Tag Archives: Flip Chip CSP 0.4mm pitch package

STMicroelectronics announced large Asian manufacturer selected its latest Antenna-Tuning Circuit the STHVDAC-253M for new LTE smartphone

Users benefit from stronger reception, fewer dropped calls,faster downloads, and longer battery life Geneva, Switzerland, 24-2-2014 — /EuropaWire/ — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced that its latest Antenna-Tuning Circuit, … Read the full press release