Siemens and TSMC Expand Strategic Alliance to Drive Next-Generation Semiconductor Innovation Across N2P, A16, and 3DFabric Technologies

Siemens and TSMC Expand Strategic Alliance to Drive Next-Generation Semiconductor Innovation Across N2P, A16, and 3DFabric Technologies

(IN BRIEF) Siemens Digital Industries Software has expanded its strategic collaboration with TSMC by certifying a wide array of EDA tools for TSMC’s most advanced process nodes, including N2P, A16, and 3DFabric® technologies. Siemens’ Calibre®, Solido™, and Analog FastSPICE platforms have all achieved certification for key design and verification tasks such as layout verification, reliability simulation, and variation-aware analysis. The partnership also includes cloud-based flow validation for AWS, development for TSMC’s emerging A14 node, and support for the COUPE™ silicon photonics platform. This collaboration aims to accelerate innovation across AI, automotive, mobile, and hyperscale sectors while empowering customers with state-of-the-art design and signoff technologies.

(PRESS RELEASE) MUNICH, 25-Apr-2025 — /EuropaWire/ — Siemens Digital Industries Software has announced a major deepening of its long-standing collaboration with TSMC, aimed at accelerating innovation in advanced semiconductor design and packaging. The expanded alliance includes a series of new tool certifications for Siemens’ flagship EDA platforms, supporting TSMC’s most advanced process nodes—N2P, A16, and 3DFabric®—as well as early-stage enablement for future technologies like A14.

Siemens’ Calibre® nmPlatform software suite, including DRC, LVS, PERC™, and YieldEnhancer™ with SmartFill, has now achieved full certification for both N2P and A16 process nodes. Siemens’ Analog FastSPICE (AFS) and Solido™ platforms have also been validated for these nodes, enabling powerful design and verification capabilities for next-generation analog, RF, mixed-signal, and memory components.

In support of 3D integration, Calibre® 3DSTACK is now certified for 3Dblox and TSMC’s 3DFabric® technologies, marking a milestone in the evolution of chiplet-based and silicon stacking designs. Siemens’ Innovator3D IC™ solution adds further versatility by enabling 3Dblox compatibility across abstraction levels.

Certification efforts are also underway for Siemens’ Aprisa™ physical implementation tool and mPower™ power integrity software, extending support for electromigration, IR-drop analysis, and physical design to the N2P node for both analog and digital applications.

The partnership extends into the cloud, with seven Siemens sign-off flows now validated for secure and high-performance deployment on AWS, including Solido SPICE, AFS, Calibre YieldEnhancer, Calibre xACT, and mPower.

In addition, Siemens and TSMC are collaborating to develop robust design solutions for TSMC’s Compact Universal Photonic Engines (COUPE™) platform. This aligns with Siemens’ broader goal of supporting emerging silicon photonics applications using its Calibre and AFS technologies.

“Partnering closely with TSMC is instrumental to our vision of advancing semiconductor design technologies that support emerging workloads in AI, mobile, automotive, and hyperscale computing,” said Mike Ellow, CEO of Siemens EDA. “These expanded certifications across process nodes and platforms empower our mutual customers to achieve better performance, faster time-to-market, and greater design confidence.”

Lipen Yuan, Senior Director of Advanced Technology Business Development at TSMC, added: “With Siemens’ tools integrated into our leading-edge process nodes, customers are now equipped with robust, secure, and reliable design environments. This collaboration highlights our continued drive to foster innovation through our Open Innovation Platform® ecosystem.”

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.

Media Contact:

Siemens Digital Industries Software PR Team
Email: press.software.sisw@siemens.com

SOURCE: Siemens