Henkel Launches High Thermal Conductivity Gap Filler to Advance Cooling Efficiency in 800G and 1.6T Optical Modules

Henkel has launched Loctite TCF 14001, a high thermal conductivity silicone liquid thermal interface material (TIM).

(IN BRIEF) Henkel has launched Loctite TCF 14001, a high-performance liquid thermal interface material designed for advanced optical transceivers used in AI data centers. Featuring a 14.5 W/m-K thermal conductivity — one of the highest among liquid TIMs — the formulation provides exceptional heat dissipation for 800G and 1.6T transceiver technologies. The two-part silicone material combines low volatility, minimal outgassing, and strong interface adhesion to maintain stability and protect against optical interference. Developed with scalability and process reliability in mind, Loctite TCF 14001 also supports applications across telecom, automotive, and industrial sectors, reinforcing Henkel’s commitment to innovation in thermal management for emerging high-power technologies.

(PRESS RELEASE) DÜSSELDORF, 28-Oct-2025 — /EuropaWire/ — Henkel has introduced Loctite TCF 14001, an advanced high thermal conductivity liquid thermal interface material (TIM) developed to meet the demanding cooling requirements of next-generation AI data center optical components. Engineered with a 14.5 W/m-K thermal conductivity, this innovative silicone-based gap filler stands among the highest-performing liquid TIMs currently available, delivering exceptional thermal management for high-power-density devices such as 800G, 1.6T, and coherent optical transceivers.

As AI-driven workloads continue to accelerate, data centers face significant challenges in managing bandwidth, latency, and heat within increasingly compact, high-speed optical architectures. Modern transceivers designed for extreme data throughput generate substantial thermal loads that, if not effectively managed, can limit performance and reliability. Henkel’s Loctite TCF 14001 addresses these challenges by offering superior heat dissipation capabilities while maintaining compatibility with large-scale manufacturing and delicate optical systems.

“The thermal conductivity level achieved by Loctite TCF 14001 represents a breakthrough for liquid TIMs,” stated Tracy Lin, Global Market Strategy Manager for Data and Telecom at Henkel. “Beyond high thermal performance, it’s critical that materials used in optical transceivers meet processability, durability, and reliability requirements. Loctite TCF 14001 delivers on all fronts, supporting mass production while ensuring consistent functionality in sensitive environments.”

Loctite TCF 14001 is a low-volatility, two-part silicone formulation characterized by minimal outgassing (<100 ppm volatiles) and extremely low oil bleed, reducing the risk of optical contamination. Its unique filler technology allows for precision-controlled automated dispensing with stable flow properties. In addition, its strong adhesion and gap variation tolerance enable consistent thermal transfer performance even under conditions of high heat stress or chip warpage, maintaining system integrity in demanding operating environments.

While developed for AI data center optical applications, Henkel’s new TIM solution extends beyond this segment. Loctite TCF 14001 can be applied in multiple industries requiring high-efficiency thermal management, including telecommunications, automotive electronics, industrial automation, and power generation. The product’s balance of thermal conductivity, reliability, and manufacturability positions it as a versatile solution for next-generation thermal control challenges.

Media Contact:

Sebastian Hinz
Adhesive Technologies
Media Relations
Headquarters, Düsseldorf/Germany
+49-211-797-8594
press@henkel.com

SOURCE: Henkel AG & Co. KGaA