Henkel Expands Thermal Interface Portfolio with Durable, High-Performance Liquid Gap Filler for Advanced Devices

Bergquist TGF 10000 application on ADAS domain controller.

(IN BRIEF) Henkel has introduced Bergquist TGF 10000, a new liquid gap filler providing 10 W/mK thermal conductivity for high-power electronics that require efficient heat dissipation. Based on a silicone two-component system, the material combines strong thermal performance with high dispensing speed, stable flow behaviour, and suitability for mass production. Designed to withstand demanding operating conditions including vibration, humidity, thermal cycling, and heat aging, the product is intended for industries such as automotive, computing, telecoms, consumer devices, and infrastructure equipment. Henkel expects the material to be particularly valuable to the automotive sector as electrified vehicles integrate more advanced computing modules and ADAS systems. Michael Cai noted that the innovation supports rapidly rising thermal demands while ensuring reliability and ease of use.

(PRESS RELEASE) DÜSSELDORF, 10-Dec-2025 — /EuropaWire/ — Henkel has expanded its thermal interface materials portfolio with the launch of Bergquist TGF 10000, a next-generation liquid gap filler engineered for demanding electronics that generate significant heat. Offering a thermal conductivity of 10 W/mK, the new formulation is positioned for high-power applications across a wide range of sectors, including automotive electrification, telecommunications hardware, computing systems, consumer devices, and large-scale network equipment. With this introduction, Henkel continues its push toward more advanced material solutions capable of supporting emerging electronic architectures.

Bergquist TGF 10000 is built on a two-component silicone base and has been designed to combine performance with practicality. The material provides high heat transfer efficiency while maintaining low thermal impedance, ensuring that systems which operate under intense thermal loads can remain stable and protected. In manufacturing environments, the gap filler supports fast and consistent dispensing, delivering reliable flow characteristics from batch to batch to maintain process uniformity on production lines.

Engineered with long-term durability in mind, the material incorporates raw components selected for stability and low volatility to enable extended service life. It is also formulated to handle environmental challenges such as extreme temperature swings, high humidity, heat aging, and mechanical vibration, making it suitable for next-generation automotive electronics and other rugged devices.

Michael Cai, ADAS Business Development Manager at Henkel, highlighted the automotive sector as a key area of opportunity for the new solution. He noted that as vehicles become more intelligent and electronic-heavy — powered by advanced processors and SoC-based ADAS systems — the need for robust thermal management rises sharply. “Bergquist TGF 10000 is designed for platforms where thermal performance cannot be compromised,” Cai explained. “It brings high conductivity together with reliability and ease of application, enabling manufacturers to handle more powerful chips while maintaining performance consistency.”

Media Contact:

Sebastian Hinz
Adhesive Technologies
Media Relations
Headquarters, Düsseldorf/Germany
+49-211-797-8594
press@henkel.com

SOURCE: Henkel AG & Co. KGaA