SÜSS MicroTec Launches Innovative Hybrid Bonding Platform to Boost Semiconductor Production Efficiency

(IN BRIEF) SÜSS MicroTec SE introduces the XBC300 Gen2 D2W/W2W, a groundbreaking hybrid bonding platform designed for both 200 mm and 300 mm substrates, providing versatile wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding capabilities. This platform is specifically tailored for semiconductor … Read the full press release →