(IN BRIEF) nepes Corporation, a leading global provider of Outsourced Semiconductor Assembly and Test (OSAT) services, has expanded its IC packaging capabilities for the 3D-IC era by adopting advanced design solutions from Siemens EDA. Leveraging Siemens’ industry-leading technologies, including the … Read the full press release
Posted in Business, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged 3D-IC Era, AJ Incorvaia, Brad Seo, Design Solutions, IC Packaging, nepes Corporation, partnership, Siemens, South Korea
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