ZEISS Rolls Out Next-Generation AIMS EUV 3.0 Mask Qualification System With Tripled Throughput and Enhanced Scanner Matching

The new generation of production-proven actinic mask qualification systems ZEISS AIMS® EUV 3.0 serves all leading semiconductor manufacturers globally. With improved scanner matching and support for both Low-NA-EUV and High-NA-EUV lithography, it offers future-proof flexibility and sets new industry benchmarks.

(IN BRIEF) ZEISS Semiconductor Manufacturing Technology is rolling out its new AIMS® EUV 3.0 actinic mask qualification system to leading semiconductor manufacturers worldwide, setting a new benchmark in photomask inspection with improved scanner matching, Digital FlexIllu illumination emulation, and full support for both Low-NA-EUV and High-NA-EUV lithography. The new system triples mask throughput compared to its predecessor, offers highly flexible illumination settings, and is backed by an innovation roadmap that includes features such as a Wafer-Level Critical Dimension Option and software upgrades to reduce downtime. ZEISS leadership highlighted its commitment to continuous improvement and operational reliability, while also confirming that the first-generation AIMS EUV systems will receive upgrades to double their throughput, ensuring ongoing value for existing customers.

(PRESS RELEASE) OBERKOCHEN, 4-Feb-2026 — /EuropaWire/ — ZEISS Semiconductor Manufacturing Technology (SMT) is continuing the global rollout of its latest AIMS® EUV 3.0 systems, a new generation of production-proven actinic mask qualification tools that are now being deployed at leading semiconductor manufacturers worldwide. The system represents a significant advancement in photomask inspection and qualification, a critical step in ensuring the performance, reliability, and yield of advanced semiconductor devices.

Designed to support the evolving demands of chip production, the AIMS® EUV 3.0 introduces enhanced scanner matching capabilities through its Digital FlexIllu functionality. This feature enables the system to accurately emulate a wide range of illumination settings, allowing for more precise assessment of defect printability under real-world lithography conditions. The platform is fully compatible with both Low-NA-EUV and High-NA-EUV lithography, providing manufacturers with greater flexibility and long-term adaptability as the industry transitions to next-generation patterning technologies.

Compared with the previous generation, the AIMS® EUV 3.0 delivers a threefold increase in mask throughput, significantly boosting productivity for mask makers and chip producers. The system also offers highly configurable illumination settings, enabling users to tailor light conditions to specific mask designs and process requirements, thereby improving inspection accuracy and overall workflow efficiency.

In addition to these performance gains, ZEISS SMT is actively expanding the system’s capabilities through a structured innovation roadmap. Dr. Clemens Neuenhahn, Head of ZEISS Semiconductor Manufacturing Solutions (SMS), emphasized the company’s commitment to continuous technological advancement, stating that ZEISS is focused on ensuring customers have access to cutting-edge solutions that keep pace with rapid industry developments.

As part of this strategy, ZEISS SMT plans to introduce new features such as the Wafer-Level Critical Dimension Option to selected pilot customers in 2026. This enhancement will provide mask manufacturers with additional analytical tools beyond post-repair defect verification, enabling more comprehensive process optimization and quality control.

ZEISS SMT is also prioritizing operational reliability by implementing ongoing software upgrades aimed at reducing system downtime and improving overall efficiency. Planned improvements include enhancements to overhead time performance, further strengthening the system’s value proposition in high-volume production environments.

Alongside the introduction of AIMS® EUV 3.0, ZEISS is also investing in upgrades for its first-generation AIMS EUV systems. These updates are expected to double throughput on existing installations, ensuring that customers using earlier platforms can still benefit from meaningful performance improvements and extended system value.

Source: ZEISS