Infineon Unveils SSO10T TSC Package: Revolutionizing Automotive Power Designs

Infineon Unveils SSO10T TSC Package: Revolutionizing Automotive Power Designs

(IN BRIEF) Infineon Technologies AG launches the SSO10T TSC package, integrating OptiMOS™ MOSFET technology with a direct top-side cooling concept, ensuring superior thermal performance in automotive electronic control units. This innovative package facilitates a compact double-sided PCB design, significantly reducing cooling requirements and system costs for various automotive applications such as electric power steering, power distribution, and DCDC converters. With up to 50 percent higher performance compared to the standard SSO8, the SSO10T TSC is poised to become the industry standard for top-side cooling, promising a future of more efficient and sustainable vehicles.

(PRESS RELEASE) MUNICH, 27-Mar-2024 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the SSO10T TSC package with OptiMOS™ MOSFET technology. With its direct top-side cooling concept, the package offers excellent thermal performance. This eliminates heat transfer into or through the PCB of the automotive electronic control unit. The package enables a simple and compact double-sided PCB design and minimizes cooling requirements and system costs for future automotive power designs. The SSO10T TSC is therefore well suited for applications such as electric power steering (EPS), EMB, power distribution, brushless DC drives (BLDC), safety switches, reverse battery, and DCDC converters.

The SSO10T TSC has a 5 x 7 mm² footprint and is based on the established industry standard SSO8, a 5 x 6 mm² robust housing. However, due to its top-side cooling, the SSO10 TSC offers more than 20 percent and up to 50 percent higher performance than the standard SSO8 – depending on the thermal interface (TIM) material used and the TIM thickness. The SSO10T TSC package is JEDEC listed for open market and provides wide second source compatibility. As a result, the package can be introduced quickly and easily as the future standard for top-side cooling.

The SSO10T package enables a very compact PCB design and reduces the system footprint. It also lowers the cost of the cooling design by eliminating vias, resulting in lower overall system costs and design effort. At the same time, the housing offers high power density and efficiency, thus supporting the development of future-proof and sustainable vehicles.

Availability

The first 40 V automotive MOSFET products with SSO10T are now available: IAUCN04S6N007T, IAUCN04S6N009T, IAUCN04S6N013T, IAUCN04S6N017T. Further information is available at https://www.infineon.com/cms/en/product/promopages/SSO10T/

Infineon at Embedded World

Embedded World will take place from 9 to 11 April, 2024 in Nuremberg, Germany. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth #138 and virtually. Company representatives will also hold several TechTalks as well as presentations at the accompanying Embedded World Conference, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email  media.relations@infineon.com . Industry analysts interested in a briefing can email  MarketResearch.Relations@infineon.com . Information about the Embedded World show highlights is available at  www.infineon.com/embeddedworld .

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

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Media Contact:

Reinhard von Faltin
Tel: +49 89 234 39694
Reinhard.vonFaltin@infineon.com

SOURCE: Infineon Technologies AG