(IN BRIEF) Henkel has received the Texas Instruments 2024 Supplier Excellence Award, acknowledging its exceptional performance in die attach technology and its strong collaboration with Texas Instruments. The award highlights Henkel’s innovation, quality, and responsiveness in serving critical sectors such … Read the full press release
Posted in Awards, Business, Financial, Germany, Industrial, Investment, Management, News, Technology
Tagged automotive, Awards, collaboration, Communications, die attach technology, environmental responsibility, Henkel, Industrial, INNOVATION, leadership, Quality, responsiveness, semiconductor technology, social responsibility, Supplier Excellence Award, supply assurance, technology leadership, Texas Instruments
(IN BRIEF) The University of Southampton’s new E-beam lithography facility, which is the second of its kind globally, will significantly advance semiconductor technology in the UK. The facility, which provides unmatched accuracy in designing the components of future technologies, supports … Read the full press release
Posted in Business, Education, Financial, Government, Industrial, Infrastructure & Utilities, Investment, Management, News, Technology, United Kingdom
Tagged Defense Systems, E-beam lithography, INNOVATION, Lord Vallance, medical diagnostics, Optoelectronics Research Centre, semiconductor skills package, semiconductor technology, talent development, UK semiconductor sector, University of Southampton
(IN BRIEF) Siemens Digital Industries Software has expanded its partnership with Intel Foundry to enhance the development of advanced semiconductor technologies. This collaboration includes certifications for Siemens’ Calibre® nmPlatform and Solido™ Simulation Suite tools with Intel’s 18A PDK, enabling cutting-edge … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Government, Industrial, Infrastructure & Utilities, Internet & Online, Investment, Management, News, Technology
Tagged 18A PDK, 3D IC, advanced packaging, Aprisa software, Calibre nmPlatform, chiplet alliance, chiplets, digital transformation, EMIB-T, GPU, Innovator3D IC, Intel Foundry, partnership, semiconductor design, semiconductor technology, Siemens, Solido Simulation Suite
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