Tag Archives: 3D packaging miniaturization

Henkel to address the demands of contemporary packaging device designs with a new high-performance non-conductive die attach film

Posted on 30, November 2022 by EuropaWire PR Editors

(PRESS RELEASE) IRVINE, CA, United States, 30-Nov-2022 — /EuropaWire/ — Henkel (ETR: HEN3), a German chemical and consumer goods company, has announced it will address the the demands of contemporary packaging device designs with the launch of a new high-performance … Read the full press release →

Posted in Business, Germany, Industrial, News, Technology

Tagged 3D packaging, 3D packaging miniaturization, adhesive, Die Attach Film, Henkel, lead frame packages, Loctite Ablestik ATB 125GR, ncDAF, non-conductive die attach film, packaging, Ramachandran Trichur, wirebond laminate