Siemens Digital Industries Software Expands Collaboration with Intel Foundry, Enhancing Advanced Semiconductor Design and Packaging Solutions

Siemens Digital Industries Software Expands Collaboration with Intel Foundry, Enhancing Advanced Semiconductor Design and Packaging Solutions

(IN BRIEF) Siemens Digital Industries Software has expanded its partnership with Intel Foundry to enhance the development of advanced semiconductor technologies. This collaboration includes certifications for Siemens’ Calibre® nmPlatform and Solido™ Simulation Suite tools with Intel’s 18A PDK, enabling cutting-edge IC design and verification. Additionally, Siemens supports Intel’s EMIB-T technology for advanced packaging and has joined Intel’s Foundry Accelerator Chiplet Alliance to accelerate chiplet development.

(PRESS RELEASE) MUNICH, 30-Apr-2025 — /EuropaWire/ — Siemens Digital Industries Software today announced the continuation and expansion of its collaboration with Intel Foundry, resulting in multiple product certifications, enhanced foundry reference flows, and further enablement of cutting-edge semiconductor technologies. This extended partnership, focusing on next-generation integrated circuits (ICs) and advanced packaging, underscores Siemens’ commitment to advancing the semiconductor design process.

Siemens’ Calibre® nmPlatform tool has now been certified for Intel’s groundbreaking 18A production Process Design Kit (PDK). Intel 18A features innovative RibbonFET Gate-all-around transistors and PowerVia backside power delivery, marking a major technological leap forward. This certification allows customers to continue using Siemens’ Calibre® nmPlatform tool as an industry-standard solution for sign-off, facilitating the acceleration of next-generation chip designs using Intel Foundry’s advanced manufacturing process.

Siemens’ Solido™ SPICE and Analog FastSPICE (AFS) software tools, part of the Solido™ Simulation Suite, have also been certified for Intel’s 18A PDK. These tools offer AI-accelerated simulation for intelligent IC design and verification, providing essential circuit verification across various design domains, including analog, mixed-signal, memory, library IP, and System-on-Chip (SoC) designs. Additionally, the Intel 18A process node has been enabled with Open Model Interface (OMI), supported by Siemens’ Solido Simulation Suite, for IC aging modeling and reliability analyses.

Siemens’ Calibre® nmPlatform and Analog FastSPICE (AFS) software are now part of the Intel Foundry Custom Reference Flow (CRF), which provides a comprehensive custom design methodology package. This enables customers to access Siemens’ best-in-class simulation and sign-off tools, now extended to 3D IC designs and chiplets.

The qualification process for Siemens’ tools is underway for Intel’s 18A-P process node, with the Intel 18A-P PDK now available for early design work. Both Calibre® nmPlatform and Solido™ Simulation Suite tools are also a part of Intel’s 14A-E process definition and Design Technology Co-Optimization (DTCO), with early runsets already available. The Intel 14A-E process node is expected to offer enhanced density and performance per watt compared to the Intel 18A process node.

Siemens also announced the certification of a reference workflow for Intel Foundry’s Embedded Multi-die Interconnect Bridge-T (EMIB-T) with Through Silicon Via (TSV) technology. Powered by Siemens’ Innovator3D™ IC solution, this workflow supports the design and analysis of the complete semiconductor package, including die, EMIB-T, and package substrate, as well as signal and power integrity analysis. The workflow enables customers to conduct detailed implementations and thermal analysis for EMIB-T technology, and the Package Assembly Design Kit (PADK) ensures assembly verification.

Additionally, Siemens’ Aprisa™ software was used to implement Power/Ground (PG) grid and bump routing for Intel’s Silicon EMIB die, and a prototype workflow for EMIB technology has been established for early design exploration.

Siemens has also joined Intel’s Foundry Accelerator Chiplet Alliance, aimed at defining and driving chiplet design infrastructure, interoperability, and security for complex systems used across aerospace, defense, and commercial markets. As a founding member, Siemens’ contribution is expected to accelerate chiplet development cycles and advance semiconductor technology.

“Partnering with Siemens allows us to provide our customers with industry-leading design solutions and accelerate the adoption of next-generation semiconductor technologies,” said Suk Lee, VP & GM of Ecosystem Technology Office at Intel Foundry. “This collaboration not only streamlines design workflows but also enables groundbreaking innovations for our mutual customers.”

“Siemens is proud to be at the forefront of semiconductor design, offering solutions that empower the next generation of chipmakers,” said Juan C. Rey, Senior Vice President and General Manager, Calibre product line at Siemens Digital Industries Software. “This partnership with Intel Foundry not only enhances design and verification processes but also drives the development of cutting-edge semiconductor technologies, pushing the boundaries of what’s possible.”

About Siemens Digital Industries Software

Siemens Digital Industries Software provides solutions for the digital transformation of industries, helping organizations optimize their design, engineering, and manufacturing processes. Leveraging the Siemens Xcelerator business platform, Siemens delivers the tools needed to accelerate innovation, streamline workflows, and create sustainable products. From integrated circuits to full systems, Siemens is transforming industries with software, hardware, and services.

For more information, visit: Siemens Digital Industries Software

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

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Siemens Digital Industries Software PR Team
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SOURCE: Siemens