Infineon

MUNICH, 29-Nov-2017 — /EuropaWire/ — The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in “Coil-on-Module” (CoM) packages offer significant advantages here. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now … Read the full press release →

MUNICH, 23-Aug-2017 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its recently launched CoolMOS™ P7 superjunction power MOSFET family with a SOT-223 package. The device has been developed as a one-to-one drop-in replacement for DPAK. … Read the full press release →

Joint press release by the “eRamp” research project partners Munich and Dresden, Germany, 30-May-2017 — /EuropaWire/ — One of the most important European research projects for energy efficiency, “eRamp”, is coming to a close. Over the past three years, 26 partners … Read the full press release →

MUNICH, 12-Apr-2017 — /EuropaWire/ — To reinforce the position of Europe’s semiconductor and electronics industry within global competition, eleven institutes within the Fraunhofer Group for Microelectronics have, together with two institutes within the Leibniz Association, come up with a concept for … Read the full press release →

MUNICH, 12-Apr-2017 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) complements its StrongIRFET™ family with a 40 V MOSFET packaged in D²PAK 7pin+. The new MOSFET family offers an extremely low R DS(on) of 0.65 mΩ and the … Read the full press release →

MUNICH/ BERLIN, 12-Apr-2017 — /EuropaWire/ — You can’t have an automated car without reliable communication infrastructure and stable mobile communication connectivity. The next generation mobile communication standard is indispensable. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) contributes to introducing the … Read the full press release →