Tag Archives: 3D IC

Siemens EDA Unveils Innovator3D IC™ and Calibre 3DStress to Streamline 2.5D/3D IC Design and Reliability

(IN BRIEF) Siemens has enriched its EDA suite with Innovator3D IC™—an AI-powered, capacity-optimized workflow for 2.5D/3D IC planning, layout, protocol compliance, and data governance—and Calibre 3DStress, which integrates transistor-level thermo-mechanical simulation into standard physical verification. Innovator3D IC™’s four modules cover … Read the full press release

Siemens Introduces Questa One, a Revolutionary AI-Powered Integrated Circuit (IC) Verification Solution for Faster and Smarter Semiconductor Design

(IN BRIEF) Siemens’ Questa One software solution is poised to reshape the IC verification landscape, addressing the industry’s growing complexity with AI-driven verification tools. Designed to cater to next-generation 3D-ICs and chiplet-based systems, Questa One accelerates verification cycles, enhances productivity, … Read the full press release

Siemens Digital Industries Software Expands Collaboration with Intel Foundry, Enhancing Advanced Semiconductor Design and Packaging Solutions

(IN BRIEF) Siemens Digital Industries Software has expanded its partnership with Intel Foundry to enhance the development of advanced semiconductor technologies. This collaboration includes certifications for Siemens’ Calibre® nmPlatform and Solido™ Simulation Suite tools with Intel’s 18A PDK, enabling cutting-edge … Read the full press release