Infineon

Nuremberg, Germany, 21-10-2013 — /EuropaWire/ — Today (October 10, 2013) at the European Microwave Week tradeshow, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced 50V LDMOS transistors designed for use in UHF TV broadcast transmitters, including one device providing the highest peak … Read the full press release →

Volume production will start in early 2014 Nuremberg, Germany, 21-10-2013 — /EuropaWire/ — Today (October 8, 2013), at the European Microwave Week tradeshow, Infineon Technologies introduced the latest generation of its pico GNSS (Global Navigation Satellite System) modules for smartphones. BGM1143N9 … Read the full press release →

Neubiberg, 22-7-2013 — /EuropaWire/ — Bombardier Transportation, an international market leader in modern rail transportation technologies, has presented Infineon Technologies AG with its Supplier Sustainability Award 2013. Bombardier introduced this award in 2011, and it is bestowed once a year in … Read the full press release →

2-7-2013 — /europawire.eu/ — Jaguar Land Rover is strengthening its leadership team creating two new roles on its Executive Committee to support an increased focus on research and development initiatives and the delivery of its ambitious new product plans for the … Read the full press release →

Neubiberg, Germany, 22-2-2013 — /europawire.eu/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the … Read the full press release →

Quarterly Report 21-2-2013 — /europawire.eu/ — Segment Result in line with expectations; cost savings taking effect  Q1 FY 2013: Revenue €851 million; Segment Result €44 million Outlook Q2 FY 2013: revenue expected to increase by a mid single digit percentage and … Read the full press release →

TIM allows higher power density for same ageing resistance Düsseldorf / Germany, 21-2-2013 — /europawire.eu/ — Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today’s power semiconductors must be integrated as early as … Read the full press release →