(IN BRIEF) Siemens’ Questa One software solution is poised to reshape the IC verification landscape, addressing the industry’s growing complexity with AI-driven verification tools. Designed to cater to next-generation 3D-ICs and chiplet-based systems, Questa One accelerates verification cycles, enhances productivity, … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Government, Industrial, Internet & Online, Investment, Management, Marketing, News, Technology
Tagged 3D IC, AI, AI-powered tools, ARM, automation, chiplet-based systems, design-for-test, DFT, electronics, IC verification, MediaTek, Microsoft, partnership, Questa One, Rambus, semiconductor design, Siemens, SOC, verification software
(IN BRIEF) Siemens Digital Industries Software has expanded its partnership with Intel Foundry to enhance the development of advanced semiconductor technologies. This collaboration includes certifications for Siemens’ Calibre® nmPlatform and Solido™ Simulation Suite tools with Intel’s 18A PDK, enabling cutting-edge … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Government, Industrial, Infrastructure & Utilities, Internet & Online, Investment, Management, News, Technology
Tagged 18A PDK, 3D IC, advanced packaging, Aprisa software, Calibre nmPlatform, chiplet alliance, chiplets, digital transformation, EMIB-T, GPU, Innovator3D IC, Intel Foundry, partnership, semiconductor design, semiconductor technology, Siemens, Solido Simulation Suite
(IN BRIEF) Siemens Digital Industries Software has expanded its strategic collaboration with TSMC by certifying a wide array of EDA tools for TSMC’s most advanced process nodes, including N2P, A16, and 3DFabric® technologies. Siemens’ Calibre®, Solido™, and Analog FastSPICE platforms … Read the full press release
Posted in Business, Environment, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged 3Dblox, 3DFabric, A14 process, A16 process, AI chip design, Analog FastSPICE, Automotive Semiconductors, AWS cloud certification, Calibre 3DSTACK, Calibre nmPlatform, Calibre PERC, chip stacking, chiplet design, Coupé, hyperscale computing, Lipen Yuan, Mike Ellow, N2P process, open innovation platform, partnership, photonics, semiconductor design, semiconductor EDA tools, Siemens, Solido, sustainability, TSMC
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