(IN BRIEF) Henkel has launched Loctite TCF 14001, a high-performance liquid thermal interface material designed for advanced optical transceivers used in AI data centers. Featuring a 14.5 W/m-K thermal conductivity — one of the highest among liquid TIMs — the … Read the full press release
Posted in Artificial Intelligence (AI), Business, Chemicals, Electronics & Machinery, Germany, Industrial, News, Technology
Tagged 1.6T, 800G, advanced packaging, AI data centers, automotive electronics, coherent optics, cooling technology, heat management, Henkel, Henkel Expands Advanced TIM Portfolio with Loctite TCF 14001 for Next-Generation High-Density Electronics, high thermal conductivity, industrial automation, Loctite TCF 14001, optical transceivers, power generation, silicone gap filler, telecommunications, Thermal Interface Material, TIM, Tracy Lin
(IN BRIEF) LPKF Laser & Electronics SE has obtained new patent protection in Korea for its LIDE (Laser Induced Deep Etching) technology, effective September 1, 2025. The process enables ultra-precise, damage-free structuring of thin glass substrates, with applications across semiconductor … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Industrial, News, Technology
Tagged advanced packaging, co-packaging optics, earthworm structure, high-volume manufacturing, Korean Patent Office, Laser Induced Deep Etching, LIDE technology, LPKF, LPKF Laser & Electronics SE, microsystem manufacturing, precision glass processing, Roman Ostholt, Semiconductor Manufacturing, TGV, through glass vias
(IN BRIEF) Siemens Digital Industries Software has expanded its partnership with Intel Foundry to enhance the development of advanced semiconductor technologies. This collaboration includes certifications for Siemens’ Calibre® nmPlatform and Solido™ Simulation Suite tools with Intel’s 18A PDK, enabling cutting-edge … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Government, Industrial, Infrastructure & Utilities, Internet & Online, Investment, Management, News, Technology
Tagged 18A PDK, 3D IC, advanced packaging, Aprisa software, Calibre nmPlatform, chiplet alliance, chiplets, digital transformation, EMIB-T, GPU, Innovator3D IC, Intel Foundry, partnership, semiconductor design, semiconductor technology, Siemens, Solido Simulation Suite
(IN BRIEF) LPKF Laser & Electronics SE has joined Onto Innovation’s Packaging Applications Center of Excellence (PACE) to accelerate the production of panel-level packages that use glass cores, crucial for modern semiconductor applications like high-performance computing and AI. LPKF will … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged advanced packaging, automated inspection, cleanroom, Dr. Roman Ostholt, Firefly® system, glass cores, Hannover, high-volume manufacturing, LIDE technology, LPKF Laser & Electronics SE, metrology, Mike Rosa, Onto Innovation, Pace, Packaging Applications Center of Excellence, partnership, semiconductor, TGV, through glass vias, Vitrion
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