Tag Archives: Coil-on-Module (CoM) portfolio

Infineon Technologies expands its internationally proven Coil-on-Module (CoM) portfolio with a complete solution for contactless ID documents

MUNICH, 29-Nov-2017 — /EuropaWire/ — The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in “Coil-on-Module” (CoM) packages offer significant advantages here. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now … Read the full press release