Tag Archives: Thermal Interface Material

Henkel Launches High Thermal Conductivity Gap Filler to Advance Cooling Efficiency in 800G and 1.6T Optical Modules

(IN BRIEF) Henkel has launched Loctite TCF 14001, a high-performance liquid thermal interface material designed for advanced optical transceivers used in AI data centers. Featuring a 14.5 W/m-K thermal conductivity — one of the highest among liquid TIMs — the … Read the full press release

Henkel’s Bergquist Hi Flow THF 5000UT Receives Industry Recognition for Innovative Thermal Interface Material

(IN BRIEF) Henkel’s phase change thermal interface material (TIM), Bergquist Hi Flow THF 5000UT, has been honored by the 2024 Lightwave Innovation Reviews for its innovative contributions to fiberoptics and optoelectronics applications. Recognized for its silicone-free composition and ability to … Read the full press release