Tag Archives: Henkel Expands Advanced TIM Portfolio with Loctite TCF 14001 for Next-Generation High-Density Electronics

Henkel Launches High Thermal Conductivity Gap Filler to Advance Cooling Efficiency in 800G and 1.6T Optical Modules

(IN BRIEF) Henkel has launched Loctite TCF 14001, a high-performance liquid thermal interface material designed for advanced optical transceivers used in AI data centers. Featuring a 14.5 W/m-K thermal conductivity — one of the highest among liquid TIMs — the … Read the full press release