vehicles, automotive qualification, automotive supercomputing, Autonomous Vehicles, AVL Software & Functions, Berliner Nanotest und Design, BMBF, Bosch, CentralCarServer, Chemnitz University of Technology, Continental, Continental Automotive, FinFET, Fraunhofer ENAS, Fraunhofer Institutes, FZI Research Center for Information Technology, Glück Engineering, Hella, IMWS, Inchron, Infineon, Infineon Technologies AG, IPMS, IZM, Karlsruhe Institute of Technology, Karlsruhe Institute of Technology (KIT), Kernkonzept, LIS and SEC), Mannheim-CeCaS, Missing Link Electronics, Munich University of Applied Sciences, Peter Schiefer, Steinbeis ZFW, STTech, Swissbit Germany, Technical University of Munich (AIR, TU Munich, Universität zu Lübeck, ZF Friedrichshafen
(ACTUALITÉ EN BREF) Infineon Technologies a annoncé la construction d’une nouvelle usine à Dresde pour les technologies à signaux analogiques/mixtes et les semi-conducteurs de puissance. Le ministère fédéral allemand des affaires économiques et de l’action pour le climat a approuvé … Read the full press release
(IN BRIEF) Infineon Technologies has announced the construction of a new plant in Dresden for analog/mixed-signal technologies and power semiconductors. The German Federal Ministry for Economic Affairs and Climate Action has approved the early project launch, enabling construction to begin … Read the full press release
(PRESS RELEASE) MUNICH, 29-Dec-2022 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, is extending its collaboration with Rainforest Connection, a NGO focused on preventing rainforest deforestation. The partners are using modern sensor technology … Read the full press release
Posted in Environment, Germany, Industrial, Management, News, Technology
Tagged Adrian Mikolajczak, artificial-intelligence, biodiversity, Bourhan Yassin, CES 2023, climate change, Consumer Electronics Show, Guardian devices, illegal deforestation, Infineon Technologies AG, NGO, Rainforest Connection, rainforest preservation, rainforests, RFCx, sensor, solar electricity, wildfires, XENSIV™ PAS CO2 sensor
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